Wafer Planarization / CMP Honing, Lapping, and Super-finishing Machines

2 Results
Wafer Planarization Machinery -- CMP 612 - Image
Wafer Planarization Machinery -- CMP 612
from Precision Surfacing Solutions

4 ” - 12 ” Wafer Diameter Capacity. Process up to two (2) wafers simultaneously or choose insitu pad conditioning. Compact, space-efficient systems. True CMP processing without a CMP system price. Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate... [See More]

  • Type: Wafer / CMP
  • Rotary Speed: 20 to 120
  • Mounting: Floor
  • Surface Speed: 0.0 to 1.97
Wafer Planarization Machinery -- CMP 712 - Image
Wafer Planarization Machinery -- CMP 712
from Precision Surfacing Solutions

4 ” - 12 ” Wafer Diameter Capacity. Process up to two (2) wafers simultaneously or choose insitu pad conditioning. Compact, space-efficient systems. True CMP processing without a CMP system price. Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate... [See More]

  • Type: Wafer / CMP
  • Rotary Speed: 20 to 120
  • Mounting: Floor
  • Surface Speed: 0.0 to 1.97