Mounting Holes Heat Sinks
Last Updated: January 31, 2025
Description
Mounting holes heat sinks are designed to dissipate heat from electronic components by providing a pathway for heat to transfer from the component to the surrounding environment. These heat sinks typically feature mounting holes that allow them to be securely attached to electronic devices, ensuring optimal thermal contact and stability.
Working Principle
Mounting holes heat sinks operate by increasing the surface area available for heat dissipation. They are typically made from materials with high thermal conductivity, such as aluminum or copper, which facilitate the transfer of heat away from the electronic component. The heat sink absorbs heat through conduction and then dissipates it into the surrounding air through convection. The presence of mounting holes ensures that the heat sink is firmly attached to the component, minimizing thermal resistance and enhancing heat transfer efficiency.
Applications
Mounting holes heat sinks are widely used in various electronic applications where efficient heat dissipation is critical. Specific examples include cooling microprocessors in computers, managing heat in power semiconductors, and ensuring the longevity and performance of LEDs and lasers in optoelectronic devices. They are also employed in high-power transistors and other components that generate significant amounts of heat during operation.
Advantages over other Heat Sinks
One of the primary advantages of mounting holes heat sinks is their ability to provide a secure and stable attachment to electronic components, which enhances thermal performance by reducing interface thermal resistance. This is particularly beneficial in applications where vibration or movement could otherwise compromise the thermal connection. Additionally, the use of mounting holes allows for easy integration into existing designs without the need for additional adhesive or bonding materials.
Limitations
A limitation of mounting holes heat sinks is that they may introduce mechanical stress to the electronic components if not properly aligned or if excessive force is applied during installation. This can potentially lead to damage or reduced performance of the component. Additionally, the presence of mounting holes may limit the design flexibility of the heat sink, as the holes must be precisely aligned with the component's mounting points.
Considerations
When selecting mounting holes heat sinks, several factors should be considered to ensure optimal performance and cost-effectiveness. Initial costs can vary depending on the material and complexity of the heat sink design. Operating expenses are generally low, as heat sinks do not require power to function. Durability is typically high, but care must be taken during installation to avoid mechanical damage. Replacement and maintenance costs are minimal, as heat sinks are passive components with no moving parts. However, it is important to periodically check for dust accumulation, which can impede airflow and reduce thermal efficiency.
from Sensata Technologies
0.25 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Mounting: Holes
- Thermal Resistance: 0.2500
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink Half Brick DC/DC Converter Aluminum Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 10.3
- Device: Passive Heat Sink
- Material: Aluminum
from Sensata Technologies
0.36 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Mounting: Holes
- Thermal Resistance: 0.3600
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink Half Brick DC/DC Converter Aluminum Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 4.7
- Device: Passive Heat Sink
- Material: Aluminum
from Sensata Technologies
0.5 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Mounting: Holes
- Thermal Resistance: 0.5000
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.7W @ 75 °C Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 15.83
- Device: Passive Heat Sink
- Material: Aluminum
from Sensata Technologies
0.7 °C/W Thermal resistance. Suitable for 1 or 2 single or dual Solid State Relays. Panel mounting [See More]
- Mounting: Holes
- Thermal Resistance: 0.7000
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.7W @ 75 °C Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 15.83
- Device: Passive Heat Sink
- Material: Aluminum
from Sensata Technologies
0.7 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Mounting: Holes
- Thermal Resistance: 0.7000
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.2W @ 75 °C Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 17.74
- Device: Passive Heat Sink
- Material: Aluminum
from Sensata Technologies
1 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Mounting: Holes
- Thermal Resistance: 1
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.2W @ 75 °C Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 17.74
- Device: Passive Heat Sink
- Material: Aluminum
from Sensata Technologies
1.0 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. DIN rail or panel mounting [See More]
- Mounting: Holes
- Thermal Resistance: 1
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 5.1W @ 75 °C Board Level, Vertical [See More]
- Mounting: Holes
- Thermal Resistance: 14.71
- Device: Passive Heat Sink
- Material: Aluminum
from Sensata Technologies
1.0 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. DIN rail or panel mounting [See More]
- Mounting: Holes
- Thermal Resistance: 1
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 5.1W @ 75 °C Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 14.71
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 26.32
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.8W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 15.79
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 6.8W @ 75 °C Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 14.33
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 6.5W @ 75 °C Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 11.54
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum Alloy 3.8W @ 75 °C Board Level [See More]
- Mounting: Holes
- Thermal Resistance: 19.74
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-218, TO-220 Aluminum Alloy 4.7W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 15.96
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum Alloy 6.4W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 11.72
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum Alloy 8.0W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 13.6
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-218 Aluminum Alloy 8.1W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 9.26
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-218 Aluminum Alloy 8.2W @ 75 °C Board Level, Vertical [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 9.15
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum Alloy 5.8W @ 75 °C Board Level, Vertical [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 12.93
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum Alloy 5.5W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 13.64
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum Alloy 5.2W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 14.42
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum Alloy 7.7W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 9.74
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum Alloy 5.0W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 15
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum Alloy 5.7W @ 75 °C Board Level [See More]
- Mounting: Holes; Socket
- Thermal Resistance: 13.16
- Device: Passive Heat Sink
- Material: Aluminum
from DigiKey
Heat Sink Aluminum Board Level [See More]
- Mounting: Holes
- Material: Aluminum
- Device: Passive Heat Sink
from Broadband TelCom Power, Inc.
Transverse fin orientation [See More]
- Mounting: Holes
- L: 58
- Device: Passive Heat Sink
- W: 60.96
from Ecopower Inc.
ThermaCool ™ Heat Sinks have been sized for each of our standard products and to accommodate a range of desired operating conditions. Proper heat sink sizing is determined by a number of factors, including those listed below: Power Dissipated (Watts) - Determined by the light engine part... [See More]
- Mounting: Holes
- W: 0.0635
- Device: Passive Heat Sink
- H: 0.0381
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 800MHz. [See More]
- Mounting: Holes
- L: 64
- Device: Active Heat Sink
- W: 50.8
from Wanbang Technology (Guangdong Dongguan) Co., LTD.
We provide OEM CNC machined heat sink, modest price, short lead time and good quality. [See More]
- Mounting: Holes
- Heat sink Fin Style:: Round; Elliptical; Straight; Machined
- Device: Passive Heat Sink; Vapor Cooler; Cold Plate
- Material: Aluminum
from Ohmite Manufacturing Co.
Designed for TO-220 devices, the Ohmite CSM series offers multiple configurations. Device attachment is made using standard screws. The CSM series can be ordered in three different profiles and hold up to 3 seperate devices at once. The CSM series from Ohmite has a thermal efficiency down to 9.8... [See More]
- Mounting: Holes
- L: 12 to 50
- Device: Passive Heat Sink
- W: 10.45 to 14.9
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 866MHz. [See More]
- Mounting: Holes
- L: 68
- Device: Active Heat Sink
- W: 67.3
from Ohmite Manufacturing Co.
The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power semiconductor... [See More]
- Mounting: Holes
- L: 114
- Device: Cold Plate
- W: 152
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Mounting: Holes
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Ohmite Manufacturing Co.
Ohmite introduces the SV-LED Series. The SV series is a high performance, low cost, configurable, scalable, and compact heatsink for LED modules. This powerful high aspect ratio heatsink comes in two standard heights. Each SV series heatsink can be configured to customer specifications. Customers... [See More]
- Mounting: Holes
- W: 21.6
- Device: Passive Heat Sink
- H: 14 to 25
from Sanyo Denki America, Inc.
CPU cooler for Intel Pentium 4 Processor (775-land LGA Package) [See More]
- Mounting: Holes
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Ohmite Manufacturing Co.
Heatsink for TO-220 Devices. Compatible with TO-220 devices. Thermal resistance as low as 7.4 °C/W. Available in multiple heights. Black Anodized and degreased versions. For TBH, and TCH series [See More]
- Mounting: Holes
- L: 35
- Device: Passive Heat Sink
- W: 12.7
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 2.80GHz. [See More]
- Mounting: Holes
- L: 95
- Device: Active Heat Sink
- W: 90
from Ohmite Manufacturing Co.
The unique design (patent pending) of the W Series heat sinks combines a tin plated, solderable, integral spring clip with an extruded aluminum heat sink body for an all-in-one solution to through-hole mounting of TO-220, TO-247, and TO-264 packages. These self-aligning heat sinks feature solderable... [See More]
- Mounting: Holes
- L: 18 to 23
- Device: Passive Heat Sink
- W: 16
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 3.06GHz. [See More]
- Mounting: Holes
- L: 95
- Device: Active Heat Sink
- W: 90
from Ohmite Manufacturing Co.
Ohmite S Series LED Heatsinks are low cost and easy assembly heat sinks for Star LED packages supplied by Cree, Lumileds, Osram and others. This simple heat sink can hold LED modules and can be mounted simply with some thread forming screws. The Ohmite S series heatsink has two types of surface... [See More]
- Mounting: Holes
- W: 69.8
- Device: Passive Heat Sink
- H: 12.7
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Mounting: Holes
- L: 95
- Device: Active Heat Sink
- W: 90
from Ohmite Manufacturing Co.
Ohmite introduces this new versatile heatsink design. This new design can accommodate several different industry packages. This design also lets the customer choose a mounting style using screws or clips for secure mounting to the heatsink. These one of a kind heatsinks are offered in a vertical... [See More]
- Mounting: Holes; Horizontal and Vertical Mount
- L: 39
- Device: Passive Heat Sink
- Weight: 42