Medium (< 1, >10-3 torr) Thin Film Equipment
from Plasma Etch, Inc.
The all aluminum chamber features over 240 square inches of active processing surface with the three level standard configuration. The clean design features an industrial powder coated frame to guard your processing environment from contamination. [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Applications: Research / Surface Analysis; Printed Circuit Boards
from Plasma Etch, Inc.
As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around the... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
from Plasma Etch, Inc.
Our welded aluminum vacuum chamber encloses a generous 500 square inches of active plasma processing surface. Surface modification with Plasma Etch yields increased bond strength and cleanliness of most any surface material. [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Applications: Research / Surface Analysis; Printed Circuit Boards
from Plasma Etch, Inc.
This system is made for smaller production facilities, R &D facilities and universities. The system features an implosion proof 6 ” w x 6 ” d x 4 ” h Rectangular welded Aluminum Vacuum Chamber and a direct powered RF electrode. Applications include medical devices, solar cells,... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
from Plasma Etch, Inc.
This system is made for smaller production facilities, R &D facilities and universities. The system features an implosion proof 8 ” w x 8 ” d x 4 ” h Rectangular welded Aluminum Vacuum Chamber and a direct powered RF electrode. Applications include medical devices, solar cells,... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
from Plasma Etch, Inc.
The generous aluminum chambers accommodates a properly sized active processing surface with our standard configurations having dual bays as few as 6 or as many as 24 plasma processing levels, each 24 ” by 18. ”. Our oxygen service vacuum pump and booster is equipped with a two point... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-10 Torr
- Process: Plasma Etching and Cleaning
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
from Plasma Etch, Inc.
The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24 ” by 18. ”. Our oxygen service vacuum pump and booster is equipped with a two point purge system to... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-10 Torr
- Process: Plasma Etching and Cleaning
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
from Plasma Etch, Inc.
Benefits to you are better adhesion or marking, cleaner parts with less labor and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with cleaning and priming. The large all aluminum chamber accommodates a generously sized active processing surface, our... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards
from Plasma Etch, Inc.
Built as an extension of our MK-II platform, it offers you the same repeatability, reliability and long life, as well as low maintenance costs. The Reactive Ion Etch (RIE) electrode offers the highest directional plasma effect. Etching with our roll to roll plasma etcher in the large all aluminum... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-10 Torr
- Applications: Research / Surface Analysis; Printed Circuit Boards
- Process: Plasma Etching and Cleaning
- Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from Plasma Etch, Inc.
Based on our popular BT-1, it shares the same robust and reliable characteristics while providing yet another example of Plasma Etch surface modification innovation. The large all aluminum chamber accommodates a generously sized circular, rotating active processing surface has the option of... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Free Standing System
- Applications: Research / Surface Analysis; Printed Circuit Boards