Passive Heat Sink Heat Sinks
Last Updated: January 16, 2025 Reviewed by: Jon Lowy, consulting engineer
Description
A passive heat sink is a device designed to absorb and dissipate heat from electronic components without the use of active cooling mechanisms such as fans or pumps. It typically consists of a metal body with fins that increase the surface area for heat dissipation.
Working Principle
Passive heat sinks operate on the principle of conduction and convection. Heat generated by electronic components is conducted through the metal body of the heat sink. The fins on the heat sink increase the surface area, allowing more heat to be transferred to the surrounding air through natural convection. The greater the contact area with the air, the more efficiently the heat is dissipated. This process helps keep the device's maximum operating temperature below its design limit, thereby enhancing reliability and performance .
Applications
Passive heat sinks are commonly used in applications where noise and mechanical reliability are critical. Specific examples include cooling small transistors or integrated circuits (ICs) on circuit boards. They are also prevalent in environments where airflow is limited or where the physical orientation of the circuit boards restricts the use of active cooling solutions .
Advantages over other Heat Sinks
Passive heat sinks offer several advantages over active cooling solutions. They are generally more cost-effective, reliable, and silent due to the absence of moving parts. For instance, a passive heat sink can provide adequate cooling for small transistors or ICs without the need for additional power-consuming components like fans. This simplicity also translates to fewer points of failure, making passive heat sinks a robust choice for many applications .
Limitations
Despite their advantages, passive heat sinks have limitations. They are less effective in environments with inadequate airflow or where the airflow path is partially blocked. Additionally, they may not be suitable for high-power devices that dissipate tens of watts or more, as they would require large and heavy heat sinks to manage the heat effectively. In such cases, active cooling solutions like forced air systems may be more efficient .
Considerations
When selecting a passive heat sink, several factors should be considered:
- Initial Costs: Passive heat sinks are generally low-cost compared to active cooling solutions.
- Operating Expense: Since they do not require additional power for fans or pumps, operating expenses are minimal.
- Durability: The absence of moving parts enhances durability and reduces the likelihood of mechanical failure.
- Accuracy: Passive heat sinks provide consistent performance, but their effectiveness can be influenced by environmental conditions such as airflow and ambient temperature.
- Replacement and Maintenance Costs: Maintenance is minimal, primarily involving occasional cleaning to ensure optimal airflow around the fins. Replacement costs are also low due to the simplicity and robustness of the design .
from DigiKey
Heat Sink BGA Aluminum [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 12
- Mounting: Clips
- Material: Aluminum
from Rego Electronics Inc.
Copper and aluminum are the two popular NC heat sink materials. Simple to complex manufacturing of many types of custom or prototype heat sinks is our specialty. Heat sinks can be machined from billet or existing extrusion profiles as well as existing forging / die casting / stamping / skived molds. [See More]
- Device: Passive Heat Sink
- Heat sink Fin Style:: Straight
from Sensata Technologies
0.25 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 0.2500
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink Half Brick DC/DC Converter Aluminum Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 10.3
- Mounting: Holes
- Material: Aluminum
from Rego Electronics Inc.
Heat Sink : Forged AL1070 fins with C1100 Base, 60 x 60 x 16 mm. Fan : 50 x 50 x 10mm / 50 x 50 x 20 mm, Two Ball Bearing. Connector Type : 3 ways / 4 ways. Screw & Back Plate : rPGA Socket CPU / BGA Package CPU [See More]
- Device: Passive Heat Sink
- W: 60
- L: 60
- H: 16
from Sensata Technologies
0.36 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 0.3600
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink Half Brick DC/DC Converter Aluminum Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 4.7
- Mounting: Holes
- Material: Aluminum
from Rego Electronics Inc.
Rego offers an extensive range of Die Casting Alumnium Heat Sinks. They are widely used in various cooling applications. These are processed by die casting and pressure casting, good for all types of diodes, SCR's, Thyristor and IGBT. Die Casting Aluminum heat sinks have a high dimensional... [See More]
- Device: Passive Heat Sink
- Heat sink Fin Style:: Straight
from Sensata Technologies
0.5 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 0.5000
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.0W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 18.63
- Mounting: Socket
- Material: Aluminum
from Rego Electronics Inc.
Standard Product : 10 x 6.3 x free ~ 95 x 29 x free (mm). Material & Finish : AL6063 / Anodizing. Features & Benefits -. A full range of sizes, high quality, high reliability, long term supply, customization available. Target Market -. Industrial PC, Point of Sale, Embedded Board, Gaming,... [See More]
- Device: Passive Heat Sink
- W: 19 to 225
- L: 10 to 58
- H: 5 to 29
from Sensata Technologies
0.7 °C/W Thermal resistance. Suitable for 1 or 2 single or dual Solid State Relays. Panel mounting [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 0.7000
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.0W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Material: Aluminum
- Thermal Resistance: 18.63
from Rego Electronics Inc.
Skived fins are produced by precisely shaving a solid block of aluminum or copper to form the fins on top of the starting material. Fins are integral to the base material, so the resistance is not effected by an interface layer such as solder or epoxy. These sinks can also be customized with... [See More]
- Device: Passive Heat Sink
- Heat sink Fin Style:: Straight
from Sensata Technologies
0.7 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 0.7000
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.3W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Material: Aluminum
- Thermal Resistance: 33.28
from Rego Electronics Inc.
Stamped Heat Sinks are constructed with a base and independent fins. Fins are attached to the base using Soldering Technology. They have high fin density which provides increased efficiency for high power applications under forced convection creating greater volumetric surface. Stamped heat sinks... [See More]
- Device: Passive Heat Sink
from Sensata Technologies
1 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. Panel mounting [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 1
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.3W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 33.28
- Mounting: Socket
- Material: Aluminum
from Sensata Technologies
1.0 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. DIN rail or panel mounting [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 1
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.1W @ 75 °C Board Level, Vertical [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 18.34
- Mounting: Socket
- Material: Aluminum
from Sensata Technologies
1.0 °C/W Thermal resistance. Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor. DIN rail or panel mounting [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 1
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.1W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Material: Aluminum
- Thermal Resistance: 18.34
from DigiKey
Heat Sink TO-220 Aluminum 4.7W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 15.83
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.7W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 15.83
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.6W @ 75 °C Board Level, Vertical [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 29.09
- Mounting: Socket
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.6W @ 75 °C Board Level, Vertical [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 28.85
- Mounting: Socket
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.7W @ 75 °C Board Level, Vertical [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 27.78
- Mounting: Socket
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level, Vertical [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 25.92
- Mounting: Socket
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 25.92
- Mounting: Socket
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Material: Aluminum
- Thermal Resistance: 25.92
from DigiKey
Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level, Vertical [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 25.92
- Mounting: Socket
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.2W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 17.74
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 4.2W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 17.74
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 5.1W @ 75 °C Board Level, Vertical [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 14.71
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 5.1W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 14.71
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 26.32
- Mounting: Holes
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.9W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 25.86
- Mounting: Socket
- Material: Aluminum
from DigiKey
Heat Sink TO-220 Aluminum 2.6W @ 75 °C Board Level [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 28.85
- Mounting: Clips
- Material: Aluminum
from Ohmite Manufacturing Co.
Designed for TO-220 devices, the Ohmite CSM series offers multiple configurations. Device attachment is made using standard screws. The CSM series can be ordered in three different profiles and hold up to 3 seperate devices at once. The CSM series from Ohmite has a thermal efficiency down to 9.8... [See More]
- Device: Passive Heat Sink
- W: 10.45 to 14.9
- L: 12 to 50
- H: ? to 31.2
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Mi-Tech Metals
Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of... [See More]
- Device: Passive Heat Sink
- Thermal Resistance: 0.5290
- Mounting: Direct Mounting
- Material: Copper; Mixed; Copper and Tungsten
from Cooliance
Custom heat pipes. Cooliance offers a wide range of heat pipes. The path, length and width of heat pipes vary from application to application so most heat pipes are custom designed. Cooliance can integrate heat pipes with remote cool plates or heat sinks. Embedded heat pipes. Heat pipes offer an... [See More]
- Device: Passive Heat Sink
- Material: Aluminum (optional feature); Copper (optional feature)
- Heat sink Fin Style:: Heat Pipes
from Airflow/Y.S. Tech, Inc.
YS Tech knows that time is always a factor in development cycles. We pride ourselves on being very responsive to our customers ’ needs, with the ability to keep the design and engineering process moving quickly for fast manufacturing turnarounds. We can take your project from the design stage... [See More]
- Device: Passive Heat Sink
- Heat sink Fin Style:: Straight
- L: 19 to 482
- Material: Aluminum; Copper
from Applied Diamond, Inc.
Applied Diamond can build heat spreaders for the most extreme possibilities. As a material, diamond has no peer as a semiconductor medium. The unsurpassed thermal conductivity of diamond and its high electrical resistivity allow for better performance across virtually all measures of... [See More]
- Device: Passive Heat Sink
- W: 1.5 to 30
- L: 2 to 30
- H: 0.1000 to 0.5000
from CoorsTek
Ceramic microelectronic components are used in active and passive devices that enable high-performance electronics to be used in all kinds of environments and applications — in aerospace, automotive, communications, computers, medical, and a large variety of electronic instruments, industrial... [See More]
- Device: Passive Heat Sink
- Material: Ceramic
from Wanbang Technology (Guangdong Dongguan) Co., LTD.
The traditional copper water-cooled plates are brazed or buried copper tubes, the processing technology is complicated, the contact thermal resistance is large, and the cost is high: Wanbang uses friction stir welding to weld copper water-cooled plates. Low production cost, simple process structure,... [See More]
- Device: Passive Heat Sink
from Boyd
The Aavid Max Clip ™ System is a high performance, low cost thermal solution for discrete power semiconductors. This thermal system combines Aavid ’s Max Clips with specialized extruded Max Clip Heat Sinks to provide optimized thermal contact. The system eliminates the need for mounting... [See More]
- Device: Passive Heat Sink
- W: 6 to 41.91
- L: 16 to 37
- H: 5.1 to 48
from Ecopower Inc.
ThermaCool ™ Heat Sinks have been sized for each of our standard products and to accommodate a range of desired operating conditions. Proper heat sink sizing is determined by a number of factors, including those listed below: Power Dissipated (Watts) - Determined by the light engine part... [See More]
- Device: Passive Heat Sink
- H: 0.0381
- W: 0.0635
- Heat sink Fin Style:: Straight
from Ohmite Manufacturing Co.
Custom Extrusion Heatsinks. The Ohmite AH series of aluminum extrusion heatsinks can be produced to customer requirements. Ohmite offers 34 different extrusion profiles. Each one can be modified with holes, bolt patterns, and finishes. Thermal performance of 0.6 °C/W is achieved in certain... [See More]
- Device: Passive Heat Sink
- H: 9.65 to 60.71
- W: 19.05 to 311
- Thermal Resistance: 0.6000 to 8
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Cooliance
Custom Heatsinks. Cooliance excels in developing and manufacturing custom heat sinks and more than 50% of the heat sinks we provide to our OEM customers are custom. Our expert thermal engineers are ready to assist you with your most challenging thermal management problems. Tell us about your thermal... [See More]
- Device: Passive Heat Sink
- Material: Aluminum (optional feature); Copper (optional feature)
from CoorsTek
Ceramic microelectronic components are used in active and passive devices that enable high-performance electronics to be used in all kinds of environments and applications — in aerospace, automotive, communications, computers, medical, and a large variety of electronic instruments, industrial... [See More]
- Device: Passive Heat Sink
- Material: Aluminum Nitride
from Wanbang Technology (Guangdong Dongguan) Co., LTD.
The friction casting of the die-casting part solves the short board which cannot be welded by the material, and effectively solves the problem of high difficulty in opening the mold of the super large-scale die-casting product. The welding of the aluminum alloy and the die-casting part solves the... [See More]
- Device: Passive Heat Sink
from Boyd
Aavid offers thousands of heat sink options for cooling semiconductor packages and other devices for use on printed circuit boards (PCBs). Available in a variety of shapes, sizes, profiles, fabrications, and mountings, Aavid offers the widest selection of board level cooling solutions. Standard... [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
Ohmite introduces the powerful B60/ C60 series heatsink with cam clip (Pat. Pending) or custom mounting. The B60/C60 series offers flexibility, high performance, and a compact heat sink design with exchangeable cam clip system for TO-247 and TO-264 devices. The B60 series can be tapped for popular... [See More]
- Device: Passive Heat Sink
- W: 69.5 to 70.7
- L: 75
- H: 41
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Cooliance
Cooliance's precision forging capabilities allow for a variety of standard elliptical fins ranging from 160 x 160mm with max fin height of 50mm. The elliptical wing shape is superior to an equivalent extruded straight fin heatsink as the wing shape acts to break up and fully leverage existing air... [See More]
- Device: Passive Heat Sink
- W: 19 to 160
- L: 19 to 160
- H: 12 to 50
from Wanbang Technology (Guangdong Dongguan) Co., LTD.
Friction stir welding is a solid welding method that achieves welding. Under the action of pressure, under the action of constant or increasing pressure and torque, the relative motion between the welding contact end faces generates frictional heat and deformation heat in the friction surface and... [See More]
- Device: Passive Heat Sink
from Boyd
Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves. This type of heat sink fabrication allows for higher fin densities and fin aspect ratios which greatly improve thermal performance due to the increased surface area. Bonded fin types can be... [See More]
- Device: Passive Heat Sink
- Material: Aluminum; Copper; Stainless Steel, Inconel
- Heat sink Fin Style:: Bonded
from Ohmite Manufacturing Co.
Clip Mounting For TO-247 and TO-264 Devices. Modular System with choice of clips. Multiple devices on a single extrusion. Alternate extrusion lengths available. Designed to mount 40X40 fan to provide forced convection. Complete system can be built to customer specifications. [See More]
- Device: Passive Heat Sink
- W: 32
- L: 58
- H: 46.3
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Cooliance
The Cooliance High Power Coolstrate ® Active LED Coolers and Passive LED Coolers that are detailed on this page are shipped without any mounting holes. This permits the LED Coolers to be used in applications that are not pre-defined. [See More]
- Device: Passive Heat Sink
- H: 50 to 150
- W: 40 to 200
- Thermal Resistance: 0.3000 to 3.7
from Wanbang Technology (Guangdong Dongguan) Co., LTD.
We provide OEM CNC machined heat sink, modest price, short lead time and good quality. [See More]
- Device: Passive Heat Sink; Vapor Cooler; Cold Plate
- Mounting: Holes
- Heat sink Fin Style:: Round; Elliptical; Straight; Machined
- Material: Aluminum
from Boyd
A type of bonded fin heat sink, brazed heat sinks offer greater structural integrity and thermal performance than epoxied bonded fins. Aavid offers a number of brazing capabilities including CAB and Vacuum. The Aavid portfolio of standard and custom heat sinks is the broadest and widest in the world... [See More]
- Device: Passive Heat Sink
- Heat sink Fin Style:: Bonded
from Ohmite Manufacturing Co.
Ohmite ’s R2 Series (patent pending) heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the clip assure secure attachment and enhanced thermal performance. Because no screws are... [See More]
- Device: Passive Heat Sink
- W: 22
- L: 35
- H: 38
from SECO
COM Express Type 6 - COMe-B75-CT6 Heat Spreader (PASSIVE) - Packaged [See More]
- Device: Passive Heat Sink
from Cooliance
Cooliance offers a selection of standard pin fin heatsinks. These are particularly suitable for applications where the air flow is from the top. Cooliance offers precision forged pin fin heatsinks that come in both active and passive versions. They can be forged in either aluminum or copper. [See More]
- Device: Passive Heat Sink
- W: 19 to 49
- L: 19 to 49
- H: 12 to 33
from Wanbang Technology (Guangdong Dongguan) Co., LTD.
Although the friction stir welding technology is very short in the automobile industry, it has entered the stage of industrial application. Wanbang has made a lot of fruitful work in the friction stir welding process and the development of the mixing head, and has achieved many key technological... [See More]
- Device: Passive Heat Sink
from Boyd
High Pressure Die Casting is a cost effective option for high volume solutions required to be light weight and superior cosmetic surface quality. Die Cast heat sinks come out in near net shape and require little to no additional assembly and can range in complexity. Die cast heat sinks are popular... [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
These surfacemount heatsinks are extruded not stamped. This extruded designs are far more efficient than any stamped counterpart. One of the main issues is getting heat from the board level into the heatsink. The extrusion allow for large pads and a direct thermal path from the board and into the... [See More]
- Device: Passive Heat Sink
- W: 25.9 to 40.2
- L: 13
- H: 10.16 to 12.1
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Cooliance
Cooliance offers a wide variety of standard radial fin options ranging in diameter from .5" to 3" and from 1 to 7 fins. Radial fin heatsinks do not require any specific orientation. Our Smart-CLIP ™ attach mechanism allows the fins to extend beyond the dimensions of the chip package without... [See More]
- Device: Passive Heat Sink
- H: 6.35 to 19.94
- W: 34.92 to 50.8
- Heat sink Fin Style:: Radial Fin
from Wanbang Technology (Guangdong Dongguan) Co., LTD.
The skived fin heat sink is a radiator made by the skived process,which is used to make the radiator for the heat dissipation of the high-power parts. Because it has one-time forming, the heat dissipation performance of the profile is not lost, and the original heat dissipation performance of the... [See More]
- Device: Passive Heat Sink
from Boyd
Patented encapsulated Annealed Pyrolytic Graphite technology that has three times the conductivity of copper with the mass of aluminum. Annealed Pyroloytic Graphite provides a high conduction path. Encapsulant sets the CTE and structural properties. Encapsulant material is selected to satisfy... [See More]
- Device: Passive Heat Sink
- Material: Annealed Pyroloytic Graphite
from Ohmite Manufacturing Co.
TO-220, TO-247 Multiple Device Heatsink. Matrix clip system for TO-247 and TO-264 packages. Maximum Repeatability; Constant spring force over repeated assembly/disassembly. Mount up to 4 devices per heatsink. Black anodized or degreased finish. For TBH, TCH, and TEH series [See More]
- Device: Passive Heat Sink
- W: 38.6 to 43.5
- L: 27 to 55
- H: 34.1 to 55.8
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Cooliance
Cooliance offers a variety of standard forged straight fin heatsinks that come in numerous base dimensions with a max height of 15mm. [See More]
- Device: Passive Heat Sink
- W: 18.5 to 44.5
- L: 19 to 45
- H: 6.3 to 12.7
from Wanbang Technology (Guangdong Dongguan) Co., LTD.
Wanbang technology relies on 20 years of precision manufacturing of aluminum products, military supporting projects, customized cooling modules, Haier, Midea's cold-conducting heat transfer project development, vacuum phase change all-aluminum uniform temperature plate and other practices, and... [See More]
- Device: Passive Heat Sink
from Boyd
Extruded aluminum is one of the most popular and cost efficient heat sink fabrication methods. Aavid maintains the world's largest portfolio of extruded heat sink profiles with over 5,000 tooled shapes. Aavid extruded heat sink profiles range from simple flat back fin structures to complex... [See More]
- Device: Passive Heat Sink
- Material: Aluminum
- W: 100 to 700
from Ohmite Manufacturing Co.
Ohmite introduces the CR series heatsink with cam clip (Pat. Pending). The CR series offers flexibility, high performance, and is comparable to popular Aavid MAX-clip heatsinks. The cam clip system for TO-247 and TO-264 devices is proprietary and provides tool or fixture free assembly. The CR series... [See More]
- Device: Passive Heat Sink
- W: 26.92 to 39.88
- L: 25 to 75
- H: 50.04 to 74.93
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Wanbang Technology (Guangdong Dongguan) Co., LTD.
The thermal design and thermal management of Wanbang Technology has rich experience in water cooling system research and water-cooled plate production, friction stir welding technology, low production cost, zero contact thermal resistance, high integration design intensity, and full-scale liquid... [See More]
- Device: Passive Heat Sink
from Boyd
The Aavid portfolio of folded fins includes over 3,000 different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat sinks and other fabrications. These fins can be purchased separately, bonded or brazed as part... [See More]
- Device: Passive Heat Sink
- Heat sink Fin Style:: Folded
- H: 0.7600 to 50.8
- Material: Aluminum; Copper; Mixed; Cupro Nickel, Inconel, Nickel Alloys, Stainless Steel
from Ohmite Manufacturing Co.
Ohmite now carries a line of heatsink solutions that are specifically designed for your BGA and PBGA applications. Ohmite's heatsinks provide a low-cost thermal solution for these specific packages in multiple sizes. Our heatsink solutions can be attached to devices with adhesive thermal tape,... [See More]
- Device: Passive Heat Sink
- W: 15 to 42.5
- L: 15 to 45
- H: 7.5 to 17.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Boyd
Aavid has one of the largest portfolios of standard LED cooling solutions in the industry. For use in a wide range of applications including downlights, spotlights, wall packs, and more, these extruded aluminum LED heat sinks can be used on their own for a passive solution or in conjunction with a... [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
Ohmite introduces the C2 series heatsink with cam clip (Pat. Pending). The C2 series design offers a lower profile while still maintaining a great surface area adding to the thermal performance. The clip system for TO-247 and similar devices is proprietary and provides tool and fixture free... [See More]
- Device: Passive Heat Sink
- W: 46.3
- L: 42
- H: 32
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Boyd
kived fin heat sinks offer highly optimized cooling as they allow for higher fin densities but do not have an interface joint where heat transfer could be impeded. Unlike bonded or brazed Heat Sinks, Skived Heat Sinks are constructed from a single piece of material and therefore have no thermal... [See More]
- Device: Passive Heat Sink
- H: 10 to 60
- L: 150 to 200
- Heat sink Fin Style:: Skived
from Ohmite Manufacturing Co.
If you are using popular IXYS devices or the Ohmite CS10 series, look no further than the VR series extruded heatsinks to complete your design. Each heatsink is designed with a cam clips system ( Pat Pend) for these popular device types. The VR series also accomodates TO-220 and TO-247 devices. [See More]
- Device: Passive Heat Sink
- W: 33.9
- L: 27 to 55
- H: 39.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Boyd
For high volume production, Aavid zipper fins are the most cost efficient method for high fin density heat sinks. These fins are made from a stamped material, typically aluminum or copper, and are folded into shape with interlocking grooves. The fins are then typically soldered, brazed, or epoxied... [See More]
- Device: Passive Heat Sink
- Material: Aluminum; Copper
- Heat sink Fin Style:: Zipper
from Ohmite Manufacturing Co.
If you are using popular SOT-227 devices or the Ohmite TGHE series, look no further than the VX series extruded heatsinks to complete your design. Each heatsink is drilled and tapped to the standard pattern for these popular device types. Remove the guess work involved for heatsink selection by... [See More]
- Device: Passive Heat Sink
- W: 48.7
- L: 35 to 55
- H: 30
from SECO
Q7 - Q7-B03 Heat Sink (PASSIVE) for Atom E39xx CPUs Packaged [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
Ohmite introduces the SV-LED Series. The SV series is a high performance, low cost, configurable, scalable, and compact heatsink for LED modules. This powerful high aspect ratio heatsink comes in two standard heights. Each SV series heatsink can be configured to customer specifications. Customers... [See More]
- Device: Passive Heat Sink
- H: 14 to 25
- W: 21.6
- Weight: 6.5 to 11.6
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
The Ohmite E series is offered in multiple extrusion lengths and is black anodized to provide great thermal performance in natural convection applications. This extrusion form can be used for TO-220, TO-218 and TO-247 devices and provides a thermal resistance as low as 3 °C/W. For use with... [See More]
- Device: Passive Heat Sink
- W: 25
- L: 25
- H: 25.4 to 63.55
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
Heatsink for TO-220 Devices. Compatible with TO-220 devices. Thermal resistance as low as 7.4 °C/W. Available in multiple heights. Black Anodized and degreased versions. For TBH, and TCH series [See More]
- Device: Passive Heat Sink
- W: 12.7
- L: 35
- H: 38.1 to 63.5
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
The unique design (patent pending) of the W Series heat sinks combines a tin plated, solderable, integral spring clip with an extruded aluminum heat sink body for an all-in-one solution to through-hole mounting of TO-220, TO-247, and TO-264 packages. These self-aligning heat sinks feature solderable... [See More]
- Device: Passive Heat Sink
- W: 16
- L: 18 to 23
- H: 30.48 to 40.64
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
Ohmite S Series LED Heatsinks are low cost and easy assembly heat sinks for Star LED packages supplied by Cree, Lumileds, Osram and others. This simple heat sink can hold LED modules and can be mounted simply with some thread forming screws. The Ohmite S series heatsink has two types of surface... [See More]
- Device: Passive Heat Sink
- H: 12.7
- W: 69.8
- Weight: 35 to 210
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
C Series For TO Package Heatsinks. No tool, camming clip system. Compatible with TO-264, TO-247,TO-220 and TO-126 Devices. Mount up to 3 devices per heatsink. Spring Clip delivers constant repeatable pressure. For TBH, TCH, TEH, and TFH series [See More]
- Device: Passive Heat Sink
- W: 19.6 to 19.94
- L: 25 to 75
- H: 32.5 to 38
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from Ohmite Manufacturing Co.
Ohmite introduces this new versatile heatsink design. This new design can accommodate several different industry packages. This design also lets the customer choose a mounting style using screws or clips for secure mounting to the heatsink. These one of a kind heatsinks are offered in a vertical... [See More]
- Device: Passive Heat Sink
- Weight: 42
- L: 39
- Mounting: Holes; Horizontal and Vertical Mount
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink
from SECO
Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed... [See More]
- Device: Passive Heat Sink