Integral Process Controller Thin Film Equipment
from Edwards Vacuum
The newly designed BCD-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 load lock evaporation system. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes, with lift off... [See More]
- Type: Batch
- Applications: Research / Surface Analysis
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Materials Processed: Metal
from Plasma Etch, Inc.
As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around the... [See More]
- Type: Laboratory or Benchtop
- Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Edwards Vacuum
The BJD-2000 & FC-2000 are our latest PVD tools for small production or R &D. These flexible evaporation systems accept a multitude of accessories to meet almost any requirement. The BJD-2000 is identical to the FC-2000 but without the load lock feature. Engineered for efficient operation,... [See More]
- Type: Batch
- Applications: Research / Surface Analysis
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Materials Processed: Metal
from Plasma Etch, Inc.
The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24 ” by 18. ”. Our oxygen service vacuum pump and booster is equipped with a two point purge system to... [See More]
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Edwards Vacuum
The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38 inch... [See More]
- Process: Physical Vapor Deposition; Electron Beam Evaporation
- Materials Processed: Metal
- Applications: Research / Surface Analysis
- Wafer / Part Size: 152
from Plasma Etch, Inc.
Benefits to you are better adhesion or marking, cleaner parts with less labor and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with cleaning and priming. The large all aluminum chamber accommodates a generously sized active processing surface, our... [See More]
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals