12 VDC Heat Sinks
Last Updated: April 1, 2025
Description
A 12 VDC heat sink is a device designed to manage the heat generated by electronic components, ensuring that their operating temperature remains below a specified limit. It achieves this by increasing the surface area in contact with the surrounding air, facilitating the dissipation of heat away from the component.
Working Principle
The working principle of a heat sink involves enhancing the thermal conductivity between the electronic component and the surrounding environment. By increasing the contact area with the air, the heat sink allows more heat to flow from the component to the air. This is often achieved through the use of fins or other structures that increase surface area. The effectiveness of a heat sink is determined by factors such as the material's thermal conductivity, the form factor, and the surface heat transfer coefficients. By improving these elements, the heat sink can more efficiently transfer heat away from the component, preventing overheating and ensuring reliable operation.
Applications
Heat sinks are widely used in electronics to cool various components. Specific examples include their use in cooling microprocessors, digital signal processors (DSPs), and graphics processing units (GPUs). They are also employed in power semiconductors and integrated circuits to maintain optimal operating temperatures and prevent thermal damage.
Advantages over other Heat Sinks
One advantage of using a 12 VDC heat sink is its reliability and cost-effectiveness. Unlike other cooling methods that may involve moving parts or complex systems, heat sinks are relatively simple and have fewer points of failure. They are also versatile, available in a wide range of sizes and configurations to suit different applications, from small discrete devices to large integrated circuits.
Limitations
A limitation of heat sinks is that they may not be sufficient for all cooling needs, especially in cases of localized overheating of individual components. In such scenarios, additional cooling methods may be required to ensure adequate heat dissipation. Furthermore, the performance of a heat sink is limited by its material properties and design, which may not always be optimal for every application.
Considerations
When selecting a heat sink, several factors should be considered. Initial costs can vary depending on the material and complexity of the design. Operating expenses are generally low, as heat sinks do not require power to function. Durability is typically high, but mechanical abuse can lead to damage. Accuracy in maintaining temperature is dependent on the design and material properties. Replacement and maintenance costs are minimal, as heat sinks are passive devices with no moving parts. However, ensuring proper installation and thermal interface materials is crucial for optimal performance.
from ToneCooling Technology Co., Ltd
CMc is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides.It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient of Kovar, Invar, and steel. Although the thermal... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The use of crystal ” oxygen-free copper heat sinks was prevalent over a decade... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 800MHz. [See More]
- Voltage: 12VDC
- L: 64
- Device: Active Heat Sink
- W: 50.8
from Boyd
Standard Aavid fan heat sink combinations are pre-assembled full thermal solutions for a variety of board level applications. Save time and space and increase thermal performance with these compact solutions. Aavid Fan Heat Sink Combinations are each comprised of a black anodized aluminum heat sink,... [See More]
- Voltage: 5VDC; 12VDC
- Material: Aluminum
- Device: Active Heat Sink
from Dynatron Corp.
Solution : Stylish active chipset cooler with quiet 50x50x10mm fan 3pin connector. [See More]
- Voltage: 12VDC
- L: 55
- Device: Active Heat Sink
- W: 54.6
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 866MHz. [See More]
- Voltage: 12VDC
- L: 68
- Device: Active Heat Sink
- W: 67.3
from Dynatron Corp.
Solution : Stylish active chipset cooler with 50x50x10mm fan 2pin connector [See More]
- Voltage: 12VDC
- L: 55
- Device: Active Heat Sink
- W: 54.6
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Voltage: 12VDC
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : Intel ® Celeron, Celeron D, Pentium 4, Pentium D, Core 2 Duo, Core 2 Quad, Core 2 Extreme, Core i7, AMD ® Sempron, Athlon 64, Athlon 64 X2, Athlon 64 FX, Phenom, Phenom II X4. CPU Socket : INTEL socket 1366, 775, AMD: socket AM2/AM3/AM2+. Solution : Evolution serial provides... [See More]
- Voltage: 12VDC
- L: 122
- Device: Active Heat Sink
- W: 108
from Sanyo Denki America, Inc.
CPU cooler for Intel Pentium 4 Processor (775-land LGA Package) [See More]
- Voltage: 12VDC
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : Intel ® Core ™ i3, Core ™ i5, Socket LGA1156, Core ™ i7, Socket LGA1366, Core ™2 Quad, Socket LGA775. AMD ® Athlon ™ X2 / FX, Phenom ™ X4, Socket AM2 / AM2+ / AM3. CPU Socket : INTEL: socket 1156, 1366, 775, AMD: socket AM2/AM3/AM2+. Solution... [See More]
- Voltage: 12VDC
- L: 124
- Device: Active Heat Sink
- W: 148
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 2.80GHz. [See More]
- Voltage: 12VDC
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 3.06GHz. [See More]
- Voltage: 12VDC
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Voltage: 12VDC
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD Athlon 64 3700+ Athlon 64 4000+ Sempron 3300+ Athlon 64 FX 53. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm fan, Aluminum Heatsink, Desktop solution [See More]
- Voltage: 12VDC
- L: 110
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 73
from Dynatron Corp.
CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 75
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 72
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 114
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Dynatron Corp.
CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6100 Series. CPU Socket : G34. Solution : 75x15mm Aluminum blower, Copper heatsink with heatpipes embedded for 1U Server solution [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Dual-Core. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 72
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 71