Mixed Material Heat Sinks
from Boyd
The Aavid portfolio of folded fins includes over 3,000 different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat sinks and other fabrications. These fins can be purchased separately, bonded or brazed as part... [See More]
- Material: Aluminum; Copper; Mixed; Cupro Nickel, Inconel, Nickel Alloys, Stainless Steel
- H: 0.7600 to 50.8
- Device: Passive Heat Sink
- Heat sink Fin Style:: Folded
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Mi-Tech Metals
Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of... [See More]
- Material: Copper; Mixed; Copper and Tungsten
- Mounting: Direct Mounting
- Device: Passive Heat Sink
- Thermal Resistance: 0.5290
from Ohmite Manufacturing Co.
Custom Extrusion Heatsinks. The Ohmite AH series of aluminum extrusion heatsinks can be produced to customer requirements. Ohmite offers 34 different extrusion profiles. Each one can be modified with holes, bolt patterns, and finishes. Thermal performance of 0.6 °C/W is achieved in certain... [See More]
- Material: Aluminum; Mixed
- W: 19.05 to 311
- Device: Passive Heat Sink
- H: 9.65 to 60.71
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Ohmite Manufacturing Co.
Ohmite introduces the powerful B60/ C60 series heatsink with cam clip (Pat. Pending) or custom mounting. The B60/C60 series offers flexibility, high performance, and a compact heat sink design with exchangeable cam clip system for TO-247 and TO-264 devices. The B60 series can be tapped for popular... [See More]
- Material: Aluminum; Mixed
- L: 75
- Device: Passive Heat Sink
- W: 69.5 to 70.7
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 77
from Ohmite Manufacturing Co.
Clip Mounting For TO-247 and TO-264 Devices. Modular System with choice of clips. Multiple devices on a single extrusion. Alternate extrusion lengths available. Designed to mount 40X40 fan to provide forced convection. Complete system can be built to customer specifications. [See More]
- Material: Aluminum; Mixed
- L: 58
- Device: Passive Heat Sink
- W: 32
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Ohmite Manufacturing Co.
Ohmite ’s R2 Series (patent pending) heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the clip assure secure attachment and enhanced thermal performance. Because no screws are... [See More]
- Material: Aluminum; Mixed
- L: 35
- Device: Passive Heat Sink
- W: 22
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Ohmite Manufacturing Co.
Ohmite S Series LED Heatsinks are low cost and easy assembly heat sinks for Star LED packages supplied by Cree, Lumileds, Osram and others. This simple heat sink can hold LED modules and can be mounted simply with some thread forming screws. The Ohmite S series heatsink has two types of surface... [See More]
- Material: Aluminum; Mixed
- W: 69.8
- Device: Passive Heat Sink
- H: 12.7
from Dynatron Corp.
CPU Support : AMD ® AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Ohmite Manufacturing Co.
C Series For TO Package Heatsinks. No tool, camming clip system. Compatible with TO-264, TO-247,TO-220 and TO-126 Devices. Mount up to 3 devices per heatsink. Spring Clip delivers constant repeatable pressure. For TBH, TCH, TEH, and TFH series [See More]
- Material: Aluminum; Mixed
- L: 25 to 75
- Device: Passive Heat Sink
- W: 19.6 to 19.94
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 3U server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU... [See More]
- Material: Aluminum; Copper; Mixed
- L: 94
- Device: Active Heat Sink
- W: 89.5
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- W: 90
- L: 90
- H: 64
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU Socket : 1366. Solution : 60 x 60 x 25 mm fan with PWM... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90