Copper Heat Sinks

Heat Sink TO-263 (D ²Pak) Copper 3.8W @ 75 °C Board Level [See More]

• Material: Copper
• Thermal Resistance: 21.9

• Device: Passive Heat Sink

ToneCooling IGBT heat sink is made from AlSiC material and features a Pin-fin design, offering excellent thermal performance to efficiently reduce IGBT module temperatures and extend the lifespan of equipment. Ideal for applications in power electronics, industrial control systems, and other... [See More]

• Material: Copper; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

DFRobot FIT0506 Heatsink [See More]

• Material: Copper; Copper
• W: 12.1

• L: 13
• H: 4.8

Application: Telecommunication Equipment [See More]

• Material: Aluminum; Copper

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

ToneCooling ‘s copper heat sinks are designed to effectively manage heat in various applications. Copper is more efficient than aluminum at transferring heat, which makes it ideal for high-performance applications like electronics, machinery, and power systems. Our custom design and... [See More]

• Material: Copper; Copper

Heat pipe 3mm OD, 100mm, 15W, sintered [See More]

• Material: Copper; Copper
• W: 3

• L: 100
• H: 3

Application: High-power Laser Equipment [See More]

• Material: Copper

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

This compact TC-LGA4189 CPU cooler leverages vapor chamber (VC) technology to provide efficient cooling for Intel Xeon processors. It ’s designed for space-constrained server environments requiring reliable thermal management. This cooler combines a VC soaking plate with aluminum fins. The VC... [See More]

• Material: Aluminum; Copper; VC soaking plate and aluminum fins . Some coolers utilize a copper base, aluminum fins, and heat pipes .
• L: 113

• Device: Passive Heat Sink; Active Heat Sink
• W: 78

Heat pipe 3mm OD, 200mm, 10W, sintered [See More]

• Material: Copper; Copper
• W: 3

• L: 200

Application: Industrial Equipment [See More]

• Material: Copper

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

This compact TC-LGA4189 CPU cooler combines a vapor chamber (VC) soaking plate with copper fins to provide efficient cooling for Intel Xeon processors in space-constrained server environments. It ’s designed for reliable thermal management in 1U and 2U chassis. Advanced Phase-Change Vapor... [See More]

• Material: Copper; VC soaking plate and copper fins.
• L: 113

• Device: Active Heat Sink; Vapor Cooler
• W: 78

Heat pipe 3mm OD, 250mm, 6W, sintered [See More]

• Material: Copper; Copper
• W: 3

• L: 250

Application: High-power Laser Equipment [See More]

• Material: Copper

• Device: Liquid Cooler

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-04-200-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 4

• L: 200

Application: Telecommunications [See More]

• Material: Copper

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-04-100-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 4

• L: 100

Application: Laser Equipment [See More]

• Material: Aluminum; Copper

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-04-150-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 4

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-05-150-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 5

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-05-250-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 5

• L: 250

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Heat pipe 6mm OD, 100mm, 51W, sintered [See More]

• Material: Copper; Copper
• W: 6

• L: 100

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-06-200-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 6

• L: 200

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-06-300-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 6

• L: 300

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-06-150-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 6

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-08-150-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 8

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

SPREADFAST SF-08-200-S Heat Pipe [See More]

• Material: Copper; Copper
• W: 8

• L: 200

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Heat pipe 10mm OD, 150mm, 85W, sintered [See More]

• Material: Copper; Copper
• W: 10

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Heat pipe 10mm OD, 250mm, 59W, sintered [See More]

• Material: Copper; Copper
• W: 10

• L: 250

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Heat pipe 12mm OD, 300mm, 50W, sintered [See More]

• Material: Copper; Copper
• W: 12

• L: 300

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

STAMPED HEATSINK [See More]

• Material: Copper
• Mounting: SMD Pad

• Device: Passive Heat Sink
• Thermal Resistance: 11

Heat Sink Raspberry Pi Aluminum, Copper Heat Spreader Kit, Top Mount [See More]

• Material: Aluminum; Copper

• Device: Passive Heat Sink

Heat Sink Raspberry Pi 4B Aluminum, Copper Top Mount Kit [See More]

• Material: Aluminum; Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Heat Sink Raspberry Pi Copper Heat Spreader Kit, Top Mount [See More]

• Material: Copper

• Device: Passive Heat Sink

Name: CPU Liquid Cooler. Item No.: TY-C03. Material: C1100. Appearance: No oxidation, inner and outer surfaces clean, no impurities. Parameters: 200PSIto detect leak. Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system. Custom Design: Available [See More]

• Material: Copper; C1100

• Device: Thermo-Electric Cooler; Liquid Cooler

Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of... [See More]

• Material: Copper; Mixed; Copper and Tungsten
• Mounting: Direct Mounting

• Device: Passive Heat Sink
• Thermal Resistance: 0.5290

Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves. This type of heat sink fabrication allows for higher fin densities and fin aspect ratios which greatly improve thermal performance due to the increased surface area. Bonded fin types can be... [See More]

• Material: Aluminum; Copper; Stainless Steel, Inconel
• Heat sink Fin Style:: Bonded

• Device: Passive Heat Sink

CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]

• Material: Aluminum; Copper; Mixed
• L: 106

• Device: Active Heat Sink
• W: 106

CPU cooler for Intel ® 775-land LGA Package. [See More]

• Material: Aluminum; Copper
• L: 72

• Device: Active Heat Sink
• W: 72.1

The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power semiconductor... [See More]

• Material: Aluminum; Copper
• L: 114

• Device: Cold Plate
• W: 152

YS Tech knows that time is always a factor in development cycles. We pride ourselves on being very responsive to our customers ’ needs, with the ability to keep the design and engineering process moving quickly for fast manufacturing turnarounds. We can take your project from the design stage... [See More]

• Material: Aluminum; Copper
• L: 19 to 482

• Device: Passive Heat Sink
• Heat sink Fin Style:: Straight

The Aavid portfolio of folded fins includes over 3,000 different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat sinks and other fabrications. These fins can be purchased separately, bonded or brazed as part... [See More]

• Material: Aluminum; Copper; Mixed; Cupro Nickel, Inconel, Nickel Alloys, Stainless Steel
• H: 0.7600 to 50.8

• Device: Passive Heat Sink
• Heat sink Fin Style:: Folded

CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]

• Material: Aluminum; Copper; Mixed
• L: 106

• Device: Active Heat Sink
• W: 106

CPU cooler for Intel ® Pentium4 (Socket478). [See More]

• Material: Aluminum; Copper
• L: 95

• Device: Active Heat Sink
• W: 90

kived fin heat sinks offer highly optimized cooling as they allow for higher fin densities but do not have an interface joint where heat transfer could be impeded. Unlike bonded or brazed Heat Sinks, Skived Heat Sinks are constructed from a single piece of material and therefore have no thermal... [See More]

• Material: Aluminum; Copper
• L: 150 to 200

• Device: Passive Heat Sink
• H: 10 to 60

CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Passive copper heatsink for 1U Server solution. [See More]

• Material: Copper
• W: 75.5

• L: 115
• H: 24

For high volume production, Aavid zipper fins are the most cost efficient method for high fin density heat sinks. These fins are made from a stamped material, typically aluminum or copper, and are folded into shape with interlocking grooves. The fins are then typically soldered, brazed, or epoxied... [See More]

• Material: Aluminum; Copper
• Heat sink Fin Style:: Zipper

• Device: Passive Heat Sink

CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 106

• Device: Active Heat Sink
• W: 79

CPU Support : AMD ® Opteron ™ 6000 & 6100 Series. CPU Socket : G34. Solution : Passive skived fin copper heatsink for 1U Server solution. [See More]

• Material: Copper
• W: 75

• L: 115
• H: 27

CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 106

• Device: Active Heat Sink
• W: 73

CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 71

CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 75

CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : Copper Heatsink, 1U server solution [See More]

• Material: Copper
• W: 78

• L: 106
• H: 23.5

CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 106

• Device: Active Heat Sink
• W: 79

CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 72

CPU Support : AMD ® K8 Socket 754, Socket 939 and Athlon 64 FX socket 940 1U Opteron Server for Opteron 150/250/850. CPU Socket : 754/939/940. Solution : Copper Heatsink, 1U server solution [See More]

• Material: Copper
• W: 74

• L: 100
• H: 24

CPU Support : AMD ® 4.1" Mounting Pitch. CPU Socket : F 1207(4.1" Mounting Pitch). Solution : Copper Heatsink, 1U server solution [See More]

• Material: Copper
• W: 76

• L: 115
• H: 24

CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 106

• Device: Active Heat Sink
• W: 77

CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 100

• Device: Active Heat Sink
• W: 77.2

CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 114

• Device: Active Heat Sink
• W: 77.2

CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 114

• Device: Active Heat Sink
• W: 75.5

CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 71

CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 74

CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 74

CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 74

CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 77

CPU Support : AMD ® Opteron ™ 6100 Series. CPU Socket : G34. Solution : 75x15mm Aluminum blower, Copper heatsink with heatpipes embedded for 1U Server solution [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 79

CPU Support : AMD ® Dual-Core. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 72

CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 71