Metal Thin Film Equipment
from EBARA Technologies, Inc.
Gas Inlet Devices. Patent gas inlet devices minimize rate of restriction and automatic gas inlet plunger removes restrictions without process interruptions. Second Scrubbing Chamber. Five fine spray, high velocity nozzles ensures effective removal of impurities. First Scrubbing Chamber. Coarse... [See More]
- Materials Processed: Tungsten; Metal; Silicon; Polymer; Nitrides
- Process: Chemical Vapor Deposition
- Type: Free Standing System; Cluster Tool
- Applications: Semiconductors
from Edwards Vacuum
The newly designed BCD-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 load lock evaporation system. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes, with lift off... [See More]
- Materials Processed: Metal
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Type: Batch
- Applications: Research / Surface Analysis
from Nikon Metrology
Thin film conductive coatings are effective in eliminating charging with non-conductive materials or enhancing secondary electron emission. JEOL ’s Smart Coater is a fully automated sputter coater that applies a fine grained gold or platinum (option) coating on samples for imaging in a... [See More]
- Materials Processed: Metal
- Process: Physical Vapor Deposition; DC Magnetron Sputtering
- Type: Batch; Laboratory or Benchtop
- Applications: Research / Surface Analysis
from Plasma Etch, Inc.
As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around the... [See More]
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
from Edwards Vacuum
The BJD-2000 & FC-2000 are our latest PVD tools for small production or R &D. These flexible evaporation systems accept a multitude of accessories to meet almost any requirement. The BJD-2000 is identical to the FC-2000 but without the load lock feature. Engineered for efficient operation,... [See More]
- Materials Processed: Metal
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Type: Batch
- Applications: Research / Surface Analysis
from Plasma Etch, Inc.
The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24 ” by 18. ”. Our oxygen service vacuum pump and booster is equipped with a two point purge system to... [See More]
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
- Process: Plasma Etching and Cleaning
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
from Edwards Vacuum
The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38 inch... [See More]
- Materials Processed: Metal
- Applications: Research / Surface Analysis
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Wafer / Part Size: 152
from Plasma Etch, Inc.
Benefits to you are better adhesion or marking, cleaner parts with less labor and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with cleaning and priming. The large all aluminum chamber accommodates a generously sized active processing surface, our... [See More]
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
- Process: Plasma Etching and Cleaning
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards