Flip Chip Substrate

Description: This is a semiconductor chip with a size that is more than 80% of the finished part. It is called FCCSP (Flip Chip CSP) as flip chip bumps are used. It is mainly used for the AP (Application Processor) chips of mobile IT devices. General Features High

• Mounting: SMT

Description: The product is a high-integration package substrate that is used to connect a high-integration semiconductor chip to a main board. This is a high-integration package substrate developed by connecting a semiconductor chip and a package substrate by using flip

• Mounting: SMT

Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D

• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Bubble-free packaging Introduction Flip-Chip Flux WS-580 is a NIA halogen-free water washable flip-chip dipping flux which has an activator system powerful enough to promote wetting on the most demanding substrate metallizations.

• Features: Other
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both

• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: DESCRIPTION This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and

Description: This document provides users of underfill material with guidance in selecting and evaluating underfill material. Underfill material is used to increase reliability of electronic devices by two methods: alleviate CTE mismatch (between the electronic package and the assembly substrate) and/or

Description: DESCRIPTION Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and

Description: LOCTITE ECCOBOND NCP 5208 is a non-conductive paste for thermal compression bonding processes in flip chip to laminate assembly. It is designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the substrate and provide fluxing

• Industry: Electronics

Description: (Known as Hysol FP0114 ) LOCTITE ECCOBOND FP0114 is a low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. It has excellent wettability and adhesion to the typical surfaces encountered in flip chip applications. It can

• Coeff. of Thermal Expansion (CTE): 18.333333333333332 µin/in-F
• Viscosity: 5,000 cP
• Industry: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound

Description: is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Description: is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Description: LUXEON FlipChip UV is the smallest and highest power density (W/cm2) ultraviolet chip-scale package LED that can be reflowed onto a substrate with a standard surface mount (SMT) equipment and process. LUXEON FlipChip UV LED enables tighter beam control and completely eliminates wire

• Peak Wavelength: 380 to 400 nm
• Forward Current: 500 milliamps
• Lens Type: Flat Lens
• LED Type: Ultraviolet

Description: A one-component capillary underfill protects chip packages on PCBs, with high Tg and low CTE to shield solder joints from stress. Product Overview ALPHA HiTech CU11-3127 is a high filler content product designed to provide enhanced mechanical strength for CSP and Flip Chip

• Industry: Electronics, Semiconductors / IC Packaging

Description: Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. This material exhibits ultra low

• Industry: Electronics
• Chemical System: Epoxy

Description: or flip chip assemblies, making them ideal for portable, wireless, compact and high performance end products. These include pure resistor networks, resistor capacitor diode networks with transistor/mosfet arrays, Schottky diodes, network terminations including customized circuits with

• Pin Count: 20
• Number of Devices in Package: 1
• Operating Temperature: -40 to 85 C
• Features: 2^nd Order, On-Chip ESD Protection, Other

Description: The EnerChip is the world’s first solid state thin film battery created on a silicon substrate. The CBC005-BDC can be placed directly on a PCB or inside a packaged part with other integrated circuits. It can be attached using standard wire bonds or solder bumps for flip chip

• Voltage: 3.8 volts
• Capacity, Amp Hours (AH): 0.000005 ampere-hr
• Operating Temperature: -4 to 158 F
• Features: Other, Rechargeable (Secondary) Batteries

Description: FCI-InGaAs-300B1XX series are multifunctional backside illuminated photodiode/arrays. They come standard in a single element diode or 4 - or 8- elements array with active area of 300µm. These back illuminated InGaAs photodiode/arrays are designed to be flip chip mounted (active area

• Sensitivity: 0.85 A/W
• Spectral Response Range: 900 to 1,700 nm
• Active Area Diameter or Length: 0.30000000000000004 mm
• Rise Time: 3.5 ns

Description: This substrate consists of a rigid substrate and a flex substrate, and the flexibility of the flex component allows for 3-D circuit connection to take place. As there is no need to use connectors between modules, this substrate is advantageous in terms of miniaturization.

Description: AlGaAs). This LED technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 mA to 50 mA). The color is deep red at a dominant wavelength of 644 nm deep red. TS AlGaAs is a flip-chip LED technology, die attached to

• Peak Wavelength: 654 nm
• Forward Voltage: 1.9 to 2.4 volts
• Forward Current: 50 milliamps
• Luminous Intensity: 100 to 400 milliCandela

Description: to 33 MHz. High switching speeds result in smaller peripheral components and enable new applications like the Rezence A4WP wireless power transfer. The PE29100 is available in a flip chip package. The PE29100 is manufactured on Peregrine’s UltraCMOS process, a patented variation of

• Category: Development Board

Description: reliability and protection for delicate components, particularly in surface-mount technology (SMT) and flip-chip assemblies. ALPHA® HiTech UP44-5566T offers a fast curing process, ensuring high throughput in production. Fast UV Cure This adhesive cures quickly under ultraviolet light,

• Industry: Electronics, Semiconductors / IC Packaging
• Cure / Technology: Single Component System, UV / Radiation Cured (EB, Light)

Description: applications, featuring a dual gantry architecture that offers motion along four degrees of freedom (X, Y, Z, and Rz) with a total of eight controlled axes. This advanced design supports demanding processes such as Flip-chip, Fan-out, Hybrid bonding, 2.5D/3D packages, µ-LED bonding,

• Stroke or X-Axis Travel: 0 to 16.141741 inch
• Y-Axis Travel: 0 to 17.5196945 inch
• Z-Axis Travel: 1.181103 inch
• Rated Speed: 78.74015748031496 in/sec

Description: applications, such as flip-chip bonding and cold welding.

Description: with providing PA bias and product identification read-back capability. The power amplifier blocks, the controller and the passive components are mounted by flip-chip package technology on a multi-layer laminate substrate. The entire assembly is encapsulated with plastic over

• Amplifier Type: Power Amplifier

Description: (WLP) provides for both interconnection and package sealing of circuits at the wafer level. Processes include flip chip solder reflow, solder lid sealing and wafer-to-wafer bonding using solder, glass, adhesives and direct fusion Applications Gated light arrays MEMS devices Oscillators

• Temperature Range: 662 F

Description: which will damage sensitive electrical circuit components. Applications Automotive diodes CPV solar cell modules Fiber optic devices Flip chips GaN MMICs Hearing aid amplifiers Hermetic feed-throughs Implantable medical devices Laser pump diodes LED lamps and heaters Microwave packages

• Process Temperature: 450 C
• Height: 482.59973939614076 mm
• Width / Tube O.D.: 774.6995816622259 mm
• Length (Chamber / Tube): 634.9996571001852 mm

Description: which will damage sensitive electrical circuit components. Applications Automotive diodes CPV solar cell modules Fiber optic devices Flip chips GaN MMICs Hearing aid amplifiers Hermetic feed-throughs Implantable medical devices Laser pump diodes LED lamps and heaters Microwave packages

• Temperature Range: 842 F

Description: to 130MHz (programming option) Output Frequency: LVCMOS 80kHz to 130MHz Wire Bond and Flip Chip options to choose from Very low Jitter and Phase Noise Low current consumption Single 1.8V, 2.5V, or 3.3V ±10% power supply Operating temperature range from -40°C to +85°C

• Output Frequency: 19 to 65 MHz
• Device Type: Clock Generator
• Bus Interface: LVDS, LVPECL
• Features: Other