Adhesive / Tape Heat Sinks
Last Updated: April 1, 2025
Description
Adhesive or tape heat sinks are specialized materials designed to facilitate the dissipation of heat from electronic components. These products function by creating a thermal interface between heat-generating components and heat sinks, thereby enhancing the efficiency of heat transfer and maintaining optimal operating temperatures for electronic devices.
Working Principle
Adhesive or tape heat sinks operate by utilizing thermally conductive materials that transfer heat away from electronic components. The adhesive layer becomes tacky or sticky when heat is applied, allowing it to bond securely to surfaces. This bonding capability ensures that the heat is effectively spread across a horizontal plane, which aids in dissipating it away from the heat source. The tape itself acts as a heat sink, absorbing and spreading the heat to prevent overheating and maintain device performance .
Applications
Adhesive or tape heat sinks are used in various applications, particularly in electronics where space and weight are critical factors. They are commonly employed in bonding electronic components to circuit boards, attaching heat sinks to semiconductors, and encapsulating sensors. Specific examples include their use in avionics equipment, where they help manage heat in miniature electronic components such as capacitors, resistors, and transistors . Additionally, they are used in die attach and lid seal applications, serving as the thermal interface between a chip die and a heat spreader .
Advantages over other Heat Sinks
Adhesive or tape heat sinks offer several advantages over traditional heat sinks. They are capable of bonding irregular surfaces and incompatible substrates, making them an ideal replacement for mechanical fasteners and liquid adhesives . These heat sinks also reduce manufacturing processing time and cost, enhance aesthetics, and improve the durability and performance of electronic devices . Furthermore, they provide mechanical strength and resistance to vibration, thermal cycling, and high temperatures, making them suitable for demanding conditions .
Limitations
One limitation of adhesive or tape heat sinks is their dependency on the adhesive's thermal conductivity and bonding strength. The effectiveness of heat dissipation can be compromised if the adhesive does not maintain a strong bond or if its thermal conductivity is insufficient for the application. Additionally, the adhesive may soften under high temperatures, which could affect its long-term performance .
Considerations
When selecting adhesive or tape heat sinks, several factors should be considered. Initial costs may vary depending on the material's thermal conductivity and adhesive properties. Operating expenses are generally low, as these heat sinks do not require additional power to function. Durability is influenced by the adhesive's resistance to environmental factors such as UV exposure and fluctuating temperatures . Replacement and maintenance costs are minimal, but it is crucial to ensure that the adhesive maintains its bonding strength over time to avoid performance degradation.
from Richardson RFPD
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies. [See More]
- Mounting: Tape or adhesive compound
- H: 8.89
from RS Components, Ltd.
Tape attach BGA/LED heatsink, 20.3 C/W [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil
- W: 27
- L: 27
- H: 18
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from Richardson RFPD
Penguin ™ Coolers: Unidirectional Fin Heat Sink for BGAs [See More]
- Mounting: Tape or adhesive compound
- Thermal Resistance: 0.4400
- H: 7.62
from RS Components, Ltd.
Tape attach BGA/LED heatsink, 23.4 C/W [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil
- W: 23
- L: 23
- H: 18
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from Richardson RFPD
The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). [See More]
- Mounting: Tape or adhesive compound
- H: 6.35
from RS Components, Ltd.
Heatsink PGA 9.4K/W ICKPGA15X15 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 37.92
- L: 38
- H: 16.51
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from Richardson RFPD
Omnidirectional Pin Fin Heat Sink for BGAs and PowerPCTM [See More]
- Mounting: Tape or adhesive compound
- H: 11.43
from RS Components, Ltd.
Heatsink PGA 21.79K/W ICKPGA21X21 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 53.3
- L: 53
- H: 16.5
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
HEATSINK LA ICK 17X17 [See More]
- Mounting: Tape or adhesive compound; Conductive Adhesive
- W: 43.1
- L: 43
- H: 20
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
HEATSINK ICK PEN 38 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil
- W: 49.5
- L: 50
- H: 38
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
BGA HEATSINK 23 X 23 [See More]
- Mounting: Tape or adhesive compound; Conductive Adhesive, Conductive Foil
- W: 23
- L: 23
- H: 6
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
BGA HEATSINK 21 X 21 [See More]
- Mounting: Tape or adhesive compound; Conductive Adhesive, Conductive Foil
- W: 21
- L: 21
- H: 6
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
SMD HEATSINK, BL. ANODISED [See More]
- Mounting: Tape or adhesive compound; Conductive Adhesive, Conductive Foil
- W: 6.3
- L: 10
- H: 4.8
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
SMD HEATSINK, BL. ANODISED [See More]
- Mounting: Tape or adhesive compound; Conductive Adhesive, Conductive Foil
- W: 6.3
- L: 13
- H: 4.8
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
PGA HEATSINK 20 X 20 X 12 [See More]
- Mounting: Tape or adhesive compound; Conductive Adhesive, Conductive Foil
- W: 51
- L: 51
- H: 12.3
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK PGA 11x11 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 24.76
- L: 28
- H: 15.24
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK PGA 17x17x8 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 43.1
- L: 43
- H: 8
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK PGA 14x14x14 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 35
- L: 35
- H: 14
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK PGA 17x17x12 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 43.6
- L: 44
- H: 12.3
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK BGA 27x27x22 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 27
- L: 27
- H: 22
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK BGA 14x14x10 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 14
- L: 14
- H: 10
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK BGA 27x27x10 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 27
- L: 27
- H: 10
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK BGA 31x31x10 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 31
- L: 31
- H: 10
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK BGA 35x35x10 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 35
- L: 35
- H: 10
from DigiKey
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Copper
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK BGA 40x40x10 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 40
- L: 40
- H: 10
from DigiKey
Heat Sink Ceramic Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Ceramic
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK LED R 40x27 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- H: 27
- W: 40
- Thermal Resistance: 9.41
from DigiKey
Heat Sink Ceramic Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Ceramic
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK LED R 45,7x16,5 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- H: 16.51
- W: 45.7
- Thermal Resistance: 10.46
from DigiKey
Heat Sink Ceramic Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Ceramic
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK LED R 32x14 G [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- H: 14
- W: 32
- Thermal Resistance: 15.23
from DigiKey
Heat Sink Ceramic Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Ceramic
- Device: Passive Heat Sink
from RS Components, Ltd.
Heatsink ICK S 10x10x12,5 [See More]
- Mounting: Tape or adhesive compound; Adhesive Foil, Conductive Foil
- W: 10
- L: 10
- H: 12.5
from DigiKey
Heat Sink Ceramic Heat Spreader [See More]
- Mounting: Tape or adhesive compound
- Material: Ceramic
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
Ohmite now carries a line of heatsink solutions that are specifically designed for your BGA and PBGA applications. Ohmite's heatsinks provide a low-cost thermal solution for these specific packages in multiple sizes. Our heatsink solutions can be attached to devices with adhesive thermal tape,... [See More]
- Mounting: Tape or adhesive compound
- L: 15 to 45
- Device: Passive Heat Sink
- W: 15 to 42.5