Products & Services
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Viscosity: 3,000 to 7,000 cP
- Use Temperature: 662 F
- Coeff. of Thermal Expansion (CTE): 25 to 76.66666666666667 µin/in-F
- Index of Refraction: 1.5259
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Viscosity: 3,000 to 7,000 cP
- Use Temperature: 662 F
- Coeff. of Thermal Expansion (CTE): 25 to 76.66666666666667 µin/in-F
- Index of Refraction: 1.5259
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Supplier: FORREST Technical Coatings
Description: Polyester Epoxy hybrid powder coatings are designed for good electrostatic properties and surface flow over a wide range of film thickness.
- Cure / Dry Temperature: 400 F
- Cure / Set Temperature: 400 F
- Substrate: Aluminum, Metal, Plastic, Steel, Wood
- Features: Chemical / Oil Resistant, Coating, Corrosion Inhibiting / Rust Preventive, Other, Paint, Protective, Touch-Up, Wear Resistant (Abrasion / Erosion)
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Supplier: TIGER Drylac Powder Coatings
Description: Epoxy/Polyester hybrid powder coating for interior applications with electrostatic dissipative properties. Typical Applications Computer hoods. Electronic cabinets Features Electrostatic dissipative.
- Features: Coating
- Type: Powder Coating
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Supplier: FORREST Technical Coatings
Description: An electrostatic developed specifically to minimize the electrostatic discharge (ESD) created when two surfaces with different voltages meet one another. When properly applied these coatings can prevent significant damage caused by electrostatic discharge.
- Features: Anti-Static / ESD Control, Chemical / Oil Resistant, Coating, Conductive, Corrosion Inhibiting / Rust Preventive, Other, Paint, Protective, Specialty / Other, Touch-Up
- Industry: Electronics, Machine Tools, Medical / Healthcare, OEM / Industrial, Process Equipment
- Location / Orientation: Interior
- Substrate: Metal, Plastic, Steel
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 4090 yellow epoxy/cyanocrylate hybrid adhesive is compatible with plastic, rubber and metal materials with a 24 hr cure time. Provides a 3-5 min working time. Works in a mix ratio of 1:1. Delivers great performance with tensile strength of 1025 psi. Minimum to maximum operating
- Viscosity: 27,000 cP
- Use Temperature: -65 to 302 F
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
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Supplier: Accuris
Description: ADHESIVE, EPOXY HYBRID - TWO COMPONENT ROOM TEMPERATURE CURE OR INDUCTION CURING, STRUCTURAL
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Supplier: FORREST Technical Coatings
Description: Polyester Epoxy hybrid powder coatings are designed for good electrostatic properties and surface flow over a wide range of film thickness.
- Cure / Dry Temperature: 350 F
- Cure / Set Temperature: 350 F
- Substrate: Aluminum, Metal, Plastic, Steel, Wood
- Features: Chemical / Oil Resistant, Coating, Corrosion Inhibiting / Rust Preventive, Other, Paint, Protective, Touch-Up, Wear Resistant (Abrasion / Erosion)
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Supplier: Epoxy Technology
Description: pot-life. UV hybrid is a UV tacking post-thermal cure required adhesive solution. Our EPO-TEK® UV Hybrids are a cutting edge technology that allows for tacking, alignment, positioning, or flow control to occur in seconds of UV illumination. Parts can be batched and thermal cured in
- Viscosity: 20,000 to 30,000 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 22.77777777777778 to 94.44444444444444 µin/in-F
- Index of Refraction: 1.5665 to 1.5842
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Supplier: PPG TrueFinish
Description: Blend of epoxy and polyester resins, less sensitive to over-bake
- Cure / Dry Temperature: 375 F
- Cure / Set Temperature: 375 F
- Substrate: Aluminum, Anodized, Metal, Steel
- Industry: Automotive, OEM / Industrial, Process Equipment
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite HY 4090GY Hybrid Adhesive Gray is a two component, one part epoxy and one part cyanoacrylate, structural instant adhesive. This high performance adhesive can be used on a variety of substrates such as plastic, rubber, and metals. It offers a fast room-temperature cure
- Viscosity: 4,000 to 40,000 cP
- Tensile Strength (Break): 1,025 psi
- Elongation: 3.6 %
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1306 Gray is a two component, room temperature and heat curing, acrylic/epoxy hybrid adhesive that has good adhesion and wetting to most surfaces. It is resistant to acids, bases, water and most organic solvents. 50 mL Cartridge.
- Viscosity: 202,000 cP
- Thermal Conductivity: 0.9 W/m-K
- Tensile Strength (Break): 4,500 psi
- Elongation: 0 to 1 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite HY 4090 Hybrid Adhesive Off-White is a two component, one part epoxy and one part cyanoacrylate, structural instant adhesive. This high performance adhesive can be used on a variety of substrates such as plastic, rubber, and metals. It offers low blooming, fast
- Viscosity: 4,000 to 40,000 cP
- Elongation: 3.6 %
- Chemical System: Epoxy (EP)
- Substrate Compatibility: Metal, Plastic, Rubber / Elastomer
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant is for protection of semiconductor devices. It is a high flow material which requires a cavity flow control barrier to prevent excessive flow. It is used for the encapsulation of bare chips mounted to plastic substrates and potting of small
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: EP36 offers the additional convenience of being a one component system together with flexible cure schedules. Master Bond EP36 is a hybrid epoxy system which offers excellent toughness and at the same time has outstanding heat resistance at high temperatures. EP36 has a unique
- Use Temperature: 500 F
- Coeff. of Thermal Expansion (CTE): 55.55555555555556 µin/in-F
- Tensile Strength (Break): 4,680 psi
- Elongation: 114.7 %
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Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold
- Use Temperature: 380 F
- Applications: Aerospace, Automotive / Transportation
- Material: Carbon / Graphite
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Supplier: Skyworks Solutions, Inc.
Description: The OLI100 is designed especially for hybrid applications that require optical isolation with a high current transfer ratio and low saturation VCE. The device consists of a light emitting diode, and an N-P-N silicon phototransistor mounted and coupled in a miniature custom ceramic package.
- Isolation Voltage: 1,500 volts
- Output: Phototransistor
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Supplier: Skyworks Solutions, Inc.
Description: The OLI920 consists of a pair of LEDs that are optically coupled to a dielectrically isolated photovoltaic diode array, packaged on a thick film ceramic substrate. When the LED is energized, the infrared emission is detected by the photovoltaic array and a DC output voltage is generated. This
- Isolation Voltage: 2,500 volts
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Supplier: Skyworks Solutions, Inc.
Description: The OLI249 is designed especially for hybrid applications that require optical isolation with high current transfer ratio (CTR) and low saturation VCE. Each OLI249 consists of an LED and N-P-N silicon phototransistor that is mounted and coupled in a miniature custom ceramic package. The low
- Isolation Voltage: 1,500 volts
- Output: Phototransistor
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Supplier: SAE International
Description: Fiber reinforced composite-metal hybrids are of great interest in automotive industry because of their excellent mechanical properties and light-weighting potential. Adhesive bonding is a preferred joining technique for manufacturing fiber reinforced composite metal hybrids. Metal
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Supplier: Skyworks Solutions, Inc.
Description: transistor improves the bandwidth by orders of magnitude as compared to standard phototransistors. The internal shield provides excellent common mode immunity performance. Device mounting is achieved by a standard hybrid assembly with non-conductive epoxies. Gold or aluminum wire bonding can
- Isolation Voltage: 1,500 volts
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Supplier: Amphenol Fiber Systems International
Description: rate applications. In addition, epoxy removal and polishing times are minimized by the ferrule's pre-domed design feature. The 110-115 termini's zirconia split alignment sleeve design ensures accurate physical contact, fiber-to-fiber alignment and guarantees the highest performing connector
- Insertion Loss: 0.5 dB
- Operating Temperature: -40 to 85 C
- Connector Ferrule: Ceramic
- Connector / Adapter: Connector
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Supplier: LEMO USA, Inc.
Description: Advantages: New design allows easy fiber length adjustment. No more half shells are required. Increased space for the fibers to move “more” freely in the connector. Reduced curing time for the optical contacts (new design allows epoxy to cure within 20 minutes). Simplified potting of the rear
- Voltage Rating: 42 to 600 volts
- Current Rating: 3 to 10 amps
- Frequency Range: 0.03 to 1 GHz
- Connector Type: Audio / Video Connector, Circular / Cylindrical Connector
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Supplier: Techsil Limited
Description: suitable for applications in high temperature/humidity environments. The thixotropic nature of this product makes it suitable for applications where good gap filling properties on rough and poorly fitting surfaces are required. The technology behind LOCTITE® HY 4090™ Hybrid Adhesives combines
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Supplier: Wacker Chemical Corp.
Description: Based on the innovative alpha-technology, the new GENIOSIL® XB hybrid polymers for the first time exploit the advantages of silane crosslinking for user-friendly, environmentally compatible structural adhesive bonds.Thanks to their low viscosity, the new hybrid polymers are easy to
- Viscosity: 2 cP
- Industry: Building / Construction
- Substrate Compatibility: Ceramic / Glass, Metal, Wood / Wood Product
- Chemical System: Silicone
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 958-7, Epoxy, Die attach LOCTITE® ABLESTIK 958-7 electrically conductive epoxy adhesive is designed for hybrid die attach. This adhesive provides better adhesion to gold than other versions of ABLEBOND 958 adhesive series. Electrically conductive Good adhesion
- Viscosity: 90,000 cP
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 564A, Epoxy Film, Assembly LOCTITE® ABLESTIK 564A adhesive film is designed for bonding hybrid substrates into packages. In centrifuge tests, this adhesive passed 15,000 gs. Electrically Insulating High purity Low outgassing High thermal stability
- Thermal Conductivity: 0.3 W/m-K
- Dielectric Constant (Relative Permittivity): 0
- Chemical System: Epoxy (EP)
- Industry: Military / Government (MIL-SPEC / GG)
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Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold
- Use Temperature: 180 F
- Industry: Aerospace, Marine
- Chemical System: Epoxy (EP)
- Features: Other, Specialty / Other
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Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold
- Use Temperature: 180 F
- Industry: Aerospace, Marine, OEM / Industrial
- Chemical System: Epoxy (EP)
- Features: Other, Specialty / Other
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Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold
- Use Temperature: 200 F
- Industry: Aerospace, Military / Government (MIL-SPEC / GG)
- Chemical System: Epoxy (EP)
- Features: Specialty / Other
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Supplier: Radwell International
Description: HALL EFFECT SENSOR, -50MT MIN, 50MT MAX, 3.96-4.04V, HYBRID, PLASTIC/EPOXY, RECTANGULAR, 3 PIN, THROUGH HOLE MOUNT. FREE 2 YEAR RADWELL WARRANTY
- Sensor Technology: Hall Effect Position Sensor
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Supplier: Amphenol Aerospace Corporation
Description: • 1mm precision ceramic ferrules • Offers increased termini density • Designed with similar high performance components as size 16 termini • Maintains fber optic/electrical hybrid capabilities • Termination accomplished using epoxy/polish method.
- Maximum Cable Diameter: 0.063 mm
- Operating Temperature: -55 to 165 C
- Connector Ferrule: Ceramic
- Connector / Adapter: Connector
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Supplier: Amphenol Aerospace Corporation
Description: • 1mm precision ceramic ferrules • Offers increased termini density • Designed with similar high performance components as size 16 termini • Maintains fber optic/electrical hybrid capabilities • Termination accomplished using epoxy/polish method.
- Maximum Cable Diameter: 0.063 mm
- Operating Temperature: -55 to 165 C
- Connector Ferrule: Ceramic
- Connector / Adapter: Connector
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 84-3MVBTI, Epoxy, Die attach LOCTITE® ABLESTIK 84-3MVBTI adhesive is designed for die attach and hybrid component attach applications. Electrically Insulating Low bleed Long work life Good dispensability
- Viscosity: 29,000 cP
- Thermal Conductivity: 0.64 W/m-K
- Coeff. of Thermal Expansion (CTE): 25.555555555555554 µin/in-F
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ECCOBOND DS 6601 epoxy hybrid is specially designed for use as the main sealant in narrow bezel LCD ODF panel assembly applications. KEY BENEFITS: One component Good curing at long wavelength ranges High adhesion
- Industry: Electronics
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Featured Products Top
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bondable resistors are ultra-stable with high reliability. This family of resistors is built in an 0202 chip outline and is ideal but not limited to hybrid circuit applications. The KYOCERA AVX WBR series is designed for stable thermocompression, epoxy or ultrasonic attachment. Richardson RFPD (read more)
Browse Chip Resistors Datasheets for Richardson RFPD -
chemistries, such as unsaturated polyester, unsaturated polyester-imide, epoxy and epoxy-polyester hybrid products, as well as a wide range of water-based, solvented varnishes and the specialty emulsion products. Typical end use markets include power generation, automotive, transportation (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
chemistries, such as unsaturated polyester, unsaturated polyester-imide, epoxy and epoxy-polyester hybrid products, as well as a wide range of water-based, solvented varnishes and the specialty emulsion products. Typical end use markets include power generation, automotive, transportation (read more)
Browse Polyester Resins Datasheets for ELANTAS North America LLC -
: Conventional Powder Coatings: Polyesters, Epoxies, Hybrids and Polyurethanes in a variety of colors and textures. Heat Resistant and High Temp powder: Our unique experience in high (read more)
Browse Powder Coatings Datasheets for FORREST Technical Coatings -
A comprehensive industry-authored white paper detailing adhesives and sealants in HEVs and BEVs, including battery cells, modules, packs, and motors. Additionally the white paper provides links to guides for body construction, paint, and vehicle assembly of hybrid and battery electric vehicles (read more)
Browse Standards and Technical Documents Datasheets for Adhesives.org -
harsh in-tank environments. The company can also upgrade standard automotive and off-road connectors to meet demanding environmental requirements. Multiple sealing methods are available to meet specific needs. Direct epoxy casting enables lightweight, low-profile hermetic assemblies, while (read more)
Browse Automotive Electrical Connectors Datasheets for Douglas Electrical Components -
CircuitSeal™ is a hermetic sealing and encapsulation process that protects connectors, circuit boards, and electronic assemblies using a low-outgassing, chemically inert epoxy. By fully encapsulating components such as rigid and flex PCBs, hybrid circuits, and flat flex cables, it creates (read more)
Browse Wire to Board Connectors Datasheets for Douglas Electrical Components -
using advanced hermetic epoxy sealing technology to minimize outgassing, withstand mechanical stress, and maintain performance through demanding environmental conditions. Available configurations include MIL-spec connectors, coaxial feedthroughs, circular and rectangular multipin connectors (read more)
Browse Military (MIL-SPEC) Connectors Datasheets for Douglas Electrical Components -
sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
technology helps protect electronics in sensors, instrumentation, and transmitters from moisture and environmental exposure. Using a proprietary epoxy bonding process, JacketSeal™ seals directly to conductors, wire jackets, and housings to prevent liquid and gas penetration. These (read more)
Browse Feedthroughs Datasheets for Douglas Electrical Components
Conduct Research Top
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Unique EPO-TEK (R) UV Hybrid Adhesives and their Applications
This paper discusses the advantages of a UV Hybrid Epoxy. A UV Hybrid Epoxy combines the fast tacking of a UV curing system with the long-term reliability of an epoxy. With this new adhesive line, parts can be aligned and positioned; or adhesive flow can be controlled with extreme accuracy
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Epoxy Techniques for Hybrid Microwave Integrated Circuits
Epoxy Techniques for Hybrid Microwave Integrated Circuits
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
Epoxies are used in the packaging and assembly of three opto-electronic devices, including Fiber Optics, LEDs, and LCDss. In fiber optics, you need epoxy for the cable and for the opto-packaging. The fiber optic components are usually packaged in hybrid technology, which mean several
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
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Smart Thermostats
RB Series surface mount end-banded thermistor elements are designed for use on hybrid substrates, integrated circuits or printed circuit boards. They have a solder coated contact techniques in including wire bond, epoxy or solder.
More Information Top
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SAXS Characterization of New Nanocomposites Based on Epoxy Resin/Siloxane/MMA/Acrylic Acid Hybrid Materials
Epoxy-functionalized POSS monomers have been also extensively studied on the development of hybrid epoxy networks since they can act as a co-monomer on the network formation together with the epoxy resin and the hardener.
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Preparation and anticorrosive properties of hybrid coatings based on epoxy‐silica hybrid materials
The SiO2 nanoparticles which are well dispersive in hybrid materials by sol-gel technology were found to lead more effectively enhanced on the ther- mal stability, mechanical strength of as-prepared hybrid epoxy -silica sol-gel materials in the form of bulky …
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Preparation and properties of MWCNTs/poly(acrylonitrile‐ styrene‐butadiene)/epoxy hybrid composites
Figure 1(a) shows the FTIR spectra of 0.36 wt % MWCNTs- modified hybrid epoxy composites, which is a represent of all .
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Numerical assessment of the dynamic behavior of hybrid shape memory alloy
composite
A parametric study based on the volume fraction of pores and epoxy material is carried out for hybrid epoxy –SMA composite and plain porous SMA, respectively, and a comparison is performed.
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Studies on Thermal and Mechanical Properties of Epoxy-Silicon Oxide Hybrid Materials
Thermally and Mechanically Superior Hybrid Epoxy -Silica Polymer films Via Sol-Gel Method, Prog.
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Environmental effects on the adhesion properties of nanostructured epoxy‐silica hybrids
In order to assess their durability in service, concrete/concrete joints, bonded or with the hybrid epoxy ‐silica or with the control epoxy adhesive, were exposed to the same environmental conditions and subjected to adhesion tests according to the “slant shear test.” .
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One-step synthesis of improved silica/epoxy nanocomposites with inorganic-organic hybrid network
Nazir T, Afzal A, Siddiqi HM et al (2010) Thermally and mechan- ically superior hybrid epoxy silica polymer films via sol-gel meth- od.
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Preparation and properties of TiO 2 ‐filled poly(acrylonitrile‐butadiene‐styrene)/epoxy hybrid composites
FESEM analysis of the fracture surface after fracture mechan- ics of TiO2-filled cross-linked hybrid epoxy network gives an insight on the cause and location of failure as well as the dispersion state of the particles within the epoxy matrix.
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Epoxy resin modified with in situ generated metal oxides by means of sol–gel process
Sangermano et al.23 reported the preparation of nanostructured organic–inorganic hybrid epoxy coat- ings containing zirconia domains obtained via a cati- onic UV/thermal dual-cure process.
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Hybrid Nanocomposites for Nanotechnology
Various kinds of hybrid epoxy -silica networks with in situ formed silica have been synthesized and investigated [19, 24, 25, 28, 45, 141].
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