Flip Chip Substrate

Description: The product is a high-integration package substrate that is used to connect a high-integration semiconductor chip to a main board. This is a high-integration package substrate developed by connecting a semiconductor chip and a package substrate by using flip

• Mounting: SMT

Description: This is a semiconductor chip with a size that is more than 80% of the finished part. It is called FCCSP (Flip Chip CSP) as flip chip bumps are used. It is mainly used for the AP (Application Processor) chips of mobile IT devices. General Features High

• Mounting: SMT

Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly)

• Fluxes & Cleaners: Soldering Flux / Rosin
• Form / Shape: Paste

Description: viscosity can be sprayed onto substrates followed by flip-chip placement. These fluxes can also be dispensed onto the side of the flip-chip, allowing the flux to wick across the bottom of the chip. Fluxes with higher viscosities can be printed onto the pads, or the

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Tackiness suitable for holding large die during assembly Bubble-free packaging Introduction Flip-Chip Flux WS-580 is a NIA halogen-free water washable flip-chip dipping flux which has an activator system powerful enough to promote wetting on the most demanding substrate

• Approvals / Conformance: Other
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Features Designed for flip-chip dipping applications Tackiness suitable for holding large die during assembly Bubble-free packaging Red color for ease of detection Introduction Flip-Chip Flux WS-446 is a water soluble flip-chip dipping

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: SMD flip chip. Edged trimmed block resistors. Pure alumina substrate (99.5 %). Ohmic range: 10R to 500R. Small internal reactance (LC down to 1 Ã? 10^-24) Resistance = 150Ohms Package/Case = 0402 Tolerance = ±2% Power Rating = 0.05W Temperature Coefficient = ±100ppm/°C

• Power Rating: 0.0500 watts
• Resistance Range: 150 ohms
• Technology / Construction: Thin Film
• Temperature Coefficient (TCR): 100 ±ppm/°C

Description: SMD flip chip. Edged trimmed block resistors. Pure alumina substrate (99.5 %). Ohmic range: 10R to 500R. Small internal reactance (LC down to 1 Ã? 10^-24) Resistance = 250Ohms Package/Case = 0402 Tolerance = ±2% Power Rating = 0.05W Temperature Coefficient = ±100ppm/°C

• Power Rating: 0.0500 watts
• Resistance Range: 250 ohms
• Technology / Construction: Thin Film
• Temperature Coefficient (TCR): 100 ±ppm/°C

Description: SMD flip chip. Edged trimmed block resistors. Pure alumina substrate (99.5 %). Ohmic range: 10R to 500R. Small internal reactance (LC down to 1 Ã? 10^-24) Resistance = 200Ohms Package/Case = 0402 Tolerance = ±2% Power Rating = 0.05W Temperature Coefficient

• Power Rating: 0.0500 watts
• Resistance Range: 200 ohms
• Technology / Construction: Thin Film
• Temperature Coefficient (TCR): 100 ±ppm/°C

Description: SMD flip chip. Edged trimmed block resistors. Pure alumina substrate (99.5 %). Ohmic range: 10R to 500R. Small internal reactance (LC down to 1 Ã? 10^-24) Resistance = 500Ohms Package/Case = 0402 Tolerance = ±2% Power Rating = 0.05W Temperature Coefficient

• Power Rating: 0.0500 watts
• Resistance Range: 500 ohms
• Technology / Construction: Thin Film
• Temperature Coefficient (TCR): 100 ±ppm/°C

Description: LOCTITE ECCOBOND NCP 5208 is a non-conductive paste for thermal compression bonding processes in flip chip to laminate assembly. It is designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the substrate and provide fluxing

• Industry: Electronics

Description: (Known as Hysol FP0114 ) LOCTITE ECCOBOND FP0114 is a low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. It has excellent wettability and adhesion to the typical surfaces encountered in flip chip applications. It can

• Coeff. of Thermal Expansion (CTE): 18.33 µin/in-F
• Industry: Electronics
• Use: Gap Filling Compound
• Viscosity: 5000 cP

Description: QSOP or flip chip assemblies, making them ideal for portable, wireless, compact and high performance end products. These include pure resistor networks, resistor capacitor diode networks with transistor/mosfet arrays, Schottky diodes, network terminations including customized circuits

• Applications: General, EMI Filtering
• Features: On-Chip ESD Protection
• Filter Category: Passive Filter
• Filter Class: Continuous

Description: Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. This material exhibits ultra low warpage

• Chemical / Polymer System Type: Epoxy
• Industry: Electronics

Description: 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Description: 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Description: LUXEON FlipChip UV is the smallest and highest power density (W/cm2) ultraviolet chip-scale package LED that can be reflowed onto a substrate with a standard surface mount (SMT) equipment and process. LUXEON FlipChip UV LED enables tighter beam control and completely

• Color: Ultraviolet
• Forward Current: 500 milliamps
• Lens Type: Flat Lens
• Peak Wavelength: 380 to 400 nm

Description: FCI-InGaAs-300B1XX series are multifunctional backside illuminated photodiode/arrays. They come standard in a single element diode or 4 - or 8- elements array with active area of 300µm. These back illuminated InGaAs photodiode/arrays are designed to be flip chip mounted (active area

• Active Area Diameter or Length: 0.3000 mm
• Dark Current: 0.0500 nA
• Operating Temperature: 0.0 to 70 C
• PN, PIN, or Avalanche: PIN Photodiode

Description: A one-component capillary underfill protects chip packages on PCBs, with high Tg and low CTE to shield solder joints from stress. Product Overview ALPHA HiTech CU11-3127 is a high filler content product designed to provide enhanced mechanical strength for CSP and Flip Chip

• Industry: Electronics

Description: Grid Array 3) FCBGA : Flip Chip BGA Quality Has durability against repetitive flexing Folder Type: 100,000 times Slider Type: 200,000 times Ideal assembly process with high reliability Able to perform continuous production. Folder Type: 100,000 times Slider Type: 200,000 times

Description: The EnerChip is the world’s first solid state thin film battery created on a silicon substrate. The CBC050-BDC can be placed directly on a PCB or inside a packaged part with other integrated circuits. It can be attached using standard wire bonds or solder bumps for flip

• Capacity, Amp Hours (AH): 5.00E-5 ampere-hr
• Operating Temperature: -4 to 158 F
• Specialty Cells: Thin Film
• Standard Battery Sizes: Other

Description: The EnerChip is the world’s first solid state thin film battery created on a silicon substrate. The CBC005-BDC can be placed directly on a PCB or inside a packaged part with other integrated circuits. It can be attached using standard wire bonds or solder bumps for flip

• Capacity, Amp Hours (AH): 5.00E-6 ampere-hr
• Operating Temperature: -4 to 158 F
• Specialty Cells: Thin Film
• Standard Battery Sizes: Other

Description: provides excellent reliability and protection for delicate components, particularly in surface-mount technology (SMT) and flip-chip assemblies. ALPHA® HiTech UP44-5566T offers a fast curing process, ensuring high throughput in production. Fast UV Cure This adhesive cures

• Cure Type / Technology: UV / Radiation Cured (EB, Light), Single Component System
• Industry: Electronics, Semiconductors / IC Packaging

Description: arsenide (TS AlGaAs). This LED technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 mA to 50 mA). The color is deep red at a dominant wavelength of 644 nm deep red. TS AlGaAs is a flip-chip LED technology, die attached

• Forward Current: 30 milliamps
• Forward Voltage: 1.9 volts
• Lens Type: Domed Lens
• Luminous Intensity: 100 milliCandela

Description: aluminum gallium arsenide (TS AlGaAs). This LED technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 mA to 50 mA). The color is deep red at a dominant wavelength of 644 nm deep red. TS AlGaAs is a flip-chip LED

• Color: Red
• Forward Current: 30 milliamps
• Forward Voltage: 1.9 volts
• Lens Type: Domed Lens

Description: aluminum gallium arsenide (TS AlGaAs). This LED technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 mA to 50 mA). The color is deep red at a dominant wavelength of 644 nm deep red. TS AlGaAs is a flip-chip LED

• Color: Red
• Forward Current: 30 milliamps
• Forward Voltage: 1.9 volts
• Lens Type: Domed Lens

Description: arsenide (TS AlGaAs). This LED technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 mA to 50 mA). The color is deep red at a dominant wavelength of 644 nm deep red. TS AlGaAs is a flip-chip LED technology, die attached

• Color: Red
• Forward Current: 30 milliamps
• Forward Voltage: 1.6 volts
• Lens Type: Domed Lens

Description: UltraCMOS® SPDT RF Switch, 10 MHz–40 GHz. The PE42524 is a HaRP™ technology-enhanced reflective SPDT RF switch die that supports a wide frequency range from 10 MHz to 40 GHz. This wideband flip-chip switch delivers high isolation performance, excellent linearity and

• Actuator Type: SPDT, Other
• Frequency Range: 10 to 40000 MHz
• Insertion Loss: 1.3 dB
• Isolation (Port to Port): 58 dB

Description: switching applications up to 33 MHz. High switching speeds result in smaller peripheral components and enable new applications like the Rezence A4WP wireless power transfer. The PE29100 is available in a flip chip package. The PE29100 is manufactured on Peregrine’s UltraCMOS process, a

• Category: Development Board

Description: MIPI) with providing PA bias and product identification read-back capability. The power amplifier blocks, the controller and the passive components are mounted by flip-chip package technology on a multi-layer laminate substrate. The entire assembly is encapsulated with plastic over

• Amplifier Type: Power Amplifier

Description: -end applications, featuring a dual gantry architecture that offers motion along four degrees of freedom (X, Y, Z, and Rz) with a total of eight controlled axes. This advanced design supports demanding processes such as Flip-chip, Fan-out, Hybrid bonding, 2.5D/3D packages, µ-LED bonding, and

• Actuation Type: Electrical
• Axis Configuration: X-Y-Z Axes
• Drive Specifications: Direct Drive, Other
• Features: Multi-position

Description: Accelerometers Atomic clocks Automotive diodes Automotive sensors CPV solar cell modules Fiber optic devices Flip chips GaN MMICs Gated light arrays Glass diodes Glass-to-metal seals Hearing aid amplifiers

• Application: Brazing / Soldering, Curing, Industrial, Other
• Computer Interface: Yes
• Configuration: Top Loading
• Controller Type: Programmable

Description: Fiber optic devices Flip chips GaN MMICs Gated light arrays Glass diodes Glass-to-metal seals Hearing aid amplifiers Hermetic feed-throughs High accuracy gyroscopes Implantable medical devices Laser pump diodes LED lamps and heaters MEMS devices Microwave packages

• Temperature Range: 212 to 932 F

Description: Flip Chip options to choose from Very low Jitter and Phase Noise Low current consumption Single 1.8V, 2.5V, or 3.3V ±10% power supply Operating temperature range from -40°C to +85°C

• Bus Interface / Output Type: LVPECL, LVDS
• Device Type: Clock Generator
• Output Frequency: 19 to 65 MHz
• Package / Form Factor: Other