Physical Vapor Deposition (PVD) Thin Film Equipment Datasheets

Cluster Tool Systems -- UNIVEX C
from Leybold USA Inc.

Cluster-Tool Systems UNIVEX C. For special applications we can also supply cluster systems based on the UNIVEX concept. These clusters are equipped according to customer requirements and incorporate separate processing, load lock and transfer chambers. Frequently sputter applications are involved... [See More]

  • Process: Physical Vapor Deposition; Resistance Evaporation (optional feature); Electron Beam Evaporation (optional feature); DC_Sputter (optional feature); RF_Sputter (optional feature); Multiple Processes; Vacuum Etching
  • Applications: Semiconductors
  • Type: Free Standing System; Cluster Tool
  • Materials Processed: Metal; Polymer
Fully Automated Sputter Coater -- JEOL Smart Coater
from Nikon Metrology

Thin film conductive coatings are effective in eliminating charging with non-conductive materials or enhancing secondary electron emission. JEOL ’s Smart Coater is a fully automated sputter coater that applies a fine grained gold or platinum (option) coating on samples for imaging in a... [See More]

  • Process: Physical Vapor Deposition; DC Magnetron Sputtering
  • Applications: Research / Surface Analysis
  • Type: Batch; Laboratory or Benchtop
  • Materials Processed: Metal
Temescal -- BCD-2800
from Edwards Vacuum

The newly designed BCD-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 load lock evaporation system. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes, with lift off... [See More]

  • Process: Physical Vapor Deposition; Electron Beam Evaporation
  • Applications: Research / Surface Analysis
  • Type: Batch
  • Materials Processed: Metal