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Supplier: ARM Inc.
Description: data. TrustZone Internal Memory Wrapper (PL141) can partition a single larger on-chip RAM into Secure and Non-Secure) Worlds TrustZone off-chip memory TrustZone RAM - in DDR memory - typically 256K-1M for decrypted/checked code. Off-chip memory
- Type: Memory
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Supplier: Win Source Electronics
Description: Manufacturer: Microchip Technology Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1104581-WE-512K8-150 CC Packaging: Bulk Mounting: SMD (SMT) Operating Supply Voltage: 5 V Categories: EEPROM Case / Package: CDIP
- IC Package Type: DIP, Other
- Memory Category: EEPROM
- Operating Temperature: 0.0 C
- Supply Voltage: Other
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1254098-SMV512K32HFG Category: Integrated Circuits (ICs)>Memory Package: Bulk Standard Package: 1 Mounting: SMD (SMT) Technology: SRAM Memory Type: Volatile Memory Size: 16Mb (512K x 32) Access Time: 20 ns Voltage - Supply: 1
- Access Time: 20 ns
- Cycle Time: 20 ns
- Memory Category: SRAM, Other
- Operating Temperature: -55 to 125 C
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Supplier: Win Source Electronics
Description: Manufacturer: STMicroelectronics Win Source Part Number: 072807-M27W512-100K6 TR Packaging: Reel - TR Mounting: SMD (SMT) Technology: EPROM - OTP Memory Size: 512Kb (64K x 8) Access Time: 100ns Categories: Integrated Circuits Status: Obsolete
- Access Time: 100 ns
- IC Package Type: PLCC, Other
- Memory Category: EPROM, Other
- Operating Temperature: -40 to 85 C
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Supplier: Win Source Electronics
Description: Manufacturer: STMicroelectronics Win Source Part Number: 130076-M27W512-100K6 Packaging: Tube/Rail Mounting: SMD (SMT) Technology: EPROM - OTP Memory Size: 512Kb (64K x 8) Access Time: 100ns Categories: Integrated Circuits Status: Obsolete
- Access Time: 100 ns
- IC Package Type: PLCC, Other
- Memory Category: EPROM, Other
- Operating Temperature: -40 to 85 C
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Supplier: TT Semiconductor, Inc.
Description: TT Semiconductor is the leading manufacturer of electronic components designed to survive under extreme temperature ranges and harsh environmental conditions. The current standard product offering is focused on high performance analog and memory devices. TT
- Density: 512000 kbits
- IC Package Type: SOIC, DIP, Other
- Memory Category: Flash
- Operating Temperature: -55 to 175 C
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Supplier: Quarktwin Technology Ltd.
Description: EEPROM Memory IC 512Kbit I²C 400 kHz 900 ns Die
- Access Time: 900 ns
- Density: 512 kbits
- IC Package Type: Other
- Memory Category: EEPROM, Other
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Supplier: Quarktwin Technology Ltd.
Description: Memory IC
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Supplier: DigiKey
Description: SRAM Memory IC 16Mb (512K x 32) Parallel 20ns 76-CFP (45.72x51.31)
- Density: 16000 kbits
- IC Package Type: Other
- Memory Category: SRAM
- Operating Temperature: -55 to 125 C
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Supplier: Lingto Electronic Limited
Description: IC 512 MB FLASH MEMORY
- Density: 512000 kbits
- Memory Category: Flash, Other
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Supplier: ODG (Origin Data Global)
Description: IC 512 MB FLASH MEMORY
- Density: 512000 kbits
- IC Package Type: Other
- Operating Temperature: -40 to 105 C
- Supply Voltage: Other
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Supplier: Acme Chip Technology Co., Limited
Description: MEMORY
- Cycle Time: 70 ns
- Density: 8000 kbits
- IC Package Type: Other
- Memory Category: SRAM, Other
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Supplier: Quarktwin Technology Ltd.
Description: SRAM Memory IC 16Mbit Parallel 20 ns 76-CFP (45.72x51.31)
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Description: IC 512 MB FLASH MEMORY
- Data Rate: 133 MHz
- Density: 512000 kbits
- IC Package Type: BGA
- Memory Category: Flash, Other
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Supplier: VAST STOCK CO., LIMITED
Description: DRAM 8G 1.35V 512Mx16 933MHz DDR3 -40-95C
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Supplier: DigiKey
Description: FLASH Memory IC 512Kb (64K x 8) SPI 100MHz 8-TSSOP
- IC Package Type: TSSOP, Other
- Operating Temperature: -40 to 105 C
- Supply Voltage: Other
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Supplier: LCSC Electronics Technology (HK) Limited
Description: 512Kbit I2C SOP-8 EEPROM ROHS
- Density: 512 kbits
- IC Package Type: SOP
- Memory Category: EEPROM
- Supply Voltage: Other
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Supplier: Lingto Electronic Limited
Description: IC NVSRAM 512KBIT SPI 16SOIC
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Supplier: ODG (Origin Data Global)
Description: IC SRAM 512KBIT SPI/DUAL 8DIP
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Supplier: Acme Chip Technology Co., Limited
Description: IC FLASH 512MBIT SPI 8WSON
- Density: 512000 kbits
- IC Package Type: Other
- Supply Voltage: Other
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Supplier: Accuris
Description: MICROCIRCUIT, MEMORY, DIGITAL, CMOS/SOI, 512K X 32-BIT (16M), RADIATION-HARDENED, LOW VOLTAGE SRAM, MULTI-CHIP MODULE
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Supplier: Microchip Technology, Inc.
Description: The Microchip AT25512 is a 512 Kb Serial EEPROM utilizing the industry standard Serial Peripheral Interface (SPI) compatible serial bus. The device is organized as one block of 64K x 8-bit and is optimized for use in consumer electronics, industrial, medical, and automotive
- Data Rate: 20 MHz
- Density: 512 kbits
- Endurance: 1.00E6 Write/Erase Cycles
- IC Package Type: SOIC, SSOP, Other
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Supplier: ODG (Origin Data Global)
Description: 512Kbit DIP-8 EEPROM ROHS
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Supplier: LCSC Electronics Technology (HK) Limited
Description: 2.7V~3.6V 50MHz 512Mbit LGA-8(6x8) NAND FLASH ROHS
- Density: 512000 kbits
- Operating Temperature: -25 to 85 C
- Supply Voltage: Other
- Technology: NAND
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Description: IC SRAM 512KBIT SPI/QUAD 8DIP
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Supplier: Radwell International
Description: MEMORY BOARD, 512MB. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Lingto Electronic Limited
Description: 8G, DDR3L, 512M X 16, 1.35V, 96
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Supplier: Infineon Technologies AG
Description: Home // Products // Memories // Radiation hardened and high-reliability memories // Defense Memories // S25FL512SAGBHEC10
- Density: 512000 kbits
- IC Package Type: Other
- Operating Temperature: -55 to 125 C
- Supply Voltage: 2.7 V, 3 V, 3.6 V, Other
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Supplier: Rochester Electronics
Description: S25FS512S - 512-Mbit MIRRORBIT Flash Memory
- IC Package Type: Other
- Memory Category: Flash
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Supplier: Karl Kruse GmbH & Co. KG
Description: Karl Kruse is a worldwide leading franchised distributor (ISO: 9001-2008 certified). A service provider specializing in the supply and material management of electronic components, since 1951. We are an innovative company who is dedicated to collaborating with customers and partners to develop and
- IC Package Type: Other
- Memory Category: SRAM
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Supplier: Utmel Electronic Limited
Description: MICROCHIP - SST25VF512A-33-4C-SA E - FLASH MEMORY, 512 KBIT, 33 MHZ, 8-SOIC
- Access Time: 12 ns
- Cycle Time: 20000 ns
- Density: 4096 kbits
- Endurance: 100000 Write/Erase Cycles
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Supplier: TT Semiconductor, Inc.
Description: TT Memories is a division of Twilight Technology formed to support the memory marketplace from legacy technologies to state-of-the-art technologies. TT Memories manufactures devices and modules for the Commercial, Industrial, Aerospace, and Defense marketplaces. TT
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Supplier: Microchip Technology, Inc.
Description: controlled through a Chip Select (CS) input. Additionally, SDI (Serial Dual Interface) and SQI (Serial Quad Interface) is supported if your application needs faster data rates. This device also supports unlimited reads and writes to the memory array. The 23A512/23LC512 is
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The MT53D512M32D2DS-053 WT:D is a 16Gb (2GB) LPDDR4 memory device designed for next-generation high-performance, power-sensitive applications. Featuring dual-channel architecture (x32 bus width) and data rates up to 4266 Mbps, it ensures efficient real (read more)
Browse Memory Chips Datasheets for Win Source Electronics -
Memory: 256 x 8 EEPROM configuration for efficient small-scale data storage. Single Wire Interface: Simplifies circuit design and reduces connectivity complexity. Compact Package Design: 4-CSP (Chip Scale Package) ensures minimal footprint, ideal (read more)
Browse EEPROM Datasheets for Nova Technology(HK) Co.,Ltd -
End™, and Application Specific Power Drivers™ to form the most compact microcontroller-based power and general purpose application systems. The product's microcontroller features up to 128kB of embedded FLASH and 32kB of SRAM memory, a high-speed 12-bit 2.5MSPS analog-to-digital converter (read more)
Browse Motor Controllers Datasheets for Qorvo -
End™, and Application Specific Power Drivers™ to form the most compact microcontroller-based power and general purpose application systems. The product's microcontroller features up to 32kB of embedded FLASH and 8kB of SRAM memory, a high-speed 10-bit, 1 MSPS analog (read more)
Browse Motor Controllers Datasheets for Qorvo -
. The product's microcontroller features up to 32kB of embedded FLASH and 8kB of SRAM memory, a high-speed 10-bit, 1 MSPS analog-to-digital converter (ADC) with dual auto-sampling sequencers, 5V/3.3V I/Os, flexible clock sources, timers, a versatile 12-channel PWM engine, and several serial interfaces. (read more)
Browse Motor Controllers Datasheets for Qorvo -
End™, and Application Specific Power Drivers™ to form the most compact microcontroller-based power and general purpose application systems. The product's microcontroller features up to 32 kB of embedded FLASH and 8 kB of SRAM memory, a high-speed 10-bit 1µs analog-to-digital converter (read more)
Browse Motor Controllers Datasheets for Qorvo -
-based motor control and drive SOC supporting a wide range of general purpose applications where cost and space are key. The product's microcontroller features up to 32kB of embedded FLASH and 8kB of SRAM memory, a high-speed 10-bit 1µs analog-to-digital converter (ADC) with dual auto-sampling sequencers, 5V/3.3V I/Os, flexible clock sources, timers, a versatile 14-channel PWM engine, and several serial interfaces. (read more)
Browse Motor Controllers Datasheets for Qorvo -
-based motor control and drive SOC supporting a wide range of general purpose applications where cost and space are key. The product's microcontroller features up to 32kB of embedded FLASH and 8kB of SRAM memory, a high-speed 10-bit 1µs analog-to-digital converter (ADC) with dual auto-sampling sequencers, 5V/3.3V I/Os, flexible clock sources, timers, a versatile 14-channel PWM engine, and several serial interfaces. (read more)
Browse System on a Chip (SoC) Datasheets for Qorvo -
improve heat transfer across component-to-heatsink interfaces. With thermal conductivity up to **45.0 W/m·K**, CSF45 helps dissipate heat from devices such as **5G base station RRUs, chips, memory modules, control boards, relays, shunts, and hard drives**. Its high compressibility (read more)
Browse Carbon, Graphite, and Diamond Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
to 128kB of embedded FLASH and 32kB of SRAM memory, a high-speed 12-bit 2.5MSPS analog-to-digital converter (ADC) with dual auto-sampling sequencers, 3.3V I/Os, flexible clock sources, timers, a versatile 15-channel PWM engine, and several serial interfaces. (read more)
Browse Motor Controllers Datasheets for Qorvo
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Falcon Flex-a new F-16 business practice
It was less expensive to use readily available 1,024K memory chips than the older technology, more costly 512K memory chips .
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Software-implemented EDAC protection against SEUs
This section analyzes several possible implementations of a 512K 8 memory chip .
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A single transistor EEPROM cell and its implementation in a 512K CMOS EEPROM
This paper describesan electrically programma- ble and erasablenonvolatile memory cell employ- ing a single floating gate transistor(l), and its implementationin a 512K CMOS EEPROM memory chip .
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Reconfigurable molecular dynamics simulator
Three ad- ditional 512K ×32 memory chips would be needed for the LJFC lookup table for each pipeline and the remaining mem- ory would be internal to the FPGAs.
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G5 harddisks and PCI-X - MacRumors Forums
The thing that coul really boost speeds in Gobi is the increase of the L2 cache which will provide 512K more memory for the chip to access at the processor clock rate.
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CR4 - Thread: Laptop Sreensaver Problem
I've turned off a lot of bells and whistles on my Toshiba Satellite w/Vista snf 2Meg memory / Intel Centrino Duo to speed it up to match my XP desktop with 512K memory and a Pentium chip .
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Variation-aware and adaptive-latency accesses for reliable low voltage caches
In this paper, our experiment data and observation is obtained by the measurement of a ULV 512K -bit embedded memory chip [9].
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An FPGA-based implementation of AMB controller for MSFW
An ESA Leon2 memory controller is attached to LEON3 processor through AMBA AHB bus, which manage two chip of 1M×16bit Flash memory and two chip of 512K ×16bit SRAM.
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EUROPRACTICE-MCM: a European initiative to create an MCM infrastructure and to stimulate commercial MCM take-up
The memory is assembled as six 512K chips on the MCM-L substrate.
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New Products
It requires 512K memory and an 8087 coprocessor chip (80287 on the AT).