TABLE OF CONTENTS The final thing Bill has to do is provide the packaging department with a final bonding diagram, based on the real die and the real package.
Bill takes his final layout, gets an electronic version of the package drawing from his packaging people, places his chip in the package and draws an accurate final bond drawing. Up until now they have only had a hand-sketched version. The assembly house has to make sure that all the bond angles are ok and the wires are not too long.
Because of all the good up-front work that Ted has done there are no problems with the bond-out and bond angles. The rough bond-out diagram he gave to Bill helped.
The final chip bonding diagram is shown in Figure CS1-93.
Most bond diagrams don't need to show detail of the insides of the chip. They are only interested in the bond pads and some unique identifiers to show which way around the chip should be. The little happy face and other symbols are not necessarily just for fun-they are also a good reference for position and rotation.
Too many projects have been spoiled by having a completely symmetrical chip that bonds out to the wrong pins. Someone placed it the wrong way around.
Put some unique identifiers on your chip so that when you stare down through the microscope you can see quickly which way around the chip should be.
What kind of unique...
