Aluminum Heat Sinks

6 ring Luxeon LED heatsink, 1.79 C/W [See More]

• Material: Aluminum; Aluminium
• W: 102

• L: 102
• H: 31.75

0.25 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 0.2500

High-performance A1001 Aluminum Heat Sink made from 6063 alloy, offering high thermal conductivity and corrosion-resistant anodized finish.Lightweight and machinable, ideal for power supplies, UPS, inverters, chargers, and adapters. [See More]

• Material: Aluminum; AL6063-T5
• H: 89

• W: 190

Heat Sink BGA Aluminum [See More]

• Material: Aluminum
• Mounting: Clips

• Device: Passive Heat Sink
• Thermal Resistance: 12

CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]

• Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

Flood LED extruded heatsink, 1.84 C/W [See More]

• Material: Aluminum; Aluminium
• W: 76.1

• L: 76
• H: 57.15

0.36 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 0.3600

Efficient A701 Aluminum Heat Sink crafted from 6063 alloy, featuring high thermal conductivity and anodized corrosion resistance.Designed for power supplies, UPS, and inverters. Lightweight, machinable, and durable. [See More]

• Material: Aluminum; AL6063-T5
• H: 25

• W: 55

Heat Sink Half Brick DC/DC Converter Aluminum Board Level [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 10.3

Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient of Kovar, Invar, and steel. Although the thermal... [See More]

• Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

LattePanda Heatsink Cooling Fan [See More]

• Material: Aluminum; Aluminium
• W: 34.5

• L: 34
• H: 10

0.5 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 0.5000

A75 Aluminum Heat Sink with high thermal conductivity, made from 6063 alloy and anodized for corrosion resistance.Suitable for power supplies, UPS, inverters. Lightweight and easily machinable for custom applications. [See More]

• Material: Aluminum; AL6063-T5
• H: 25

• W: 162

Heat Sink Half Brick DC/DC Converter Aluminum Board Level [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 4.7

Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond... [See More]

• Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

Cooling aggregate 0.06K/W 12V 6W [See More]

• Material: Aluminum; Aluminium
• W: 135

• L: 200
• H: 98

0.7 °C/W Thermal resistance. Suitable for 1 or 2 single or dual Solid State Relays. Panel mounting [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 0.7000

A954 Aluminum Heat Sink optimized for solar inverters, constructed from 6063 alloy with high thermal conductivity and anodized finish.Ideal for power supplies, UPS, and adapters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 45

• W: 232

Heat Sink TO-220 Aluminum 4.0W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 18.63

Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The use of crystal ” oxygen-free copper heat sinks was prevalent over a decade... [See More]

• Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
• W: 89.5

• L: 90
• H: 69

Cooling aggregate 0.16K/W 12V 2W [See More]

• Material: Aluminum; Aluminium
• W: 102

• L: 100
• H: 77

0.7 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 0.7000

D01-001 Aluminum Heat Sink from D01 Series, made from 6063 alloy with high thermal conductivity and anodized corrosion resistance.Suitable for power supplies, UPS, inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 33

• W: 120

Heat Sink TO-220 Aluminum 4.0W @ 75 °C Board Level [See More]

• Material: Aluminum
• Thermal Resistance: 18.63

• Device: Passive Heat Sink

Cooling aggregate 0.5K/W 12V 1.8W [See More]

• Material: Aluminum; Aluminium
• W: 60

• L: 60
• H: 47

1 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 1

D01-002 Aluminum Heat Sink part of D01 Series, crafted from 6063 alloy with high thermal conductivity and anodized finish.Ideal for inverters, power supplies, and UPS. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 40

• W: 120

Heat Sink TO-220 Aluminum 2.3W @ 75 °C Board Level [See More]

• Material: Aluminum
• Thermal Resistance: 33.28

• Device: Passive Heat Sink

Heatsink 2K/W 60x60x16mm anodised [See More]

• Material: Aluminum; Aluminium
• W: 60

• L: 60
• H: 16

1.0 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. DIN rail or panel mounting [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 1

D01-003 Aluminum Heat Sink from D01 Series, made from 6063 alloy with high thermal conductivity and anodized corrosion resistance.Perfect for UPS systems, power supplies, and inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 50

• W: 120

Heat Sink TO-220 Aluminum 2.3W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 33.28

Heatsink 0.6K/W 100x100x32mm anodised [See More]

• Material: Aluminum; Aluminium
• W: 102

• L: 100
• H: 32

1.0 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. DIN rail or panel mounting [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 1

D01-004 Aluminum Heat Sink designed for solar/wind systems, made from 6063 alloy with high thermal conductivity and anodized finish.Suitable for power supplies, UPS, and inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 29

• W: 138

Heat Sink TO-220 Aluminum 4.1W @ 75 °C Board Level, Vertical [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 18.34

HEATSINK WA210B [See More]

• Material: Aluminum; Aluminium
• W: 200

• L: 1000
• H: 40

D01-007 Aluminum Heat Sink from D01 Series, made from 6063 alloy with high thermal conductivity and anodized corrosion resistance.Ideal for chargers, power supplies, and UPS. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 25.5

• W: 69.56

Heat Sink TO-220 Aluminum 4.1W @ 75 °C Board Level [See More]

• Material: Aluminum
• Thermal Resistance: 18.34

• Device: Passive Heat Sink

Heatsink,100x40x150mm,1 °C/W,SK92 150SA [See More]

• Material: Aluminum; Aluminium
• W: 100

• L: 150
• H: 40

D01-008 Aluminum Heat Sink part of D01 Series, crafted from 6063 alloy with high thermal conductivity and anodized finish.Suitable for power supplies, UPS, and inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 29.2

• W: 50

Heat Sink TO-220 Aluminum 4.7W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 15.83

HEATSINK SK100-100-SA [See More]

• Material: Aluminum; Aluminium
• W: 66

• L: 100
• H: 40

D01-014 Aluminum Heat Sink with 153x50mm profile, made from 6063 alloy offering high thermal conductivity and anodized corrosion resistance.Ideal for power supplies, UPS, and inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 50

• W: 153

Heat Sink TO-220 Aluminum 4.7W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 15.83

HEATSINK SK100-37,5-SA [See More]

• Material: Aluminum; Aluminium
• W: 66

• L: 38
• H: 40

D01-015 Aluminum Heat Sink designed for inverters, made from 6063 alloy with high thermal conductivity and anodized finish.Suitable for power supplies and UPS. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 73

• W: 240

Heat Sink TO-220 Aluminum 2.6W @ 75 °C Board Level, Vertical [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 29.09

HEATSINK SK100-50-SA [See More]

• Material: Aluminum; Aluminium
• W: 66

• L: 50
• H: 40

D01-017 Aluminum Heat Sink optimized for solar systems, made from 6063 alloy with high thermal conductivity and anodized corrosion resistance.Ideal for power supplies, UPS, and inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 55

• W: 153

Heat Sink TO-220 Aluminum 2.6W @ 75 °C Board Level, Vertical [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 28.85

HEATSINK SK100-75-SA [See More]

• Material: Aluminum; Aluminium
• W: 66

• L: 75
• H: 40

D01-018 Aluminum Heat Sink from D01 Series, made from 6063 alloy with high thermal conductivity and anodized finish.Suitable for power supplies, UPS, and inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 40

• W: 153

Heat Sink TO-220 Aluminum 2.7W @ 75 °C Board Level, Vertical [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 27.78

HEATSINK SK85-37,5-SA [See More]

• Material: Aluminum; Aluminium
• W: 160

• L: 38
• H: 40

D01-020 Aluminum Heat Sink part of D01 Series, crafted from 6063 alloy with high thermal conductivity and anodized finish.Suitable for inverters, power supplies, and UPS. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 44.6

• W: 120

Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level, Vertical [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 25.92

HEATSINK SK85-50-SA [See More]

• Material: Aluminum; Aluminium
• W: 160

• L: 50
• H: 40

HFX Aluminum Heat Sink made from 6063 alloy, featuring high thermal conductivity and anodized corrosion-resistant finish.Suitable for power supplies, UPS, and inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 55

• W: 242

Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 25.92

HEATSINK SK85-75-SA [See More]

• Material: Aluminum; Aluminium
• W: 160

• L: 75
• H: 40

MY-001 Aluminum Heat Sink Profile from 6063 alloy, offering high thermal conductivity and anodized corrosion resistance.Ideal for inverters, power supplies, and UPS. Lightweight and machinable. [See More]

• Material: Aluminum; AL6061
• H: 21

• W: 57.9

Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level [See More]

• Material: Aluminum
• Thermal Resistance: 25.92

• Device: Passive Heat Sink

HEATSINK SK92-100-SA [See More]

• Material: Aluminum; Aluminium
• W: 100

• L: 100
• H: 40

RS 138-10 Aluminum Heat Sink designed for UPS systems, made from 6063 alloy with high thermal conductivity and anodized finish.Suitable for power supplies and inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 63

• W: 138

Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level, Vertical [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 25.92

HEATSINK SK92-50-SA [See More]

• Material: Aluminum; Aluminium
• W: 100

• L: 50
• H: 40

TPS3102 Aluminum Heat Sink made from 6063 alloy, featuring high thermal conductivity and anodized corrosion-resistant finish.Ideal for power supplies, UPS, and inverters. Lightweight and machinable. [See More]

• Material: Aluminum; AL6063-T5
• H: 15

• W: 162

Heat Sink TO-220 Aluminum 4.2W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 17.74

HEATSINK SK92-75-SA [See More]

• Material: Aluminum; Aluminium
• W: 100

• L: 75
• H: 40

Heat Sink TO-220 Aluminum 4.2W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 17.74

HEATSINK SK56-150-SA [See More]

• Material: Aluminum; Aluminium
• W: 300

• L: 150
• H: 40

Heat Sink TO-220 Aluminum 5.1W @ 75 °C Board Level, Vertical [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 14.71

HEATSINK SK56-200-SA [See More]

• Material: Aluminum; Aluminium
• W: 300

• L: 200
• H: 40

Heat Sink TO-220 Aluminum 5.1W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 14.71

HEATSINK SK56-75-SA [See More]

• Material: Aluminum; Aluminium
• W: 300

• L: 75
• H: 40

Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Holes

• Device: Passive Heat Sink
• Thermal Resistance: 26.32

HEATSINK SK58-100-SA [See More]

• Material: Aluminum; Aluminium
• W: 150

• L: 100
• H: 27

Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Socket

• Device: Passive Heat Sink
• Thermal Resistance: 25.86

HEATSINK SK58-50-SA [See More]

• Material: Aluminum; Aluminium
• W: 150

• L: 50
• H: 27

Heat Sink TO-220 Aluminum 2.6W @ 75 °C Board Level [See More]

• Material: Aluminum
• Mounting: Clips

• Device: Passive Heat Sink
• Thermal Resistance: 28.85

11*5*7MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 5

• L: 11
• H: 7

CPU cooler for Intel ® PentiumIII (FC-PGA2) / 800MHz. [See More]

• Material: Aluminum
• L: 64

• Device: Active Heat Sink
• W: 50.8

YS Tech knows that time is always a factor in development cycles. We pride ourselves on being very responsive to our customers ’ needs, with the ability to keep the design and engineering process moving quickly for fast manufacturing turnarounds. We can take your project from the design stage... [See More]

• Material: Aluminum; Copper
• L: 19 to 482

• Device: Passive Heat Sink
• Heat sink Fin Style:: Straight

CPU Support : Intel ® Celeron, Celeron D, Pentium 4, Pentium D, Core 2 Duo, Core 2 Quad, Core 2 Extreme, Core i7, AMD ® Sempron, Athlon 64, Athlon 64 X2, Athlon 64 FX, Phenom, Phenom II X4. CPU Socket : INTEL socket 1366, 775, AMD: socket AM2/AM3/AM2+. Solution : Evolution serial provides... [See More]

• Material: Aluminum
• L: 122

• Device: Active Heat Sink
• W: 108

AAVID THERMALLOY - 573100D00000G - Heat Sink, Square, PCB, Surface Mount, 15 °C/W, TO-252, 22.86 mm, 10.16 mm, 8 mm [See More]

• Material: Aluminum

We provide OEM CNC machined heat sink, modest price, short lead time and good quality. [See More]

• Material: Aluminum
• Heat sink Fin Style:: Round; Elliptical; Straight; Machined

• Device: Passive Heat Sink; Vapor Cooler; Cold Plate
• Mounting: Holes

Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves. This type of heat sink fabrication allows for higher fin densities and fin aspect ratios which greatly improve thermal performance due to the increased surface area. Bonded fin types can be... [See More]

• Material: Aluminum; Copper; Stainless Steel, Inconel
• Heat sink Fin Style:: Bonded

• Device: Passive Heat Sink

Cooliance's precision forging capabilities allow for a variety of standard elliptical fins ranging from 160 x 160mm with max fin height of 50mm. The elliptical wing shape is superior to an equivalent extruded straight fin heatsink as the wing shape acts to break up and fully leverage existing air... [See More]

• Material: Aluminum
• L: 19 to 160

• Device: Passive Heat Sink
• W: 19 to 160

Transverse fin orientation [See More]

• Material: Aluminum
• L: 58

• Device: Passive Heat Sink
• W: 60.96

Designed for TO-220 devices, the Ohmite CSM series offers multiple configurations. Device attachment is made using standard screws. The CSM series can be ordered in three different profiles and hold up to 3 seperate devices at once. The CSM series from Ohmite has a thermal efficiency down to 9.8... [See More]

• Material: Aluminum
• L: 12 to 50

• Device: Passive Heat Sink
• W: 10.45 to 14.9

15.5*10.5*21MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 10.5

• L: 16
• H: 21

CPU cooler for Intel ® PentiumIII (FC-PGA2) / 866MHz. [See More]

• Material: Aluminum
• L: 68

• Device: Active Heat Sink
• W: 67.3

CPU Support : Intel ® Core ™ i3, Core ™ i5, Socket LGA1156, Core ™ i7, Socket LGA1366, Core ™2 Quad, Socket LGA775. AMD ® Athlon ™ X2 / FX, Phenom ™ X4, Socket AM2 / AM2+ / AM3. CPU Socket : INTEL: socket 1156, 1366, 775, AMD: socket AM2/AM3/AM2+. Solution... [See More]

• Material: Aluminum
• L: 124

• Device: Active Heat Sink
• W: 148

AAVID THERMALLOY - 6022BG - Heat Sink, Square, PCB, 16.7 °C/W, TO-220, 22.23 mm, 30.73 mm, 6.35 mm [See More]

• Material: Aluminum

Superconducting aluminum temperature plate. Superconducting aluminum uniform temperature plate, which is quickly and evenly distributed to the low temperature condensation by the heat of evaporation of the thermal superconducting medium in the vacuum chamber, and then the capillary structure in the... [See More]

• Material: Aluminum
• L: 100 to 3000

• Device: Cold Plate
• W: 5 to 240

Extruded aluminum is one of the most popular and cost efficient heat sink fabrication methods. Aavid maintains the world's largest portfolio of extruded heat sink profiles with over 5,000 tooled shapes. Aavid extruded heat sink profiles range from simple flat back fin structures to complex... [See More]

• Material: Aluminum
• W: 100 to 700

• Device: Passive Heat Sink

Cooliance offers a selection of standard pin fin heatsinks. These are particularly suitable for applications where the air flow is from the top. Cooliance offers precision forged pin fin heatsinks that come in both active and passive versions. They can be forged in either aluminum or copper. [See More]

• Material: Aluminum
• L: 19 to 49

• Device: Passive Heat Sink
• W: 19 to 49

The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power semiconductor... [See More]

• Material: Aluminum; Copper
• L: 114

• Device: Cold Plate
• W: 152

15.5*10.5*24MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 10.5

• L: 16
• H: 24

CPU cooler for Intel ® 775-land LGA Package. [See More]

• Material: Aluminum; Copper
• L: 72

• Device: Active Heat Sink
• W: 72.1

CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]

• Material: Aluminum; Copper; Mixed
• L: 106

• Device: Active Heat Sink
• W: 106

AAVID THERMALLOY 374424B00035GHeat Sink, Square, PCB, For Ball Grid Arrays, BGA, 20.3 C/W, 18 mm, 27 mm, 27 mm [See More]

• Material: Aluminum

Standard Aavid fan heat sink combinations are pre-assembled full thermal solutions for a variety of board level applications. Save time and space and increase thermal performance with these compact solutions. Aavid Fan Heat Sink Combinations are each comprised of a black anodized aluminum heat sink,... [See More]

• Material: Aluminum
• Voltage: 5VDC; 12VDC

• Device: Active Heat Sink

Cooliance offers a wide variety of standard radial fin options ranging in diameter from .5" to 3" and from 1 to 7 fins. Radial fin heatsinks do not require any specific orientation. Our Smart-CLIP ™ attach mechanism allows the fins to extend beyond the dimensions of the chip package without... [See More]

• Material: Aluminum
• W: 34.92 to 50.8

• Device: Passive Heat Sink
• H: 6.35 to 19.94

Custom Extrusion Heatsinks. The Ohmite AH series of aluminum extrusion heatsinks can be produced to customer requirements. Ohmite offers 34 different extrusion profiles. Each one can be modified with holes, bolt patterns, and finishes. Thermal performance of 0.6 °C/W is achieved in certain... [See More]

• Material: Aluminum; Mixed
• W: 19.05 to 311

• Device: Passive Heat Sink
• H: 9.65 to 60.71

20*10*20MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 10

• L: 20
• H: 20

CPU cooler for Intel Pentium 4 Processor (775-land LGA Package) [See More]

• Material: Aluminum
• L: 72

• Device: Active Heat Sink
• W: 72.1

CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]

• Material: Aluminum; Copper; Mixed
• L: 106

• Device: Active Heat Sink
• W: 106

HEAT SINK TO-3 1.25" COMPACT [See More]

• Material: Aluminum

Flat Tube Liquid Cold Plates utilizing aluminum multi-port extrusion (MPE) tubing are compact thermal management solutions that offer extremely low thermal resistance. These extrusions utilize thin external walls which minimize thermal resistance between the cold plate and heat source mounting... [See More]

• Material: Aluminum
• Weight: 50

• Device: Liquid Cooler

Cooliance offers a variety of standard forged straight fin heatsinks that come in numerous base dimensions with a max height of 15mm. [See More]

• Material: Aluminum
• L: 19 to 45

• Device: Passive Heat Sink
• W: 18.5 to 44.5

Ohmite introduces the powerful B60/ C60 series heatsink with cam clip (Pat. Pending) or custom mounting. The B60/C60 series offers flexibility, high performance, and a compact heat sink design with exchangeable cam clip system for TO-247 and TO-264 devices. The B60 series can be tapped for popular... [See More]

• Material: Aluminum; Mixed
• L: 75

• Device: Passive Heat Sink
• W: 69.5 to 70.7

20*15*20MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 15

• L: 20
• H: 20

CPU cooler for Intel ® Pentium4 (Socket478) / 2.80GHz. [See More]

• Material: Aluminum
• L: 95

• Device: Active Heat Sink
• W: 90

CPU Support : AMD Athlon 64 3700+ Athlon 64 4000+ Sempron 3300+ Athlon 64 FX 53. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm fan, Aluminum Heatsink, Desktop solution [See More]

• Material: Aluminum
• L: 110

• Device: Active Heat Sink
• W: 78

HEATSINK ALUM ANOD [See More]

• Material: Aluminum

The Aavid portfolio of folded fins includes over 3,000 different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat sinks and other fabrications. These fins can be purchased separately, bonded or brazed as part... [See More]

• Material: Aluminum; Copper; Mixed; Cupro Nickel, Inconel, Nickel Alloys, Stainless Steel
• H: 0.7600 to 50.8

• Device: Passive Heat Sink
• Heat sink Fin Style:: Folded

Clip Mounting For TO-247 and TO-264 Devices. Modular System with choice of clips. Multiple devices on a single extrusion. Alternate extrusion lengths available. Designed to mount 40X40 fan to provide forced convection. Complete system can be built to customer specifications. [See More]

• Material: Aluminum; Mixed
• L: 58

• Device: Passive Heat Sink
• W: 32

22*10*22MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 10

• L: 22
• H: 22

CPU cooler for Intel ® Pentium4 (Socket478) / 3.06GHz. [See More]

• Material: Aluminum
• L: 95

• Device: Active Heat Sink
• W: 90

CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 106

• Device: Active Heat Sink
• W: 77

HEATSINK CPU 40.6MM SQ H=.525" [See More]

• Material: Aluminum

Aavid, Thermal Division of Boyd Corporation ’s tube liquid cold plates feature copper or stainless steel tubing pressed into aluminum plates. Tube cold plates feature a joint free continuous tube mechanically interlocked into an extruded aluminum plate. These cost effective liquid cold plates... [See More]

• Material: Aluminum; Pressed with Copper or Stainless Steel Tubing
• L: 152 to 305

• Device: Liquid Cooler
• W: 88.9 to 127

Ohmite ’s R2 Series (patent pending) heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the clip assure secure attachment and enhanced thermal performance. Because no screws are... [See More]

• Material: Aluminum; Mixed
• L: 35

• Device: Passive Heat Sink
• W: 22

22*10*25MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 10

• L: 22
• H: 25

CPU cooler for Intel ® Pentium4 (Socket478). [See More]

• Material: Aluminum; Copper
• L: 95

• Device: Active Heat Sink
• W: 90

CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 100

• Device: Active Heat Sink
• W: 77.2

HEATSINK PWR .75H BLACK TO-220 [See More]

• Material: Aluminum

kived fin heat sinks offer highly optimized cooling as they allow for higher fin densities but do not have an interface joint where heat transfer could be impeded. Unlike bonded or brazed Heat Sinks, Skived Heat Sinks are constructed from a single piece of material and therefore have no thermal... [See More]

• Material: Aluminum; Copper
• L: 150 to 200

• Device: Passive Heat Sink
• H: 10 to 60

TO-220, TO-247 Multiple Device Heatsink. Matrix clip system for TO-247 and TO-264 packages. Maximum Repeatability; Constant spring force over repeated assembly/disassembly. Mount up to 4 devices per heatsink. Black anodized or degreased finish. For TBH, TCH, and TEH series [See More]

• Material: Aluminum
• L: 27 to 55

• Device: Passive Heat Sink
• W: 38.6 to 43.5

23.5*16*25MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 16

• L: 24
• H: 25

CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 114

• Device: Active Heat Sink
• W: 75.5

HEATSINK TO-218 SOLDER PIN [See More]

• Material: Aluminum

Aavid, Thermal Division of Boyd Corporation ’s Hi-Contact ™ technology optimizes the contact area liquid tubes have with a cooling surface to provide the best possible liquid cold plate thermal performance. Our patented geometry used in these designs ensures the most tube-to-plate and... [See More]

• Material: Aluminum; Interlocked with Copper or Stainless Steel Tubing
• L: 57 to 610

• Device: Liquid Cooler
• W: 57.2 to 178

Ohmite introduces the CR series heatsink with cam clip (Pat. Pending). The CR series offers flexibility, high performance, and is comparable to popular Aavid MAX-clip heatsinks. The cam clip system for TO-247 and TO-264 devices is proprietary and provides tool or fixture free assembly. The CR series... [See More]

• Material: Aluminum
• L: 25 to 75

• Device: Passive Heat Sink
• W: 26.92 to 39.88

23X16X20MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 16

• L: 23
• H: 20

CPU Support : AMD ®:K7 AMD ® Recommended up to XP2100+, MP2100+ & Sempron 3000+; Intel ®: 933MHZ and 1/1.26GHZ and 1.40 Ghz &. CPU Socket : A/462/370. Solution : 60 x 60 x 10mm fan, Aluminum Heatsink, Desktop solution [See More]

• Material: Aluminum
• L: 70

• Device: Active Heat Sink
• W: 63

HEATSINK TO-220 1.45" HIGH [See More]

• Material: Aluminum

For high volume production, Aavid zipper fins are the most cost efficient method for high fin density heat sinks. These fins are made from a stamped material, typically aluminum or copper, and are folded into shape with interlocking grooves. The fins are then typically soldered, brazed, or epoxied... [See More]

• Material: Aluminum; Copper
• Heat sink Fin Style:: Zipper

• Device: Passive Heat Sink

Ohmite now carries a line of heatsink solutions that are specifically designed for your BGA and PBGA applications. Ohmite's heatsinks provide a low-cost thermal solution for these specific packages in multiple sizes. Our heatsink solutions can be attached to devices with adhesive thermal tape,... [See More]

• Material: Aluminum
• L: 15 to 45

• Device: Passive Heat Sink
• W: 15 to 42.5

24*10*100MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 10

• L: 24
• H: 100

CPU Support : Intel ® P4 3.4Ghz and P4EE up to 3.4GHz. CPU Socket : 478. Solution : 60 x 60 x 10mm fan, Aluminum Heatsink, 2U&Up server & Desktop solution [See More]

• Material: Aluminum
• L: 90

• Device: Active Heat Sink
• W: 76

HEATSINK TO-220 LIGHTWEIGHT .5" [See More]

• Material: Aluminum

If you are using popular IXYS devices or the Ohmite CS10 series, look no further than the VR series extruded heatsinks to complete your design. Each heatsink is designed with a cam clips system ( Pat Pend) for these popular device types. The VR series also accomodates TO-220 and TO-247 devices. [See More]

• Material: Aluminum
• L: 27 to 55

• Device: Passive Heat Sink
• W: 33.9

25*2.5*25MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 2.5

• L: 25
• H: 25

CPU Support : AMD ® AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server... [See More]

• Material: Aluminum; Copper; Mixed
• L: 100

• Device: Active Heat Sink
• W: 78

HEATSINK TO-220 TAB FOLD 42.16MM [See More]

• Material: Aluminum

If you are using popular SOT-227 devices or the Ohmite TGHE series, look no further than the VX series extruded heatsinks to complete your design. Each heatsink is drilled and tapped to the standard pattern for these popular device types. Remove the guess work involved for heatsink selection by... [See More]

• Material: Aluminum
• L: 35 to 55

• Device: Passive Heat Sink
• W: 48.7

28*15*28MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 15

• L: 28
• H: 28

CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 100

• Device: Active Heat Sink
• W: 78

HEATSINK TO-220 TABS BLACK [See More]

• Material: Aluminum

The Ohmite E series is offered in multiple extrusion lengths and is black anodized to provide great thermal performance in natural convection applications. This extrusion form can be used for TO-220, TO-218 and TO-247 devices and provides a thermal resistance as low as 3 °C/W. For use with... [See More]

• Material: Aluminum
• L: 25

• Device: Passive Heat Sink
• W: 25

30*25*30MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 25

• L: 30
• H: 30

CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 3U server... [See More]

• Material: Aluminum; Copper; Mixed
• L: 100

• Device: Active Heat Sink
• W: 78

HEATSINK TO-220 VERT MNT W/TABS [See More]

• Material: Aluminum

Heatsink for TO-220 Devices. Compatible with TO-220 devices. Thermal resistance as low as 7.4 °C/W. Available in multiple heights. Black Anodized and degreased versions. For TBH, and TCH series [See More]

• Material: Aluminum
• L: 35

• Device: Passive Heat Sink
• W: 12.7

30*30*25 MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 30

• L: 30
• H: 25

CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207. Solution : 60 x 60 x 25mm fan, Aluminum Heatsink, 2U&Up server solution [See More]

• Material: Aluminum
• L: 100

• Device: Active Heat Sink
• W: 71

HEATSINK TO-220 VERT MNT W/TABS [See More]

• Material: Aluminum

The unique design (patent pending) of the W Series heat sinks combines a tin plated, solderable, integral spring clip with an extruded aluminum heat sink body for an all-in-one solution to through-hole mounting of TO-220, TO-247, and TO-264 packages. These self-aligning heat sinks feature solderable... [See More]

• Material: Aluminum
• L: 18 to 23

• Device: Passive Heat Sink
• W: 16

35*12*25MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 12

• L: 35
• H: 25

CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207. Solution : 60 x 60 x 25mm fan, Aluminum Heatsink, 2U&Up server solution [See More]

• Material: Aluminum
• L: 100

• Device: Active Heat Sink
• W: 71

HEATSINK TO-220 VRT MT BLK 1.5" [See More]

• Material: Aluminum

Ohmite S Series LED Heatsinks are low cost and easy assembly heat sinks for Star LED packages supplied by Cree, Lumileds, Osram and others. This simple heat sink can hold LED modules and can be mounted simply with some thread forming screws. The Ohmite S series heatsink has two types of surface... [See More]

• Material: Aluminum; Mixed
• W: 69.8

• Device: Passive Heat Sink
• H: 12.7

35*15*35MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 15

• L: 35
• H: 35

CPU Support : Intel ® Xeon ™ 5500 Series Nehalem EP Processor Socket LGA 1366 E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5508, L5518. CPU Socket : 1366. Solution : Aluminum Heatsink, 1U server solution [See More]

• Material: Aluminum
• W: 90

• L: 90
• H: 27

HEATSINK TO-220 W/PINS 1.5"TALL [See More]

• Material: Aluminum

C Series For TO Package Heatsinks. No tool, camming clip system. Compatible with TO-264, TO-247,TO-220 and TO-126 Devices. Mount up to 3 devices per heatsink. Spring Clip delivers constant repeatable pressure. For TBH, TCH, TEH, and TFH series [See More]

• Material: Aluminum; Mixed
• L: 25 to 75

• Device: Passive Heat Sink
• W: 19.6 to 19.94

50*18*21MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 18

• L: 50
• H: 21

CPU Support : Intel ® Xeon ® Processor 5000 Series, W3690, W3680, W3670, W3580, W3570, W3550, W3540, W3530, W3520. CPU Socket : 1366. Solution : Low-noise à ˜92x25 PWM fan, HCC(Heatpipe Contact CPU) technology heatpipe CPU cooler with pre-printed Shin-Etsu G751 Thermal... [See More]

• Material: Aluminum
• L: 91

• Device: Active Heat Sink
• W: 91

HEATSINK TO-220 W/PINS BLK 2" [See More]

• Material: Aluminum

Ohmite introduces this new versatile heatsink design. This new design can accommodate several different industry packages. This design also lets the customer choose a mounting style using screws or clips for secure mounting to the heatsink. These one of a kind heatsinks are offered in a vertical... [See More]

• Material: Aluminum
• L: 39

• Device: Passive Heat Sink
• Weight: 42

60x11x20MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 11

• L: 60
• H: 20

CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU Socket : 1366. Solution : Extrusion Aluminum Heatsink 2U&Up... [See More]

• Material: Aluminum
• W: 90

• L: 90
• H: 64.5

HEATSINK W/TAB BLACK [See More]

• Material: Aluminum

15*10*20MM 6063-T6 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 10

• L: 15
• H: 20

CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU... [See More]

• Material: Aluminum; Copper; Mixed
• L: 94

• Device: Active Heat Sink
• W: 89.5

Heatsink; TO-220; 15.6degC/W; 44.45 x 17.78 x 12.7mm; Through Hole Mount [See More]

• Material: Aluminum

15*10*20MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 10

• L: 15
• H: 20

CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]

• Material: Aluminum; Copper; Mixed
• W: 90

• L: 90
• H: 64

Heatsink;Omnidirectional;11.4mm;Black Anodized [See More]

• Material: Aluminum

20*15*40MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 15

• L: 20
• H: 40

CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU Socket : 1366. Solution : 60 x 60 x 25 mm fan with PWM... [See More]

• Material: Aluminum; Copper; Mixed
• L: 90

• Device: Active Heat Sink
• W: 90

TO-220 Package 3.7 C/W Thermal Resistance Large Radial Fin Heat Sink [See More]

• Material: Aluminum

20*14*20MM 6063-T5Aluminum - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 14

• L: 20
• H: 20

CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]

• Material: Aluminum; Copper; Mixed
• L: 90

• Device: Active Heat Sink
• W: 90

20*20*6.3MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 20

• L: 20
• H: 6.3

CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]

• Material: Aluminum; Copper; Mixed
• L: 90

• Device: Active Heat Sink
• W: 90

33*33*15MM 6063-T5 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 33

• L: 33
• H: 15

CPU Support : Intel ® Core i7 processors, Xeon Westmere 5600 series & Nehalem 5500 Series. CPU Socket : 1366. Solution : 92 x 92 x 25mm fan with PWM function, Aluminum Radial Fin Heatsink with Copper Inserted, Desktop&Workstation server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 110

• Device: Active Heat Sink
• W: 110

40*40*20.3MM 6063-T6 - Heat sink/heatsink ROHS [See More]

• Material: Aluminum
• W: 40

• L: 40
• H: 20.3

CPU Support : Intel ® Xeon ® Tulsa, Paxville. CPU Socket : 604. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]

• Material: Aluminum; Copper; Mixed
• L: 94

• Device: Active Heat Sink
• W: 81