Automated Loading Thin Film Equipment
from Plasma Etch, Inc.
The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24 ” by 18. ”. Our oxygen service vacuum pump and booster is equipped with a two point purge system to... [See More]
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals