7.4

Epoxy-phenolic adhesive compositions of commercially available types

7.5

Epoxy-nylon adhesive composition

7.7

The effect of LP-3 polymer on the physical properties of liquid epoxy resin

7.8

Typical formulations and properties of polysulfide-epoxy adhesives

7.10

Polybutadiene toughened epoxy system

8.2

Typical flexible epoxy formulations and their effect on properties

8.4

Nonfiller silyated polyether-epoxy blend

8.5

Properties of a CTBN modified epoxy adhesive

8.6

Formulas for two-part CTBN modified epoxy adhesive system

8.7

Two-part ATBN modified epoxy adhesive

8.8

Typical two-part CTBN and ATBN toughened epoxy adhesives

9.6

Cellulose fibers in an epoxy adhesive

11.5

General-purpose epoxy adhesive with amidoamine curing agents

11.6

Effect of fillers on tensile shear strength of polyamide cured epoxy adhesives

11.7

Typical formulation for an epoxy adhesive cured with an amidoamine

11.8

Typical epoxy adhesive cured with triethylenetetramine (TETA)

11.9

Room temperature cure, general-purpose epoxy adhesive cured with triethylenetetramine (TETA)

11.11

Quick-curing epoxy adhesive cured with polymercaptan

11.12

Starting formulations for rapid-setting, room temperature curing epoxy adhesives

11.13

Starting formulation for a flexible epoxy adhesive containing polyamide curing agent and reactive diluent

11.14

Starting formulation for a high-peel-strength adhesive

11.15

Epoxy-polysulfide adhesive formulation

11.16

Formulation for a flexible...