Appendix F: Surface Preparation Methods for Common Substrate Materials

The following sources were used in compiling this appendix:

Cagle, C. V., Adhesives Bonding Techniques and Applications, McGraw-Hill, New York, 1968.
DeLollis, N. J., Adhesives for Metals Theory and Technology, Industrial Press, New York, 1970.
Schields, J., Adhesives Handbook, CRC Press, Boca Raton, FL, 1970.
Guttman, W. H., Concise Guide to Structural Adhesives, Reinhold, New York, 1961.
Preparing the Surface for Adhesive Bonding, Hysol Division, Dexter Corp., Bulletin Gl-600.
ASTM D 2093, Preparation of Surfaces of Plastics Prior to Adhesive Bonding, American Society for Testing and Materials, Conshohocken, PA.
ASTM D 2651, Preparation of Metal Surfaces for Adhesive Bonding, American Society for Testing and Materials, Conshohocken, PA.
Adhesives and Sealants, vol. 3, Engineered Materials Handbook, ASM International, Materials Park, OH, 1990.
Handbook of Plastics Joining, Plastics Design Library, Norwich, NY, 1997.

Note	All formulations in the following tables of this appendix are presented on a parts-by-weight basis unless otherwise indicated.

Table F1: Surface Preparation Methods for Metal Substrates
Substrates	Cleaning methods	Substrate treatments	Comments
Aluminum and aluminum alloys	Trichloroethylene	1.	Sandblast or 100-grit emery cloth followed by solvent degreasing.	Medium- to high-strength bonds, suitable for noncritical applications
		2.	Immerse for 10 min at 70 82 C in a commercial alkaline cleaner or	Optimum bond strength per FPL etch process. Specified in ASTM D 2651 and MIL-A-9067. Solvent degrease may replace alkaline cleaning.
Sodium metasilicate	3.0
Sodium hydroxide	1.5
Sodium dodecylbenzene sulfonate, such as Nacconol 90G (Stephan Co., Nothfield, IL)	1.5

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