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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire,
- Alloy: Tin-Silver (Sn-Ag)
- Approvals / Conformance: ASTM / UNS
- Conductivity: 8.12E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
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Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Indium Corporation
Description: Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: DigiKey
Description: "SN96/AG4 .031"" SOLDER WIRE 1OZ S"
- Form / Shape: Wire
- Melting Range: 430 F
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Supplier: Indium Corporation
Description: Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes.
- Alloy: Indium (In), Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag), Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: DigiKey
Description: Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 18 AWG, 19 SWG Spool, 17.64 oz (500g)
- Form / Shape: Wire
- Melting Range: 423 to 424 F
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Supplier: DigiKey
Description: Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 17.64 oz (500g)
- Form / Shape: Wire
- Melting Range: 423 to 424 F
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Supplier: DigiKey
Description: Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 17.64 oz (500g)
- Form / Shape: Wire
- Melting Range: 423 to 424 F
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester lead-free solder wire is another quality product from Kester. Total composition for this lead-free solder wire is sn96.5/ag03/cu0.5.
- Form / Shape: Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without flux core lead-free
- Approvals / Conformance: Other
- Form / Shape: Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without flux core lead-free
- Approvals / Conformance: Other
- Form / Shape: Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without flux core lead-free
- Approvals / Conformance: Other
- Form / Shape: Wire
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Supplier: RS Components, Ltd.
Description: WSW SAC L0 solders have been developed to meet the electronics industryâ??s increasingly stringent quality requirements. WSW SAC L0 lead-free solder wire with Sn3.0Ag0.5Cu alloy. L0 - Halogen-free flux. For a long life of the soldering tips. Fast and
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 to 430 F
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Supplier: ODG (Origin Data Global)
Description: SOLDER WIRE SN42/BI57/AG1 .047"
- Equipment Type: Other
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Supplier: Utmel Electronic Limited
Description: Conn Wire to Board HDR 4 POS 3.96mm Solder RA Thru-Hole KK® Bag
- Contact Pitch: 3.96 to 3.96 mm
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Supplier: SAE International
Description: This specification covers wire, strip, bars, pigs, or as ordered. Alloy: 1.5 Sn Solder UNS Number: L50131
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Supplier: ODG (Origin Data Global)
Description: SLDR SLV WIRE-WIRE 0.235/0.255"
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Supplier: RS Components, Ltd.
Description: WSW SAC L0 solders have been developed to meet the electronics industryâ??s increasingly stringent quality requirements. WSW SAC L0 lead-free solder wire with Sn3.0Ag0.5Cu alloy. L0 - Halogen-free flux. For a long life of the soldering tips. Fast and
- Diameter / Thickness: 0.0197 inch
- Form / Shape: Solid Wire
- Melting Range: 423 to 430 F
- Soldering Filler Alloys: Tin-Silver (Sn-Ag)
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Supplier: HAVE, Inc.
Description: 3 pole XLR female receptacle with 1/4" switching (normalling)stereo jack. With solder cups for wire termination. Combo / Combo Series Combined XLR receptacle and phone jack. New attractive `front end` design (30% less protruding from panel than original). Saves racks space by
- Connector Type: 1/4'' Phone Plug / Jack, XLR Connector
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Supplier: Accuris
Description: Test methods for electrical materials, printed boards and other interconnection structures and assemblies \x96 Part 5-4: General test methods for materials and assemblies \x96 Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
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Supplier: Lapp Tannehill
Description: Heated, Sn96 solder alloy, Sleeve size = 4, No preinstalled wire. 100 solder sleeves/pack MANUFACTURER : Sumitomo MANUFACTURER PART NUMBER : H-HC-4 AVAILABILITY : Contact 800-633-6339 for Availability SERIES : H-H Series SIZE : 4 OPERATING
- Operating Temperature: 175 C
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Supplier: Aries Electronics, Inc.
Description: FEATURES For mounting liquid crystal displays and other high pin count or odd centered components Available in several sizes with bifurcated contacts in solder pin tails or wire wrap pins For Wire Wrap Pins, consult Data Sheet 12009 Optional spacer
- Contact / Pin Type: Solder Tail Pins, Wire Wrap Pins
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
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Supplier: HAVE, Inc.
Description: 3 pole XLR female receptacle with 1/4" switching ground and stereo jack. With solder cups for wire termination. Combo / Combo Series Combined XLR receptacle and phone jack. New attractive `front end` design (30% less protruding from panel than original). Saves racks space by
- Connector Type: Audio / Video Connector
- Gender: Female / Jack
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Heavy Duty Rectangular Connectors - Rectangular Connectors - B4P-VH(LF)(SN) -- 769522-B4P-VH(LF)(SN)Supplier: Win Source Electronics
Description: Manufacturer: JST Sales America Inc. Win Source Part Number: 769522-B4P-VH(LF)(SN ) Series: VH Packaging: Bulk Number of Positions: 4 Mounting Style: Through Hole Operating Temperature Range: -25°C ~ 85°C Connector Type: Header Contact Type: Male
- Current Rating: 10 amps
- Voltage Rating: 250 volts
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Supplier: TE Connectivity
Description: Dimension : 1.14 MM [.045 INCH ] Termination Method to Printed Circuit Board : Through Hole - Solder Termination Method to Wire & Cable : Solder Termination Post & Tail Length
- Connector Type: Wire-to-Board Connector
- Current Rating: 7 amps
- Voltage Rating: 600 volts
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1047762-B4B-ZR-3.4(L F)(SN) Category: Connectors, Interconnects>Rectan gular Connectors - Headers, Male Pins Series: ZH Number of Positions: 4 Connector Type: Header Contact Type: Male Pin Number of Positions Loaded: All Number
- Contact Plating: Other
- Contacts Pitch: 1.5 mm
- Current Rating: 1 amps
- Mounting: Through-hole, Other
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Supplier: TE Connectivity
Description: Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Tab Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
- Features: RoHS
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Supplier: Win Source Electronics
Description: Manufacturer: JST Sales America Inc. Win Source Part Number: 063106-S3B-EH(LF)(SN ) Packaging: Bulk Number of Positions: 3 Connector Type: Header Contact Type: Male Pin Number of Positions Loaded: All Number of Rows: 1 Termination: Press-Fit, Solder
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Supplier: TE Connectivity
Description: Preloaded : No Number of Positions : 4 Number of Power Positions : 0 Number of Signal Positions : 4 Contact Features Circular Connector Contact Type : Solder Cup
- Contact Size (AWG): 16 AWG
- Current Rating: 13 amps
- Number of Contacts: 4 #
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Supplier: TE Connectivity
Description: Features Product Terminates To : Printed Circuit Board Termination Method to Wire & Cable : Solder
- Applications / Industry: Motor
- Length: 0.5433 inch
- OD / Width : 0.2500 inch
- Plating / Coating: Tin, Specialty / Other
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Supplier: ASTM International
Description: 1.1 These test methods cover equipment and techniques for measuring the resistance of static electrical connections such as wire terminations or splices, friction connectors, soldered joints, and wrapped-wire connections. 1.2 Measurements under two distinct levels of electrical
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Supplier: Richardson RFPD
Description: series and shunt diodes or bias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance through low millimeter frequencies. Large bond pads facilitate the use of low
- Actuator Type: Other
- Frequency Range: 50 to 26500 MHz
- Insertion Loss: 0.9000 dB
- Isolation (Port to Port): 42 dB
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Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
retardant. Shrink Ratio--4:1 (75%). Shrinkage begins when exposed to 120°C. Longitudinal shrinkage: 10%. Dielectric Strength: 400V/Mil min. Uses: Strain reliefs, jacketing material, component insulation, seal & protect wire splices, breakouts or connectors-to-cable terminations. OPER. TEMP.: -55°C to +135°C. Meets MIL-I-23053/4, Class 3, UL VW-1, CSA OFT (jacket only), ASTM D638. (read more)
Browse Tubing Datasheets for BRIM Electronics, Inc. -
Engineered for High-Flow Hydraulic Systems Built to EN853 2SN, GBT 3683 2SN, SAE J517 R2S, and ISO 1436 2SN standards, this hose features two braids of high-tensile steel wire reinforcement. It delivers a working pressure of 16.5MPa and a burst pressure of 66MPa, ensuring (read more)
Browse Hydraulic Hose Datasheets for Ningbo TIP Fluid Technology Co., Ltd. -
hose ensures superior performance. Applications 1.Applicable media:Petroleum based hydraulic oil, Water, Ethylene glycol, Lubricating oil, Air and Water 2.Inner tube: Synthetic rubber 3.Reinforcement: One braid of steel wire 4.Cover:Synthetic rubber 5 (read more)
Browse Hydraulic Hose Datasheets for Ningbo TIP Fluid Technology Co., Ltd. -
bump-on-polymer processes Single and multiple layer Cu redistribution with several polymer repassivation material choices Eutectic Sn/Pb, Pb-free and high-Pb solder alloys Design services and custom test vehicle fabrication Downloads (read more)
Browse IC Interfaces Datasheets for Micross Components, Inc. -
, high directivity, and excellent return loss performance. Stripline design handles much higher power than equivalent core-and-wire models, while the enclosure remains minimally sized at 3.600 x 0.600 x 0.38 inches with SMA-Female connectors. The device is RoHS compliant, and Sn/Pb solder is (read more)
Browse RF Couplers Datasheets for Werbel Microwave LLC -
Cr, Fe ,Ni, Cu, Zn, Pd, Ag, Sn and Au. Up to four separate plating lines can be measured sequentially with the option to set up individual measurement programs for each line. The solution can be pumped directly from the plating tank that connects to the instrument’s measurement tubing (read more)
Browse X-Ray Fluorescence Spectrometers Datasheets for Pratt & Whitney Measurement Systems, Inc. -
MacDermid Alpha Electronics Solutions introduces ALPHA® SF828-MBB. Designed for soldering small?surface areas of wire and delivering excellent?peel force and high machine cleanliness, this is our latest liquid flux for the photovoltaic market. ALPHA (read more)
Browse Fluxes Datasheets for MacDermid Alpha Electronics Solutions -
elemental Cr, Fe ,Ni, Cu, Zn, Pd, Ag, Sn and Au. Up to four separate plating lines can be measured sequentially with the option to set up individual measurement programs for each line. The solution can be pumped directly from the plating tank that connects to the instrument’s measurement tubing (read more)
Browse Datasheets for Pratt & Whitney Measurement Systems, Inc. -
solutions , as well as elemental Cr, Fe ,Ni, Cu, Zn, Pd, Ag, Sn and Au. Up to four separate plating lines can be measured sequentially with the option to set up individual measurement programs for each line. The solution can be pumped directly from the plating tank that connects to the (read more)
Browse X-Ray Fluorescence Spectrometers Datasheets for Pratt & Whitney Measurement Systems, Inc.
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Measurements on Subscale Y-Ba-Cu-O Racetrack Coils at 77 K and Self-Field
At each voltage tap location, a pair of twisted Cu instrumen- tation wires (AWG 32 and Polymide insulation) is soldered ( Sn96 / Ag4 solder) to the conductor edge with a contact length 1.5 mm.
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Measurements on Subscale Y-Ba-Cu-O Racetrack Coils at 77 K and Self-Field
At each voltage tap location, a pair of twisted Cu instru- mentation wires (AWG 32 and Polymide insulation) is soldered ( Sn96 / Ag4 solder) to the conductor edge with a contact length 1.5 mm.
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The Reliability of Soldered or Epoxy Bonded Chip Capacitor Interconnections on Hybrids
because of the relatively small number of nonconductive bonded chips evaluated and the possibility that some wire Of the solders evaluated, SnlO-Pb88-Ag2 was the most re- bonds were damaged by mishandling. .... If a larger sample size liable for attaching capacitors to alumina substrates; this was were used, probably nonconductive epoxy bonding would followed by Sn62-Pb36-Ag2 and Sn96 - Ag4 .
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Electrochromic Windows: Process and Fabrication Improvements for Lower Total Costs
…in Solder and Brazing techniques to develop a lead-free solder preform and soldering process to fit .... Development work was done using two lead free alloys: Sn96 AG4 (solid wire form), and Sn96.5:AG3.5 (washer shaped preform).
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Performance of New Copper Based Metallization Systems in an 85°C 80-Percent RH Cl2Contaminated Environment
Capacitors having all three end ter- mmations were reflow soldered on SnlO-Pb88-Ag2 or Sn96 - Ag4 tinned pads, by reflowing Sn62-Pb-36-2Ag paste, or by silver conduc- tive epoxy bonding with Ablefilm 606-2 (commonly used for bonding active … while the electrical intercon- nection from substrate to chip was made by thennocompression bond- ed gold wire .
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Electronic Materials and Processes Handbook, Third Edition > Materials and Processes for Hybrid Microelectronics and Multichip Modules
Sn96 / Ag4 . .... Solders for microelectronic applications are generally in the form of a paste, with the solder in powder .... Wire bonding .
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Board level reliability testing of μBGA(R) packaging with lead-free solder attachment
Sn93.6IAg4.7lCu 1.7 Sn95/Ag4.O/Cu1 Sn96 .5/Ag3.O/Cu0.5 Sn95.5/ Ag4 .O/Cu0.5 Sn95.5/Ag3.8/Cu0.7 Sn95.75/Ag3.5/Cu0.75 Tintsilver Tintcopper Tin/Silv./Cpr.* Tin/Silv./Cpr.* Tin/Silv./Cpr.* Tin/Silv./Cpr. Tin/Silv./Cpr. .... The compositions in Table I1 are a sampling of lead-free solders developed by some of the … also have a reliable source of supply, be available in all forms (powder, wire and bar), and…
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Deformation and damage of materials of the structure and connecting technique
Diameter the wire h... .... Therefore, a great interest consisted in investigating the deformation properties of solders in these size dimensions. .... Sn96.5Ag3Cu0.5 . .... For production the SnAgCu-Bumps, the sounding pastes became Hereaus F365 type 4, Sn95,5-Ag4-Cu0,5 , and the type 6 is used Fremat FTL 020 FP 18N/4/2 Sn95.5Ag3.8Cu0.7.
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Lead-Free Electronic Solders
z - Ag4 (Sb,Sn). .... Lead-Free Electronic Solders . .... Preparation Center of the Ames Laboratory for experimental assistance in solder alloy and wire preparation and in .... Sn96 .2Ag2.5Cu0.8Sb0.5 .
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Microvias: For Low Cost, High Density Interconnects > Solders for Next-Generation High-Density Interconnects
Although gold- wire bonding is still widely used on chips including DRAM and SRAM, solder -bumped flip chip is gradually applied to DRAM and SRAM devices. .... Sn96 .5-Ag3.5. .... • Sn95- Ag4 .0-Cu1 (217 to 219ºC, AMES Labs, covers any alloy containing 3.5 percent…