TABLE OF CONTENTS Logic gates and memory devices are fabricated as integrated circuits (ICs) because the components used, such as resistors, diodes, bipolar junction transistors, and the insulated gate or metal-oxide semiconductor field-effect transistors are the integral parts of the chip. The various components are interconnected within the chip to form an electronic circuit during assembly. The chip is mounted on a metal or plastic package, and connections are welded to the external pins to form an IC. The ICs result in an increase in reliability and reduction in weight and size.
Small-scale integration (SSI) refers to ICs housing fewer than 10 gates in a single chip. Medium-scale integration (MSI) includes 11 to 100 gates, whereas large-scale integration (LSI) refers to more than 100 to 5000 gates in a single chip. Very large-scale integration (VLSI) devices contain several thousands of gates per chip.
Integrated circuits are classified into two general categories ( a) linear and ( b) digital. Linear integrated circuits are operated with continuous signals and are used to construct electronic circuits such as amplifiers, voltage comparators, voltage regulators, etc. Digital circuits are operated with binary signals and are invariably constructed with integrated circuits. This chapter describes the basic internal structure of different types of logic families and analysis of their operation.
The various logic families can be broadly classified into categories according to the IC fabrication process ( a) bipolar and ( b) metal oxide semiconductor (MOS). Integrated circuits are available in various types of...
