Research / Surface Analysis Thin Film Equipment
from Nikon Metrology
Thin film conductive coatings are effective in eliminating charging with non-conductive materials or enhancing secondary electron emission. JEOL ’s Smart Coater is a fully automated sputter coater that applies a fine grained gold or platinum (option) coating on samples for imaging in a... [See More]
- Applications: Research / Surface Analysis
- Process: Physical Vapor Deposition; DC Magnetron Sputtering
- Type: Batch; Laboratory or Benchtop
- Materials Processed: Metal
from Technic, Inc.
Mini Plating Plant 3 – Standard Features. Four (4) polypropylene tanks 11 ” x 15 ” x 11 ” deep (7 gallon). Two (2) 1000 watt Teflon heaters with digital thermostats and low level protection. Two (2) 10 amp/18 volt DC CC/CV power supplies. Two (2) 60 minute manual timers. [See More]
- Applications: Research / Surface Analysis
from Plasma Etch, Inc.
The all aluminum chamber features over 240 square inches of active processing surface with the three level standard configuration. The clean design features an industrial powder coated frame to guard your processing environment from contamination. [See More]
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Edwards Vacuum
The newly designed BCD-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 load lock evaporation system. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes, with lift off... [See More]
- Applications: Research / Surface Analysis
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Type: Batch
- Materials Processed: Metal
from Technic, Inc.
Mini Plating Plant 5 – Standard Features. Six (6) polypropylene tanks 10 ½ ” x 6 ½ ” x 11 ” deep (3 gallon). Two (2) 500 watt Teflon heaters with digital thermostats and low level protection. Two (2) 10 amp/18 volt DC CC/CV power supplies. Two (2) 60 minute... [See More]
- Applications: Research / Surface Analysis
from Plasma Etch, Inc.
As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around the... [See More]
- Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Edwards Vacuum
The BJD-2000 & FC-2000 are our latest PVD tools for small production or R &D. These flexible evaporation systems accept a multitude of accessories to meet almost any requirement. The BJD-2000 is identical to the FC-2000 but without the load lock feature. Engineered for efficient operation,... [See More]
- Applications: Research / Surface Analysis
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Type: Batch
- Materials Processed: Metal
from Technic, Inc.
Light Induced Solar Plating of Front-Side Contacts (For Research and development applications). The plating station is 14"x28"x10" deep (approx. 12 gal.) constructed from ½" thick polypropylene with flange. Stainless steel anode fixture with hinge assembly (anode fixture is designed to... [See More]
- Applications: Photovoltaic or solar cell; Research / Surface Analysis
from Plasma Etch, Inc.
The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24 ” by 18. ”. Our oxygen service vacuum pump and booster is equipped with a two point purge system to... [See More]
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Type: Free Standing System
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Edwards Vacuum
The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38 inch... [See More]
- Applications: Research / Surface Analysis
- Materials Processed: Metal
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Wafer / Part Size: 152
from Technic, Inc.
Designed for small scale testing of copper plating of PCBs plating. Mini Electroless Copper Line – Standard Features. Seven (7) polypropylene tanks 10 ½ ” x 6 ½ ” x 11 ” deep (3 gallon). One (1) Stainless steel tank 10 ½ ” x 6 ½ ” x 11... [See More]
- Applications: Research / Surface Analysis
from Plasma Etch, Inc.
Benefits to you are better adhesion or marking, cleaner parts with less labor and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with cleaning and priming. The large all aluminum chamber accommodates a generously sized active processing surface, our... [See More]
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Type: Free Standing System
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Edwards Vacuum
The FC-4400A represents our largest scale design lift off oriented evaporation and our ultimate high throughput platform. This system is designed to support the metallization of thirty 6 inch wafers per load via high capacity e-beam evaporation. The load locked, 44 inch x 44 inch x 28 inch product... [See More]
- Applications: Research / Surface Analysis
- Materials Processed: Metal
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Wafer / Part Size: 152
from Technic, Inc.
Technic ’s Mini Mods are self-contained plating units with a built-in utility shelf for rectifiers, meters and additional controls. Mini Mod 2 - Standard Features. Two (2) polypropylene tanks 11 ” x 15 ” x 11 ” deep (7 gallon). One (1) 1000 watt Teflon heater with digital... [See More]
- Applications: Research / Surface Analysis
from Plasma Etch, Inc.
Based on our popular BT-1, it shares the same robust and reliable characteristics while providing yet another example of Plasma Etch surface modification innovation. The large all aluminum chamber accommodates a generously sized circular, rotating active processing surface has the option of... [See More]
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Type: Free Standing System
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals