Epoxy Adhesive Formulations

Chapter 4: Epoxy Resins

4.1 INTRODUCTION

The syntheses of commercial epoxy resins that are commonly used in many applications were discussed in Chap. 2. Additional information is provided in this chapter with regard to the physical and chemical properties of certain epoxy resins relative to their use in adhesive systems.

Many types of epoxy resins can be used in adhesive formulations. These are characterized in Table 4.1. The most commonly used type is the resin-based diglycidyl ether of bisphenol A (DGEBA). Epoxy novolac, flexible epoxy, high-functionality, and film-forming epoxy resins are also used in specialty applications.

Table 4.1: Epoxy Resin Types

Epoxy resin type

Characteristics

Primary curing requirements [*]

Diglycidyl ether of bisphenol A (DGEBA)

General-purpose use

RT, ET

Bisphenol F diluted DGEBA

Very low viscosity

RT, ET

Epoxy novolac

High heat and chemical resistance

ET

Flexibilizing

High elongation and impact resistance

RT, ET

Brominated DGEBA

Flame resistance

RT, ET

Aliphatic

High reactivity and low viscosity

RT, ET

Cycloaliphatic

Good electrical characteristics and chemical resistance, low viscosity

ET

High functionality

High heat and chemical resistance

ET

Film formers

Adhesion promotion, high resiliency

RT, ET

[*]RT = room temperature, ET = elevated temperature.

The epoxy resin is a primary component in any epoxy adhesive formulation, and it is often referred to as the base polymer. However, it is certainly not the only or even not always the predominant component in influencing desirable end properties. Epoxy resins by themselves are often too rigid to provide the required properties such as flexibility, peel and impact...

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Category: Insulating Varnishes and Impregnating Resins
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