Electrical Insulation / Dielectric Material Rubber Adhesives and Sealants
from Master Bond, Inc.
Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System UV15-7SP4 is a new one component, optically clear, toughened UV and/or curable polymer system with extended service capability of -80 °F to +250 °F. It is 100% reactive, does not contain any solvents or other volatiles and does not embrittle even upon exposure to... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be used for bonding, sealing, coating and casting. Master Bond UV15X-5 offers... [See More]
- Features: Flexible; High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high performance seals and gaskets. The UV21 is a solvent free system and has an excellent six month shelf life at ambient... [See More]
- Features: Flexible; High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Contact or Pressure Sensitive Adhesives; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond UV15FL is a new one component, high strength, low viscosity, flexible UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Wacker Chemical Corp.
ELASTOSIL ® N198 BLACK US is a non-slump, RTV-1 oxime cure silicone rubber that cures on contact with moisture in the air. Special features. Neutral cure. Solvent-free. Primerless adhesion to most substrates. Available in Black or Gray. Application. ELASTOSIL ® N198 BLACK US is intended for... [See More]
- Features: High Dielectric
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Industry: Electronics
from Epoxies Etc...
20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Novagard Solutions
Non-corrosive, single component silicone coating [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; UV or Radiation Cured (optional feature); Single Component; Reactive or Moisture Cured (optional feature); Room Temperature Vulcanizing or Curing
from Techsil Limited
Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]
- Features: High Dielectric; Thermally Conductive
- Industry: Electronics
- Chemical System: Silicone
from Techsil Limited
TSE3221S is a heat curable translucent silicone adhesive designed for sealing and coating applications. This grade adheres well to a variety of substrates such as metals, plastics, ceramic and glass without the use of a primer. Potential applications include sealing and coating for hybrid Ics,... [See More]
- Features: High Dielectric
- Industry: Electronics
- Chemical System: Silicone