Evaporation - Electron Beam Thin Film Equipment
from Edwards Vacuum
The newly designed BCD-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 load lock evaporation system. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes, with lift off... [See More]
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Applications: Research / Surface Analysis
- Type: Batch
- Materials Processed: Metal
from Edwards Vacuum
The BJD-2000 & FC-2000 are our latest PVD tools for small production or R &D. These flexible evaporation systems accept a multitude of accessories to meet almost any requirement. The BJD-2000 is identical to the FC-2000 but without the load lock feature. Engineered for efficient operation,... [See More]
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Applications: Research / Surface Analysis
- Type: Batch
- Materials Processed: Metal
from Edwards Vacuum
The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38 inch... [See More]
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Materials Processed: Metal
- Applications: Research / Surface Analysis
- Wafer / Part Size: 152
from Edwards Vacuum
The FC-4400A represents our largest scale design lift off oriented evaporation and our ultimate high throughput platform. This system is designed to support the metallization of thirty 6 inch wafers per load via high capacity e-beam evaporation. The load locked, 44 inch x 44 inch x 28 inch product... [See More]
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Materials Processed: Metal
- Applications: Research / Surface Analysis
- Wafer / Part Size: 152