Mixed Material Heat Sinks
Last Updated: April 1, 2025
Description
Mixed material heat sinks are designed to manage and dissipate heat from electronic components by utilizing a combination of different materials. These heat sinks enhance thermal performance by leveraging the unique properties of each material used in their construction, such as thermal conductivity and structural strength.
Working Principle
Mixed material heat sinks operate by transferring thermal energy from a high-temperature device to a lower temperature medium, typically air. The combination of materials, such as aluminum and copper, allows for improved thermal conductivity and heat absorption. The design often includes fins to increase surface area, which enhances the heat dissipation process. By increasing the contact area with the air, these heat sinks effectively lower the operating temperature of electronic components, thus preventing overheating and ensuring reliable performance.
Applications
Mixed material heat sinks are widely used in various electronic applications. They are essential in cooling high-power semiconductors like transistors and are also employed in optoelectronics, including light-emitting diodes (LEDs) and lasers, where temperature management is crucial for device performance and longevity. Additionally, they are used in protecting electronic components during soldering processes, particularly for components like reed switches that require heat sink protection.
Advantages over other Heat Sinks
One of the primary advantages of mixed material heat sinks is their ability to combine the strengths of different materials, such as the superior thermal conductivity of copper with the lightweight nature of aluminum. This combination can result in a heat sink that is both efficient in heat dissipation and manageable in terms of weight and cost. The use of composite materials like synthetic diamond or copper-tungsten pseudoalloy can further enhance performance by providing exceptional thermal management capabilities.
Limitations
Despite their advantages, mixed material heat sinks can have limitations. The complexity of combining different materials can lead to increased manufacturing costs and potential challenges in ensuring uniform thermal expansion, which might affect the structural integrity over time. Additionally, the use of expensive materials like copper can increase the overall cost of the heat sink.
Considerations
When selecting mixed material heat sinks, several factors should be considered. Initial costs can be higher due to the use of multiple materials and complex manufacturing processes. Operating expenses may also be impacted by the need for additional cooling mechanisms, such as fans or pumps, to optimize performance. Durability and maintenance are crucial, as the combination of materials must withstand thermal cycling without degrading. Replacement and maintenance costs should be evaluated, particularly in applications where reliability and longevity are critical.
from ToneCooling Technology Co., Ltd
CMc is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides.It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient of Kovar, Invar, and steel. Although the thermal... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The use of crystal ” oxygen-free copper heat sinks was prevalent over a decade... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from Mi-Tech Metals
Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of... [See More]
- Material: Copper; Mixed; Copper and Tungsten
- Mounting: Direct Mounting
- Device: Passive Heat Sink
- Thermal Resistance: 0.5290
from Boyd
The Aavid portfolio of folded fins includes over 3,000 different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat sinks and other fabrications. These fins can be purchased separately, bonded or brazed as part... [See More]
- Material: Aluminum; Copper; Mixed; Cupro Nickel, Inconel, Nickel Alloys, Stainless Steel
- H: 0.7600 to 50.8
- Device: Passive Heat Sink
- Heat sink Fin Style:: Folded
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Ohmite Manufacturing Co.
Custom Extrusion Heatsinks. The Ohmite AH series of aluminum extrusion heatsinks can be produced to customer requirements. Ohmite offers 34 different extrusion profiles. Each one can be modified with holes, bolt patterns, and finishes. Thermal performance of 0.6 °C/W is achieved in certain... [See More]
- Material: Aluminum; Mixed
- W: 19.05 to 311
- Device: Passive Heat Sink
- H: 9.65 to 60.71
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Ohmite Manufacturing Co.
Ohmite introduces the powerful B60/ C60 series heatsink with cam clip (Pat. Pending) or custom mounting. The B60/C60 series offers flexibility, high performance, and a compact heat sink design with exchangeable cam clip system for TO-247 and TO-264 devices. The B60 series can be tapped for popular... [See More]
- Material: Aluminum; Mixed
- L: 75
- Device: Passive Heat Sink
- W: 69.5 to 70.7
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 77
from Ohmite Manufacturing Co.
Clip Mounting For TO-247 and TO-264 Devices. Modular System with choice of clips. Multiple devices on a single extrusion. Alternate extrusion lengths available. Designed to mount 40X40 fan to provide forced convection. Complete system can be built to customer specifications. [See More]
- Material: Aluminum; Mixed
- L: 58
- Device: Passive Heat Sink
- W: 32
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Ohmite Manufacturing Co.
Ohmite ’s R2 Series (patent pending) heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the clip assure secure attachment and enhanced thermal performance. Because no screws are... [See More]
- Material: Aluminum; Mixed
- L: 35
- Device: Passive Heat Sink
- W: 22
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Ohmite Manufacturing Co.
Ohmite S Series LED Heatsinks are low cost and easy assembly heat sinks for Star LED packages supplied by Cree, Lumileds, Osram and others. This simple heat sink can hold LED modules and can be mounted simply with some thread forming screws. The Ohmite S series heatsink has two types of surface... [See More]
- Material: Aluminum; Mixed
- W: 69.8
- Device: Passive Heat Sink
- H: 12.7
from Dynatron Corp.
CPU Support : AMD ® AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Ohmite Manufacturing Co.
C Series For TO Package Heatsinks. No tool, camming clip system. Compatible with TO-264, TO-247,TO-220 and TO-126 Devices. Mount up to 3 devices per heatsink. Spring Clip delivers constant repeatable pressure. For TBH, TCH, TEH, and TFH series [See More]
- Material: Aluminum; Mixed
- L: 25 to 75
- Device: Passive Heat Sink
- W: 19.6 to 19.94
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 3U server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU... [See More]
- Material: Aluminum; Copper; Mixed
- L: 94
- Device: Active Heat Sink
- W: 89.5
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- W: 90
- L: 90
- H: 64