Active Heat Sink Heat Sinks
from Boyd
Standard Aavid fan heat sink combinations are pre-assembled full thermal solutions for a variety of board level applications. Save time and space and increase thermal performance with these compact solutions. Aavid Fan Heat Sink Combinations are each comprised of a black anodized aluminum heat sink,... [See More]
- Device: Active Heat Sink
- Voltage: 5VDC; 12VDC
- Material: Aluminum
from Cooliance
The Cooliance High Power Coolstrate ® Active LED Coolers and Passive LED Coolers that are detailed on this page are shipped without any mounting holes. This permits the LED Coolers to be used in applications that are not pre-defined. [See More]
- Device: Active Heat Sink
- H: 60 to 110
- W: 50 to 160
- Thermal Resistance: 0.1500 to 1.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 800MHz. [See More]
- Device: Active Heat Sink
- W: 50.8
- L: 64
- H: 31
from Dynatron Corp.
Solution : Stylish active chipset cooler with quiet 50x50x10mm fan 3pin connector. [See More]
- Device: Active Heat Sink
- W: 54.6
- L: 55
- H: 13
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 866MHz. [See More]
- Device: Active Heat Sink
- W: 67.3
- L: 68
- H: 45
from Dynatron Corp.
Solution : Stylish active chipset cooler with 50x50x10mm fan 2pin connector [See More]
- Device: Active Heat Sink
- W: 54.6
- L: 55
- H: 13
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Device: Active Heat Sink
- W: 72.1
- L: 72
- H: 62.6
from Dynatron Corp.
CPU Support : Intel ® Celeron, Celeron D, Pentium 4, Pentium D, Core 2 Duo, Core 2 Quad, Core 2 Extreme, Core i7, AMD ® Sempron, Athlon 64, Athlon 64 X2, Athlon 64 FX, Phenom, Phenom II X4. CPU Socket : INTEL socket 1366, 775, AMD: socket AM2/AM3/AM2+. Solution : Evolution serial provides... [See More]
- Device: Active Heat Sink
- W: 108
- L: 122
- H: 157
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Sanyo Denki America, Inc.
CPU cooler for Intel Pentium 4 Processor (775-land LGA Package) [See More]
- Device: Active Heat Sink
- W: 72.1
- L: 72
- H: 62.6
from Dynatron Corp.
CPU Support : Intel ® Core ™ i3, Core ™ i5, Socket LGA1156, Core ™ i7, Socket LGA1366, Core ™2 Quad, Socket LGA775. AMD ® Athlon ™ X2 / FX, Phenom ™ X4, Socket AM2 / AM2+ / AM3. CPU Socket : INTEL: socket 1156, 1366, 775, AMD: socket AM2/AM3/AM2+. Solution... [See More]
- Device: Active Heat Sink
- W: 148
- L: 124
- H: 120
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 2.80GHz. [See More]
- Device: Active Heat Sink
- W: 90
- L: 95
- H: 62.5
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Device: Active Heat Sink
- W: 106
- L: 106
- H: 72.6
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 3.06GHz. [See More]
- Device: Active Heat Sink
- W: 90
- L: 95
- H: 62
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Device: Active Heat Sink
- W: 106
- L: 106
- H: 72.6
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Device: Active Heat Sink
- W: 90
- L: 95
- H: 62
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 79
- L: 106
- H: 27.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD Athlon 64 3700+ Athlon 64 4000+ Sempron 3300+ Athlon 64 FX 53. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm fan, Aluminum Heatsink, Desktop solution [See More]
- Device: Active Heat Sink
- W: 78
- L: 110
- H: 60
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 73
- L: 106
- H: 66
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 71
- L: 100
- H: 65.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]
- Device: Active Heat Sink
- W: 75
- L: 115
- H: 27.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 79
- L: 106
- H: 27.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 72
- L: 115
- H: 65.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 77
- L: 106
- H: 63
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 77.2
- L: 100
- H: 63
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 77.2
- L: 114
- H: 63
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 75.5
- L: 114
- H: 66.7
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 71
- L: 100
- H: 65.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27.5
from SECO
SBC-C90 Heat Sink (active) - Packaged [See More]
- Device: Active Heat Sink
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 77
- L: 115
- H: 27
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6100 Series. CPU Socket : G34. Solution : 75x15mm Aluminum blower, Copper heatsink with heatpipes embedded for 1U Server solution [See More]
- Device: Active Heat Sink
- W: 79
- L: 115
- H: 27.8
from Dynatron Corp.
CPU Support : AMD ® Dual-Core. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 72
- L: 115
- H: 66
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 71
- L: 100
- H: 65.5