Copper Heat Sinks

Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves. This type of heat sink fabrication allows for higher fin densities and fin aspect ratios which greatly improve thermal performance due to the increased surface area. Bonded fin types can be... [See More]

• Material: Aluminum; Copper; Stainless Steel, Inconel
• Heat sink Fin Style:: Bonded

• Device: Passive Heat Sink

CMc is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides.It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]

• Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

This pack of 5 copper heatsinks offers a perfect solution to keep your LattePanda running at full speed. Each heatsink has a self adhesive pad so installation is quick and easy. Material: Pure copper . Dimensions (per heatsink): 13.2 x 12.1 x 4.8 mm / 0.52 x 0.48 x 0.19 inches. Weight: 32 g. For Use... [See More]

• Material: Copper
• W: 12.1

• L: 13
• H: 4.8

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

The Aavid portfolio of folded fins includes over 3,000 different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat sinks and other fabrications. These fins can be purchased separately, bonded or brazed as part... [See More]

• Material: Aluminum; Copper; Mixed; Cupro Nickel, Inconel, Nickel Alloys, Stainless Steel
• H: 0.7600 to 50.8

• Device: Passive Heat Sink
• Heat sink Fin Style:: Folded

CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]

• Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 100mm. Dimensions = 3 x 100mm. Diameter = 3mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 3

• L: 100

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

kived fin heat sinks offer highly optimized cooling as they allow for higher fin densities but do not have an interface joint where heat transfer could be impeded. Unlike bonded or brazed Heat Sinks, Skived Heat Sinks are constructed from a single piece of material and therefore have no thermal... [See More]

• Material: Aluminum; Copper
• L: 150 to 200

• Device: Passive Heat Sink
• H: 10 to 60

Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient of Kovar, Invar, and steel. Although the thermal... [See More]

• Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 150mm. Dimensions = 3 x 150mm. Diameter = 3mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 3

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

For high volume production, Aavid zipper fins are the most cost efficient method for high fin density heat sinks. These fins are made from a stamped material, typically aluminum or copper, and are folded into shape with interlocking grooves. The fins are then typically soldered, brazed, or epoxied... [See More]

• Material: Aluminum; Copper
• Heat sink Fin Style:: Zipper

• Device: Passive Heat Sink

Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond... [See More]

• Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 200mm. Dimensions = 3 x 200mm. Diameter = 3mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 3

• L: 200

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The use of crystal ” oxygen-free copper heat sinks was prevalent over a decade... [See More]

• Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 250mm. Dimensions = 3 x 250mm. Diameter = 3mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 3

• L: 250

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 200mm. Dimensions = 4 x 200mm. Diameter = 4mm. Series = SF. Material = Copper [See More]

• Material: Copper
• W: 4

• L: 200

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 100mm. Dimensions = 4 x 100mm. Diameter = 4mm. Series = SF. Material = Copper [See More]

• Material: Copper
• W: 4

• L: 100

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 150mm. Dimensions = 4 x 150mm. Diameter = 4mm. Series = SF. Material = Copper [See More]

• Material: Copper
• W: 4

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 150mm. Dimensions = 5 x 150mm. Diameter = 5mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 5

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 250mm. Dimensions = 5 x 250mm. Diameter = 5mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 5

• L: 250

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 100mm. Dimensions = 6 x 100mm. Diameter = 6mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 6

• L: 100

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 200mm. Dimensions = 6 x 200mm. Diameter = 6mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 6

• L: 200

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 300mm. Dimensions = 6 x 300mm. Diameter = 6mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 6

• L: 300

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 150mm. Dimensions = 6 x 150mm. Diameter = 6mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 6

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 300mm. Dimensions = 8 x 300mm. Diameter = 8mm. Series = SF. Material = Copper [See More]

• Material: Copper
• W: 8

• L: 300

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 150mm. Dimensions = 8 x 150mm. Diameter = 8mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 8

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 200mm. Dimensions = 8 x 200mm. Diameter = 8mm. Series = SF. Material = Copper [See More]

• Material: Copper
• W: 8

• L: 200

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 350mm. Dimensions = 8 x 350mm. Diameter = 8mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 8

• L: 350

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 150mm. Dimensions = 10 x 150mm. Diameter = 10mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 10

• L: 150

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 250mm. Dimensions = 10 x 250mm. Diameter = 10mm. Series = SF. Material = Copper [See More]

• Material: Copper
• W: 10

• L: 250

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 150mm. Dimensions = 12 x 150mm. Diameter = 12mm. Series = SF. Material = Copper [See More]

• Material: Copper
• W: 12

• L: 150

Heat Sink Raspberry Pi Aluminum, Copper Heat Spreader Kit, Top Mount [See More]

• Material: Aluminum; Copper

• Device: Passive Heat Sink

Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer. Length = 300mm. Dimensions = 12 x 300mm. Diameter = 12mm. Material = Copper. Series = SF [See More]

• Material: Copper
• W: 12

• L: 300

Heat Sink Raspberry Pi 4B Aluminum, Copper Top Mount Kit [See More]

• Material: Aluminum; Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Heat Sink Raspberry Pi Copper Heat Spreader Kit, Top Mount [See More]

• Material: Copper

• Device: Passive Heat Sink

Heat Sink Raspberry Pi 3 B+ Copper Board Level [See More]

• Material: Copper
• Mounting: Tape or adhesive compound

• Device: Passive Heat Sink

Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of... [See More]

• Material: Copper; Mixed; Copper and Tungsten
• Mounting: Direct Mounting

• Device: Passive Heat Sink
• Thermal Resistance: 0.5290

CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]

• Material: Aluminum; Copper; Mixed
• L: 106

• Device: Active Heat Sink
• W: 106

The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power semiconductor... [See More]

• Material: Aluminum; Copper
• L: 114

• Device: Cold Plate
• W: 152

Name: CPU Liquid Cooler. Item No.: TY-C03. Material: C1100. Appearance: No oxidation, inner and outer surfaces clean, no impurities. Parameters: 200PSIto detect leak. Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system. Custom Design: Available [See More]

• Material: Copper; C1100

• Device: Thermo-Electric Cooler; Liquid Cooler

YS Tech knows that time is always a factor in development cycles. We pride ourselves on being very responsive to our customers ’ needs, with the ability to keep the design and engineering process moving quickly for fast manufacturing turnarounds. We can take your project from the design stage... [See More]

• Material: Aluminum; Copper
• L: 19 to 482

• Device: Passive Heat Sink
• Heat sink Fin Style:: Straight

CPU cooler for Intel ® 775-land LGA Package. [See More]

• Material: Aluminum; Copper
• L: 72

• Device: Active Heat Sink
• W: 72.1

CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]

• Material: Aluminum; Copper; Mixed
• L: 106

• Device: Active Heat Sink
• W: 106

CPU cooler for Intel ® Pentium4 (Socket478). [See More]

• Material: Aluminum; Copper
• L: 95

• Device: Active Heat Sink
• W: 90

CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Passive copper heatsink for 1U Server solution. [See More]

• Material: Copper
• W: 75.5

• L: 115
• H: 24

CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 106

• Device: Active Heat Sink
• W: 79

CPU Support : AMD ® Opteron ™ 6000 & 6100 Series. CPU Socket : G34. Solution : Passive skived fin copper heatsink for 1U Server solution. [See More]

• Material: Copper
• W: 75

• L: 115
• H: 27

CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 106

• Device: Active Heat Sink
• W: 73

CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 71

CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 75

CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : Copper Heatsink, 1U server solution [See More]

• Material: Copper
• W: 78

• L: 106
• H: 23.5

CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 106

• Device: Active Heat Sink
• W: 79

CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 72

CPU Support : AMD ® K8 Socket 754, Socket 939 and Athlon 64 FX socket 940 1U Opteron Server for Opteron 150/250/850. CPU Socket : 754/939/940. Solution : Copper Heatsink, 1U server solution [See More]

• Material: Copper
• W: 74

• L: 100
• H: 24

CPU Support : AMD ® 4.1" Mounting Pitch. CPU Socket : F 1207(4.1" Mounting Pitch). Solution : Copper Heatsink, 1U server solution [See More]

• Material: Copper
• W: 76

• L: 115
• H: 24

CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 106

• Device: Active Heat Sink
• W: 77

CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 100

• Device: Active Heat Sink
• W: 77.2

CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 114

• Device: Active Heat Sink
• W: 77.2

CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 114

• Device: Active Heat Sink
• W: 75.5

CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 71

CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 74

CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 74

CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 74

CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 77

CPU Support : AMD ® Opteron ™ 6100 Series. CPU Socket : G34. Solution : 75x15mm Aluminum blower, Copper heatsink with heatpipes embedded for 1U Server solution [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 79

CPU Support : AMD ® Dual-Core. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 115

• Device: Active Heat Sink
• W: 72

CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]

• Material: Copper
• L: 100

• Device: Active Heat Sink
• W: 71