Gas Control Unit Thin Film Equipment
from Plasma Etch, Inc.
Our welded aluminum vacuum chamber encloses a generous 500 square inches of active plasma processing surface. Surface modification with Plasma Etch yields increased bond strength and cleanliness of most any surface material. [See More]
- Type: Laboratory or Benchtop
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Plasma Etch, Inc.
The generous aluminum chambers accommodates a properly sized active processing surface with our standard configurations having dual bays as few as 6 or as many as 24 plasma processing levels, each 24 ” by 18. ”. Our oxygen service vacuum pump and booster is equipped with a two point... [See More]
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Plasma Etch, Inc.
The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24 ” by 18. ”. Our oxygen service vacuum pump and booster is equipped with a two point purge system to... [See More]
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Plasma Etch, Inc.
Benefits to you are better adhesion or marking, cleaner parts with less labor and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with cleaning and priming. The large all aluminum chamber accommodates a generously sized active processing surface, our... [See More]
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Plasma Etch, Inc.
Built as an extension of our MK-II platform, it offers you the same repeatability, reliability and long life, as well as low maintenance costs. The Reactive Ion Etch (RIE) electrode offers the highest directional plasma effect. Etching with our roll to roll plasma etcher in the large all aluminum... [See More]
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-10 Torr
from Plasma Etch, Inc.
Based on our popular BT-1, it shares the same robust and reliable characteristics while providing yet another example of Plasma Etch surface modification innovation. The large all aluminum chamber accommodates a generously sized circular, rotating active processing surface has the option of... [See More]
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals