Shipping Tube / Stick Magazine Insulated Gate Bipolar Transistors (IGBT)
from DigiKey
IGBT TRENCH FS 600V 60A TO-247N [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -55 to 150
- Structure: Trench Field Stop
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1324937-APT150GN60J. Category: Discrete Semiconductor Products >Transistors - IGBTs - Modules. Packaging: Tube. Standard Package: 1. Mounting: Chassis Mount. Power - Max: 536 W. Configuration: Single. Input: Standard. IGBT Type: Trench... [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 600
- Package Type: SOT3; ISOTOP
from Infineon Technologies AG
600 V, 15 A IGBT Discrete in TO220 package. Hard-switching 600 V, 15 A single TRENCHSTOP ™ IGBT3 in a TO220 package, leads to significant improvement of static as well as dynamic performance of the device, due to combination of trench-cell and fieldstop concept. The combination of IGBT with... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 2 to 20
- VCE(on): 600
- tr: 11
from Rochester Electronics
Buffer or Inverter Based IGBT/MOSFET Driver, 4A, CMOS, PDSO8 [See More]
- Packing Method: Tube; Tube
- Package Type: SOIC8
from DigiKey
IGBT TRENCH FS 600V 40A TO-247 [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -55 to 150
- Structure: Trench Field Stop
from Win Source Electronics
Manufacturer: Vishay Semiconductor Opto Division. Win Source Part Number: 1279690-VO3120. Packaging: Tube. Mounting Style: Through Hole. Approvals: cUR, UR. Technology: Optical Coupling. Current - Output High, Low: 2.5A, 2.5A. Voltage - Isolation: 5300Vrms. Current - Peak Output: 2.5A. Categories:... [See More]
- Packing Method: Tube; Tube
- Package Type: SOT3
- TJ: -40 to 110
from Infineon Technologies AG
600 V, 20 A IGBT Discrete in TO-247 package. High speed 600 V, 20 A single TRENCHSTOP ™ IGBT3 in a TO247 package provides the best compromise between switching and conduction losses. The key feature of this family is a MOSFET-like turn-off switching behavior, leading to low turn off losses. [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 20 to 100
- VCE(on): 600
- tr: 23
from Rochester Electronics
AEC 101 Qualified, 650V, 40A Fieldstop 4 trench IGBT [See More]
- Packing Method: Tube; Tube
- Package Type: TO-247; TO-247-3LD
from DigiKey
IGBT 2500V 75A TO-264AA [See More]
- Packing Method: Tube
- Package Type: TO-264-3, TO-264AA
from Win Source Electronics
Manufacturer: Fairchild/ON Semiconductor. Win Source Part Number: 197246-10N120BND. Packaging: Tube/Rail. Mounting: Through Hole. Reverse Recovery Time (trr): 70ns. IGBT Type: NPT. Input Type: Standard. Gate Charge: 100nC. Categories: Discrete Semiconductor Products. Status: Not For New Designs. [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 298000
- VCE(on): 2.7
- TJ: -55 to 150
from Infineon Technologies AG
600 V, 30 A IGBT Discrete in TO-247 package. High speed 600 V, 30 A single TRENCHSTOP ™ IGBT3 in a TO247 package provides the best compromise between switching and conduction losses. The key feature of this family is a MOSFET-like turn-off switching behavior, leading to low turn off losses. [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 20 to 100
- VCE(on): 600
- tr: 30
from Rochester Electronics
Automotive IGBT Discretes [See More]
- Packing Method: Tube; Tube
- Package Type: TO-263; TO-263-3, D2PAK
from DigiKey
IGBT PT 1200V 48A TO-247AD [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -55 to 150
- Structure: PT
from Win Source Electronics
Manufacturer: Fairchild/ON Semiconductor. Win Source Part Number: 052105-11N120CND. Packaging: Tube/Rail. Mounting: Through Hole. Reverse Recovery Time (trr): 70ns. IGBT Type: NPT. Input Type: Standard. Gate Charge: 100nC. Categories: Discrete Semiconductor Products. Status: Not For New Designs. [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 298000
- VCE(on): 2.4
- TJ: -55 to 150
from Infineon Technologies AG
To further enhance the best-in-class performance of the TRENCHSTOP ™ 5 IGBT technology, Infineon offers the technology in a high power package with an extra Kelvin emitter pin. The TO-247 4pin provides ultra-low inductance to the gate-emitter control loop and brings TRENCHSTOP ™ 5 IGBT... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 30 to 100
- VCE(on): 650
- tr: 9
from Rochester Electronics
Automotive IGBT Discretes [See More]
- Packing Method: Tube; Tube
- Package Type: SUPER220
from DigiKey
IGBT 2500V 5.5A TO-268AA [See More]
- Packing Method: Tube
- Package Type: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
- TJ: -55 to 150
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1016960-AOK10B60D. Packaging: Tube/Rail. Mounting: Through Hole. Reverse Recovery Time (trr): 105ns. Input Type: Standard. Gate Charge: 17.4nC. Categories: Discrete Semiconductor Products. Status: Active. Temperature Range -... [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 163000
- VCE(on): 1.8
- TJ: -55 to 175
from Infineon Technologies AG
1350 V, 20 A IGBT Discrete with anti-parallel diode in TO-247 package. The Reverse Conducting R5 1350 V, 20 A RC-H5 IGBTs with monolithically integrated reverse conducting diode in a TO-247 package has been optimized for the demanding requirements of Induction Cooking applications. With a... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 8 to 60
- VCE(on): 1350
- tf: 50
from Rochester Electronics
FGA180N33ATD - IGBT-Single 330V 180A 390W (Tc) TO-3P-3 Tube [See More]
- Packing Method: Tube; Tube
- Package Type: TO-3; TO-3PN-3
from DigiKey
IGBT PT 650V 180A TO-247AD [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -55 to 175
- Structure: PT
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1016962-AOK15B60D. Packaging: Tube/Rail. Mounting: Through Hole. Reverse Recovery Time (trr): 196ns. Input Type: Standard. Gate Charge: 25.4nC. Categories: Discrete Semiconductor Products. Status: Active. Temperature Range -... [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 167000
- VCE(on): 1.8
- TJ: -55 to 175
from Infineon Technologies AG
650 V, 40 A IGBT with monolithically integrated diode in TO-247 package. Reverse Conducting R6 650 V, 40 A IGBT in TO-247 package with monolithically integrated diode is designed to fulfill demanding requirements of induction heating applications using half-bridge resonant topology. Thanks to best... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 20 to 75
- VCE(on): 650
- tr: 19
from Rochester Electronics
IGBT, 650 V, 40 A Field Stop Trench 650 V, 40 A Field Stop Trench IGBT [See More]
- Packing Method: Tube; Tube
- Package Type: TO-3; TO-3PF-3L
from DigiKey
IGBT 650V 50A TO-263AA [See More]
- Packing Method: Tube
- Package Type: TO-263; TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- TJ: -55 to 175
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1016965-AOK20B135D1. Packaging: Tube/Rail. Mounting: Through Hole. Input Type: Standard. Gate Charge: 66nC. Categories: Discrete Semiconductor Products. Status: Active. Temperature Range - Operating: -55 °C to 175... [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 340000
- VCE(on): 1.8
- TJ: -55 to 175
from Infineon Technologies AG
650 V, 8 A IGBT with anti-parallel diode in TO-220 package. High Speed 650 V, 8 A hard-switching IGBT TRENCHSTOP ™ 5 co-packed with RAPID 1 fast and soft anti-parallel diode in a TO-220 package, is defined as "best-in-class" IGBT. Summary of Features. 650 V breakthrough voltage. Compared to... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 30 to 100
- VCE(on): 650
- tr: 5
from Rochester Electronics
IGBT, 650V, 40A Field Stop Trench [See More]
- Packing Method: Tube; Tube
- Package Type: TO-247; TO-247 3L
from DigiKey
IGBT 4500V 23A ISOPLUS I4-PAC [See More]
- Packing Method: Tube
- Package Type: ISOPLUSi5-PAK™
- TJ: -55 to 150
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 805826-AOK20B135E1. Packaging: Tube. Mounting Style: Through Hole. Power - Max: 250W. Current - Collector Pulsed (Icm): 80A. Switching Energy: 800 μJ (off). Input Type: Standard. Gate Charge: 58nC. Test Condition: 600V,... [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 1350
- Package Type: TO-247; SOT3
from Infineon Technologies AG
600 V, 30 A IGBT with anti-parallel diode in TO-247 package. Hard-switching 600 V, 30 A high speed TRENCHSTOP ™ IGBT3 co-packed with Rapid 1 fast and soft anti-parallel diode in a TO-247 advanced isolation package for a best cost efficient solution. Summary of Features. TRENCHSTOP ™... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 18 to 60
- VCE(on): 600
- tr: 34
from Rochester Electronics
FGI3040G2-F085C - Ignition IGBT, N-Channel Ignition, DPAK, 450V 1.3V, EcoSPARK II [See More]
- Packing Method: Tube; Tube
- Package Type: TO-220; TO-220-JDEC
- Polarity: N-Channel
from DigiKey
IGBT NPT 1200V 25A 156W Through Hole TO-247 [B] [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -55 to 150
- Structure: NPT
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1003003-AOK20B60D1. Packaging: Tube/Rail. Mounting: Through Hole. Reverse Recovery Time (trr): 107ns. Input Type: Standard. Gate Charge: 24.6nC. Categories: Discrete Semiconductor Products. Status: Active. Temperature Range -... [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 167000
- VCE(on): 2.4
- TJ: -55 to 175
from Infineon Technologies AG
650 V, 40 A IGBT in TO-247 advanced isolation package. Hard-switching 650 V, 40 A TRENCHSTOP ™ 5 H5 IGBT discrete in TO-247 advanced isolation package is the highest efficiency discrete IGBT technology on the market ideally suited for customers who are looking for outstanding efficiency and... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 30 to 100
- VCE(on): 650
- tr: 29
from Rochester Electronics
600V, SMPS IGBT [See More]
- Packing Method: Tube; Tube
- Package Type: TO-220; TO-220-3
from DigiKey
IGBT NPT 1200V 25A 156W Through Hole TO-220 [K] [See More]
- Packing Method: Tube
- Package Type: TO-220; TO-220-3
- TJ: -55 to 150
- Structure: NPT
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 804764-AOK20B65M2. Packaging: Tube. Mounting Style: Through Hole. Power - Max: 227W. Reverse Recovery Time (trr): 292ns. Current - Collector Pulsed (Icm): 60A. Switching Energy: 580 μJ (on), 280 μJ (off). Input... [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 650
- Package Type: TO-247; SOT3
from Infineon Technologies AG
600 V, 120 A IGBT discrete with anti-parallel diode in TO-247PLUS package. Hard switching 600 V, 120 A TRENCHSTOP ™ IGBT technology in a TO-247PLUS package for higher current capability. The TO-247PLUS package allows up to 120 A in 600 V with the same outer dimensions as the industry standard... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 2 to 20
- VCE(on): 600
- tr: 75
from Rochester Electronics
Discrete IGBT without Anti-Parallel Diode [See More]
- Packing Method: Tube; Tube
- Package Type: FULLPAK220
from DigiKey
IGBT Trench Field Stop 600V 40A 136W Through Hole TO-247-3 [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -55 to 175
- Structure: Trench Field Stop
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1016972-AOK30B135W1. Packaging: Tube/Rail. Mounting: Through Hole. Input Type: Standard. Gate Charge: 62nC. Categories: Discrete Semiconductor Products. Status: Active. Temperature Range - Operating: -55 °C to 175... [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 340000
- VCE(on): 2.2
- TJ: -55 to 175
from Infineon Technologies AG
1200 V, 8 A IGBT7 S7 with anti-parallel diode in TO-247 package. Hard-switching 1200 V, 8 A TRENCHSTOP ™ IGBT7 S7 discrete in TO-247 package with EC7 diode inside. It offers low VCEsat to achieve very low conduction losses in target applications and the co-packed very soft and fast emitter... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 2 to 20
- VCE(on): 1200
- tr: 15
from Rochester Electronics
IKZ75N65 - Discrete IGBT with Anti-Parallel Diode [See More]
- Packing Method: Tube; Tube
- Package Type: PG-TO247-4
from DigiKey
IGBT Trench Field Stop 600V 40A 136W Surface Mount D3PAK [See More]
- Packing Method: Tube
- Package Type: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
- TJ: -55 to 175
- Structure: Trench Field Stop
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 768554-AOK40B60D1. Series: Alpha IGBT. Packaging: Tube. Mounting Style: Through Hole. Operating Temperature Range: -55 °C ~ 150 °C (TJ). Package: TO-247-3. Power - Max: 278W. Reverse Recovery Time (trr): 127ns. [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 150
- VCES: 600
- Package Type: TO-247; SOT3
from Infineon Technologies AG
1200 V, 15 A IGBT with anti-parallel diode in TO-247 package. Hard-switching 1200 V, 15 A high speed TRENCHSTOP ™ IGBT6 in a TO-247 package co-packed with a very soft and fast recovery anti-parallel diode is optimized for the best compromise between switching and conduction losses. Summary of... [See More]
- Packing Method: Tube; TUBE
- tr: 29
- Switching Speed: 18 to 60
- tf: 27
from Rochester Electronics
Buffer or Inverter Based IGBT/MOSFET Driver, 0.5A, CMOS, PQCC32 [See More]
- Packing Method: Tube; Tube
- Package Type: PLCC44
from DigiKey
IGBT PT 1200V 96A 540W Through Hole T-MAX ™ [B2] [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3 Variant
- TJ: -55 to 150
- Structure: PT
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1016975-AOK40B65H1. Packaging: Tube/Rail. Mounting: Through Hole. Reverse Recovery Time (trr): 346ns. Input Type: Standard. Gate Charge: 63nC. Categories: Discrete Semiconductor Products. Status: Active. Temperature Range -... [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 300000
- VCE(on): 2.4
- TJ: -55 to 175
from Infineon Technologies AG
650 V, 20 A IGBT with anti-parallel diode in TO-247 package. Hard-switching 650 V, 20 A TRENCHSTOP ™ IGBT7 discrete in TO-247 package with soft EC7 diode inside. This price performance optimized range has premium controllability for the better EMI while switching losses are lower than the... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 5 to 40
- VCE(on): 650
- tr: 6
from Rochester Electronics
Half Bridge Based IGBT/MOSFET Driver [See More]
- Packing Method: Tube; Tube
- Package Type: SOIC14
from DigiKey
IGBT TRENCH FS 600V 75A TO-247L [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -40 to 175
- Structure: Trench Field Stop
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 804442-AOK40B65M3. Packaging: Tube. Mounting Style: Through Hole. Power - Max: 300W. Reverse Recovery Time (trr): 365ns. Current - Collector Pulsed (Icm): 120A. Switching Energy: 1.3mJ (on), 500 μJ (off). Input Type:... [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 650
- Package Type: TO-247; SOT3
from Infineon Technologies AG
650 V, 75 A IGBT Discrete with CoolSiC ™ diode. 650 V, 75 A TRENCHSTOP ™ 5 H5 IGBT co-packed with half-rated 6th generation CoolSiC ™ Schottky barrier diode in TO-247-3 package. The ultra-fast 650 V hard-switching TRENCHSTOP ™ 5 H5 IGBT benefits very low switching losses at... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 40 to 100
- VCE(on): 650
- tr: 9
from Rochester Electronics
Half Bridge Based IGBT/MOSFET Driver [See More]
- Packing Method: Tube; Tube
- Package Type: PDIP8
from DigiKey
IGBT Trench Field Stop 650V 91A 278W Through Hole TO-247-3 [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -55 to 150
- Structure: Trench Field Stop
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 808749-AOK50B65M2. Packaging: Tube. Mounting Style: Through Hole. Power - Max: 500W. Reverse Recovery Time (trr): 327ns. Current - Collector Pulsed (Icm): 150A. Switching Energy: 2.09mJ (on), 1.03mJ (off). Input Type:... [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 650
- Package Type: TO-247; SOT3
from Infineon Technologies AG
650 V, 20 A IGBT with anti-parallel diode in TO-247-3-HCC package. High speed 650 V, 20 A reverse conducting TRENCHSTOP ™ 5 WR6 IGBT in high creepage and clearance TO-247-3-HCC package. It is specifically optimized for PFC for RAC / CAC and Welding inverter application. Excellent... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 20 to 75
- VCE(on): 650
- tr: 13
from Rochester Electronics
Buffer or Inverter Based IGBT/MOSFET Driver [See More]
- Packing Method: Tube; Tube
- Package Type: SSOP32
from DigiKey
IGBT TRENCH FS 650V 91A TO-247-3 [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: 175
- Structure: Trench Field Stop
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1016979-AOK60B60D1. Packaging: Tube/Rail. Mounting: Through Hole. Reverse Recovery Time (trr): 137ns. Input Type: Standard. Gate Charge: 75nC. Categories: Discrete Semiconductor Products. Status: Active. Temperature Range -... [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 417000
- VCE(on): 2.4
- TJ: -55 to 150
from Infineon Technologies AG
1200 V, 50 A IGBT with anti-parallel diode in TO-247PLUS package. Hard-switching 1200 V, 50 A HighSpeed 3 H3 in TO-247PLUS 4pin package. Higher current capability, improved thermal behaviour, extended C-E creepage are the key features of the TO-247PLUS package. The 4pin package configuration... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 18 to 60
- VCE(on): 1200
- tr: 29
from Rochester Electronics
High Speed IGBT [See More]
- Packing Method: Tube; Tube
- Package Type: TO-220; TO-220-3FP
from DigiKey
IGBT [See More]
- Packing Method: Tube
- Package Type: i4-Pac™-4, Isolated
- TJ: -55 to 150
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 812211-AOK75B60D1. Packaging: Tube. Mounting Style: Through Hole. Power - Max: 500W. Reverse Recovery Time (trr): 147ns. Current - Collector Pulsed (Icm): 290A. Switching Energy: 3.7mJ (on), 1.3mJ (off). Input Type: Standard. [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 150
- VCES: 600
- Package Type: TO-247; SOT3
from Infineon Technologies AG
1200 V, 40 A IGBT with anti-parallel diode in TO-247-4 package. Hard-switching 1200 V, 40 A high speed TRENCHSTOP ™ IGBT6 in a TO-247PLUS 4pin package co-packed with a soft and fast recovery full current anti-parallel diode is the responding to the market requirements for high efficiency and... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 10 to 50
- VCE(on): 1200
- tr: 27
from Rochester Electronics
Buffer or Inverter Based IGBT/MOSFET Driver, 4A, PDSO16 [See More]
- Packing Method: Tube; Tube
- Package Type: SOIC16
from DigiKey
IGBT PT 1200V Through Hole TO-247AB [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -40 to 150
- Structure: PT
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1144956-AOKS30B60D1. Packaging: Tube. Mounting Style: Through Hole. Current - Collector Pulsed (Icm): 96A. Switching Energy: 1.1mJ (on), 240 μJ (off). Input Type: Standard. Gate Charge: 34nC. Test Condition: 400V, 30A,... [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 150
- VCES: 600
- Package Type: TO-247; SOT3
from Infineon Technologies AG
650 V, 50 A IGBT Discrete with Silicon Carbide Schottky diode. 650 V, 50A TRENCHSTOP ™ 5 S5 IGBT co-packed with full-rated 6th generation Silicon Carbide CoolSiC ™ Schottky barrier diode in Kelvin-emitter TO-247-4 package. The 650 V hard-switching TRENCHSTOP ™ 5 S5 IGBT technology... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 10 to 30
- VCE(on): 650
- tr: 9
from Rochester Electronics
Buffer or Inverter Based IGBT/MOSFET Driver, 4A, PDSO14 [See More]
- Packing Method: Tube; Tube
- Package Type: RQFN14
from DigiKey
IGBT Trench 1200V 72A 390W Through Hole ISO247 [See More]
- Packing Method: Tube
- Structure: Trench
- Package Type: TO-247; TO-247-3
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1017162-AOT10B60D. Packaging: Tube/Rail. Mounting: Through Hole. Reverse Recovery Time (trr): 105ns. Input Type: Standard. Gate Charge: 17.4nC. Categories: Discrete Semiconductor Products. Status: Active. Temperature Range -... [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 163000
- VCE(on): 1.8
- TJ: -55 to 175
from Infineon Technologies AG
Hybrid Power Discrete with SiC power technology in THD package for e-Mobility applications. Best cost-performance is the most important aspect for auxiliary applications in electric vehicles and hybrid vehicles. Therefore, Infineon has developed a hybrid of 650V TRENCHSTOP ™ 5 AUTO... [See More]
- Packing Method: Tube; TUBE
- tf: 13
- tr: 12
- Package Type: TO-247; PG-TO247-3
from Rochester Electronics
SI8281CD - Automotive Isolated SiC and IGBT driver with integrated dc-dc [See More]
- Packing Method: Tube; Tube
- Package Type: SOIC20
from DigiKey
IGBT PT 1200V 38A 165W Surface Mount TO-263HV [See More]
- Packing Method: Tube
- Structure: PT
- Package Type: TO-263; TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 768565-AOT10B65M1. Series: Alpha IGBT. Packaging: Tube. Mounting Style: Through Hole. Operating Temperature Range: -55 °C ~ 175 °C (TJ). Package: TO-220-3. Power - Max: 150W. Reverse Recovery Time (trr): 262ns. [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 650
- Package Type: TO-220; SOT3
from Infineon Technologies AG
The power module implements the second generation CoolSiC ™ Automotive MOSFET 1200 V, optimized for electric drive train applications, from mid- to high-range automotive power classes to high-range commercial, construction, and agricultural vehicles. Summary of Features. VDSS = 1200 V. IDN =... [See More]
- Packing Method: Tube; TUBE
- Transistor Grade / Operating Range: Automotive; eMobility ; Hybrid Electric Vehicles ; Drives ; CAV ; Aircon
- Package Type: PG-MDIP-11
from Rochester Electronics
SI8283BC - Isolated SiC and IGBT driver with feature-rich integrated dc-dc [See More]
- Packing Method: Tube; Tube
- Package Type: SOIC24
from DigiKey
IGBT PT 1200V 9A 45W Surface Mount TO-252AA [See More]
- Packing Method: Tube
- Structure: PT
- Package Type: TO-252 (DPAK); TO-252-3, DPAK (2 Leads + Tab), SC-63
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 803605-AOT10B65M2. Packaging: Tube. Mounting Style: Through Hole. Power - Max: 150W. Reverse Recovery Time (trr): 262ns. Current - Collector Pulsed (Icm): 30A. Switching Energy: 180 μJ (on), 130 μJ (off). Input... [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 650
- Package Type: TO-220; SOT3
from Infineon Technologies AG
HybridPACKTM DSC S1 700 V, 400 A half-bridge TRENCHSTOPTM IGBT3 including matching diodes with enhanced softness is a very compact IGBT molded module targeting hybrid and electric vehicles. Summary of Features. Increased blocking Voltage capability to 700 V. Integrated current sensor. Integrated... [See More]
- Packing Method: Tube; TUBE
- VCE(on): 1.65
- VCES: 700
- IC(max): 400
from DigiKey
IGBT PT 1200V 100A 350W Chassis Mount SOT-227B [See More]
- Packing Method: Tube
- Structure: PT
- Package Type: SOT-227-4, miniBLOC
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1145006-AOT15B60D. Series: Alpha IGBT. Packaging: Tube. Mounting Style: Through Hole. Operating Temperature Range: -55 °C ~ 175 °C (TJ). Package: TO-220-3. Power - Max: 167W. Reverse Recovery Time (trr): 196ns. [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 600
- Package Type: TO-220; SOT3
from Infineon Technologies AG
The HybridPACKTM DSC S2 is a very compact half-bridge module targeting Hybrid- and Electric Vehicle applications. The module is based on Infineon ’s long-term experience developing IGBT power modules and implements the EDT2 IGBT generation. The innovative and small package is designed for... [See More]
- Packing Method: Tube; TUBE
- VCE(on): 1.2
- VCES: 750
- IC(max): 900
from DigiKey
IGBT 3000V 86A 357W Through Hole ISOPLUS i4-PAC ™ [See More]
- Packing Method: Tube
- Package Type: i4-Pac™-5 (3 Leads)
- TJ: -55 to 150
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 768567-AOT15B65M1. Series: Alpha IGBT. Packaging: Tube. Mounting Style: Through Hole. Operating Temperature Range: -55 °C ~ 175 °C (TJ). Package: TO-220-3. Power - Max: 214W. Reverse Recovery Time (trr): 317ns. [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 650
- Package Type: TO-220; SOT3
from Infineon Technologies AG
HybridPACKTM DSC L 700 V, 200 A six-pack TRENCHSTOPTM IGBT3 including matching diodes with enhanced softness is a very compact IGBT molded module targeting hybrid and electric vehicles. Summary of Features. Increased blocking voltage capability to 700 V. Integrated current sensor. Low inductive... [See More]
- Packing Method: Tube; TUBE
- VCE(on): 1.45
- VCES: 700
- IC(max): 200
from DigiKey
IGBT 3000V 38A 200W Through Hole TO-247HV (IXBH) [See More]
- Packing Method: Tube
- Package Type: TO-247; TO-247-3
- TJ: -55 to 150
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1017227-AOT5B60D. Packaging: Tube/Rail. Mounting: Through Hole. Reverse Recovery Time (trr): 98ns. Input Type: Standard. Gate Charge: 9.4nC. Categories: Discrete Semiconductor Products. Status: Active. Temperature Range -... [See More]
- Packing Method: Rail; Tube; Tube/Rail
- PD: 82400
- VCE(on): 1.8
- TJ: -55 to 175
from Infineon Technologies AG
The automotive IGBT discrete AIKQ120N75CP2 is an EDT2 IGBT with a co-packed diode in the TO247PLUS package. The 750V EDT technology significantly improves energy efficiency and cooling efforts for high voltage automotive applications by enabling battery voltages up to 470V and safe fast switching... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 7 to 15
- VCE(on): 750
- tr: 69
from DigiKey
IGBT PT 1200V 140A Through Hole PLUS247 ™-3 [See More]
- Packing Method: Tube
- Structure: PT
- Package Type: TO-247; TO-247-3 Variant
from Win Source Electronics
Manufacturer: Alpha & Omega Semiconductor Inc. Win Source Part Number: 1145031-AOT5B65M1. Packaging: Tube. Mounting Style: Through Hole. Reverse Recovery Time (trr): 195ns. Current - Collector Pulsed (Icm): 15A. Switching Energy: 80 μJ (on), 70 μJ (off). Input Type: Standard. Gate... [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
- VCES: 650
- Package Type: TO-220; SOT3
from Infineon Technologies AG
The automotive IGBT discrete AIKQ200N75CP2 is an EDT2 IGBT with a co-packed diode in the TO247PLUS package. The 750V EDT technology significantly improves energy efficiency and cooling efforts for high voltage automotive applications by enabling battery voltages up to 470V and safe fast switching... [See More]
- Packing Method: Tube; TUBE
- Switching Speed: 7 to 15
- VCE(on): 750
- tr: 120
from Shenzhen Shengyu Electronics Technology Limited
Discrete Semiconductor Products - Transistors - IGBTs - Single [See More]
- Packing Method: Tube; Through Hole
- TJ: -55 to 175
Low VCE(sat) Type, 600V 30A, FRD Built-in, TO-247GE, Field Stop Trench IGBT
-- RGCL60TS60Dfrom ROHM Semiconductor GmbH
ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications. [See More]
- Packing Method: Tube
- TJ: -55 to 175
- PD: 111000
- Package Type: TO-247; TO-247GE
from ROHM Semiconductor USA, LLC
ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications. [See More]
- Packing Method: Tube
- TJ: -55 to 175
- PD: 54000
- Transistor Grade / Operating Range: Commercial
from Utmel Electronic Limited
1200V/15A RC IGBT FSII TO [See More]
- Packing Method: Tube; Tube
- PD: 333000
- IC(max): 30
- TJ: -40 to 175
from Acme Chip Technology Co., Limited
IGBT WITH SIC COPACK DIODE IGBT [See More]
- Packing Method: Tube; Tube
- Package Type: Automotive
from Shenzhen Shengyu Electronics Technology Limited
Discrete Semiconductor Products - Transistors - IGBTs - Single [See More]
- Packing Method: Tube; Through Hole
- TJ: -55 to 150
Low VCE(sat) Type, 600V 30A, FRD Built-in, TO-3PFM, Field Stop Trench IGBT
-- RGCL60TK60Dfrom ROHM Semiconductor GmbH
ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications. [See More]
- Packing Method: Tube
- TJ: -55 to 175
- PD: 54000
- Package Type: TO-3PFM
from Utmel Electronic Limited
650V FS4 TRENCH IGBT [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
from Acme Chip Technology Co., Limited
SIC_DISCRETE [See More]
- Packing Method: Tube; Tube
- Package Type: Automotive
from Shenzhen Shengyu Electronics Technology Limited
IGBT STD 600V 60A TO-220AB [See More]
- Packing Method: Tube; Tube
from ROHM Semiconductor GmbH
The RGS30TSX2HR is a 10 μs SCSOA guaranteed IGBT, suitable for Heater of Automotive. The RGS series delivers low conduction loss that contributes to reducing size and to improving efficiency of applications. This product complies AEC-Q101 qualification. [See More]
- Packing Method: Tube
- TJ: -55 to 175
- PD: 267000
- Package Type: TO-247; TO-247N
from Utmel Electronic Limited
FAIRCHILD SEMICONDUCTOR FGL60N100BNTDIGBT Single Transistor, 60 A, 2.9 V, 180 W, 1 kV, TO-264, 3 Pins [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: NPN
- VCE(on): 1.5
from Acme Chip Technology Co., Limited
IGBT 600V TO247-3 [See More]
- Packing Method: Tube; Tube
- Package Type: Automotive
from Shenzhen Shengyu Electronics Technology Limited
FS3 T TO247 40A 650V AUTO [See More]
- Packing Method: Tube; Tube
- Package Type: Automotive
- TJ: -55 to 175
from ROHM Semiconductor GmbH
RGT20TM65D is a Field Stop Trench IGBT with low collector - emitter saturation voltage, suitable for General Inverter, UPS, Power Conditioner, Welder. [See More]
- Packing Method: Tube
- TJ: -55 to 175
- PD: 25000
- Package Type: TO-220; TO-220NFM
from Utmel Electronic Limited
FAIRCHILD SEMICONDUCTOR HGTG27N120BN IGBT Single Transistor, 72 A, 2.7 V, 500 W, 1.2 kV, TO-247, 3 Pins [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- VCE(on): 2.45
from Acme Chip Technology Co., Limited
IGBT 600V 20A TRENCH TO-247N [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 650V TO247-3 [See More]
- Packing Method: Tube; Tube
- Package Type: Automotive
- TJ: -40 to 175
from ROHM Semiconductor GmbH
ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications. [See More]
- Packing Method: Tube
- TJ: -55 to 175
- PD: 133000
- Package Type: TO-262
from Utmel Electronic Limited
IC PREDRIVER IGBT IGNITION 8DIP [See More]
- Packing Method: Tube; Tube
- TJ: -40 to 150
from Acme Chip Technology Co., Limited
IGBT 600V-X TO247 TUBE 0.45K [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IC DISCRETE 600V TO220-3 [See More]
- Packing Method: Tube; Tube
from ROHM Semiconductor GmbH
BM63373S-VA/-VC is an Intelligent Power Module composed of gate drivers, bootstrap diodes, IGBTs, fly wheel diodes. [See More]
- Packing Method: Tube
- Package Type: HSDIP25
- TJ: -40 to 125
- Transistor Grade / Operating Range: Commercial
from Utmel Electronic Limited
IGBT 1000V 50A 156W TO3P [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- VCE(on): 1.5
from Acme Chip Technology Co., Limited
1200V 40A FSIII IGBT LOW VCESAT [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IC DISCRETE 600V TO247-3 [See More]
- Packing Method: Tube; Tube
- Package Type: Automotive
from ROHM Semiconductor GmbH
BM63373S-VA/-VC is an Intelligent Power Module composed of gate drivers, bootstrap diodes, IGBTs, fly wheel diodes. [See More]
- Packing Method: Tube
- Package Type: HSDIP25VC
- TJ: -40 to 125
- Transistor Grade / Operating Range: Commercial
from Utmel Electronic Limited
IGBT 1200V 16A 138W TO220-3 [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- IC(max): 16
from Acme Chip Technology Co., Limited
IGBT MODULE 100A SINGLE 600V LOW [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 600V 20A 163W TO247 [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 1200V 22A 100W TO220 [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- IC(max): 22
from Acme Chip Technology Co., Limited
IGBT MODULE 75A SINGLE 1200V HIG [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 600V 20A 163W TO220 [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 1200V 30A 150W TO247AD [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- IC(max): 30
from Acme Chip Technology Co., Limited
IGBT 600V 10A 60W TO220SM [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 650V 10A TO220 [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 1200V 40A 288W TO247 [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- IC(max): 40
from Acme Chip Technology Co., Limited
IGBT 600V 30A 170W TO3PN [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 600V 20A 42W TO220F [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 1200V 46A 313W TO247-3 [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- TJ: -55 to 150
from Acme Chip Technology Co., Limited
PB-F IGBT / TRANSISTOR TO-3PN IC [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT MOD 650V 165A 430W ISOTOP [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 1200V 60A 300W TO247AD [See More]
- Packing Method: Tube; Tube
- IC(max): 60
- VCE(on): 2.28
- tr: 25
from Acme Chip Technology Co., Limited
IGBT TRENCH [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 1200V 245A 960W TMAX [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 150
from Utmel Electronic Limited
IGBT 1200V 60A 300W TO247AD [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- VCE(on): 2.4
from Acme Chip Technology Co., Limited
INDUSTRY 14 PG-HSIP247-3 [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 600V 229A 625W TO264 [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 175
from Utmel Electronic Limited
IGBT 1200V 70A 320W TO247AC [See More]
- Packing Method: Tube; Tube
- VCE(on): 2.4
- Polarity: N-Channel; N-CHANNEL
- IC(max): 70
from Acme Chip Technology Co., Limited
INDUSTRY 14 [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 1200V 25A 156W TO247 [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 150
from Utmel Electronic Limited
IGBT 1200V 80A 555W TO247-3 [See More]
- Packing Method: Tube; Tube
- VCE(on): 1.8
- Polarity: N-Channel; N-CHANNEL
- IC(max): 80
from Acme Chip Technology Co., Limited
INDUSTRY 14 [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 1200V 25A 156W TO220 [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 150
from Utmel Electronic Limited
IGBT 300V 170A 330W TO3P [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- IC(max): 170
from Acme Chip Technology Co., Limited
INDUSTRY 14 [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT NPT COMBI 1200V 20A TO-247 [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 300V 400A TO264AA [See More]
- Packing Method: Tube; Tube
- IC(max): 400
from Acme Chip Technology Co., Limited
INDUSTRY 14 [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT FIELDSTOP COMBI 600V 20A TO [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 400V [See More]
- Packing Method: Tube; Tube
- TJ: -40 to 150
- PD: 1800
from Acme Chip Technology Co., Limited
INDUSTRY 14 [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 1200V 88A 500W D3PAK [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 400V 45W IPAK [See More]
- Packing Method: Tube; Tube
- PD: 45000
- VCE(on): 4.5
- TJ: -40 to 150
from Acme Chip Technology Co., Limited
IGBT TRENCH [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT MODULE 900V 87A 284W ISOTOP [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 4500V 30A TO-247HV [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 150
from Acme Chip Technology Co., Limited
IGBT TRENCH [See More]
- Packing Method: Tube; Tube
- Package Type: 210 A
from Shenzhen Shengyu Electronics Technology Limited
IGBT 600V 87A 283W SOT-227 [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 600V 10A 25W TP220FP [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- VCE(on): 1.45
from Acme Chip Technology Co., Limited
INDUSTRY 14 [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT FIELDSTOP COMBI 600V 50A TO [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 600V 110A 284W TO247 [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- VCE(on): 1.15
from Acme Chip Technology Co., Limited
CIPOS MICRO [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT MOD 600V 130A 431W ISOTOP [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 600V 13A 60W D2PAK [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- VCE(on): 2.6
from Acme Chip Technology Co., Limited
CIPOS MICRO [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT 1200V 200A 833W TO264 [See More]
- Packing Method: Tube; Tube
- TJ: -55 to 150
from Utmel Electronic Limited
IGBT 600V 13A 60W TO220 [See More]
- Packing Method: Tube; Tube
- IC(max): 13
- VCE(on): 2.1
- PD: 60000
from Acme Chip Technology Co., Limited
IGBT 600V 19A 60W TO220-3 [See More]
- Packing Method: Tube; Tube
from Shenzhen Shengyu Electronics Technology Limited
IGBT MODULE 600V 430A 1150W SP6 [See More]
- Packing Method: Tube; Tube
from Utmel Electronic Limited
IGBT 600V 14A 38W DPAK [See More]
- Packing Method: Tube; Tube
- Transistor Technology / Material: SILICON
- Polarity: N-Channel; N-CHANNEL
- VCE(on): 1.7
from Acme Chip Technology Co., Limited
IGBT 1200V ULTRA FAST TO247 [See More]
- Packing Method: Tube; Tube