Heat Transfer Industrial Greases

17 Results
Lightweight Thermal Conductive Putty -- DTT04-s
from Shiu Li Technology Co., Ltd

LiPOLY's DTT04-s is a low-density gap filler material and lightweight properties improve product performance, reduceproduction costs, and reduce material use and energy consumption [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Specific Gravity: 2.3
  • Viscosity Index: 1000
  • Use Temperature: -76 to 302
Non-Silicone Thermal Conductive Putty -- N-Putty
from Shiu Li Technology Co., Ltd

LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot. [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Thermal Conductivity: 3.5
  • Use Temperature: -76 to 302
  • Dielectric Strength: 1.18E7
Non-Silicone Thermal Conductive Putty -- N-putty3-s
from Shiu Li Technology Co., Ltd

LiPOLY N-putty3-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 7.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It can also overcome... [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Specific Gravity: 3.4
  • Viscosity Index: 25000
  • Use Temperature: -76 to 302
Non-Silicone Thermal Conductive Putty -- N-putty5-s
from Shiu Li Technology Co., Ltd

LiPOLY N-putty5-s series is a non-silicon thermally conductive material without volatilization of lowmolecular siloxane, and low total volatile gas. With a thermal conductivity of 9.0 W/m*K, the highdeformation can perfectly fill small air gaps to eliminate tolerances. It can also overcome... [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Specific Gravity: 3.3
  • Viscosity Index: 25000
  • Use Temperature: -76 to 302
Non-Silicone Thermal Grease Series -- G3380NA/NJ/NK/NT
from Shiu Li Technology Co., Ltd

Non-Silicone Thermal Compound G3380N is made of non-silicon resin material and pollution of optical surfaces. Low thermal resistance and great thermal conductivity. G3380N has been used extensively in Consumer electronics and Microprocessors for their thermal control techniques. The grease can cover... [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Specific Gravity: 2.2 to 2.8
  • Viscosity Index: 96 to 146
  • Use Temperature: -76 to 302
Thermal Conductive Putty -- DTT13
from Shiu Li Technology Co., Ltd

LiPOLY DTT13 is a one-part dispensable material with thermal conductivity 13.0 W/m*K. High deformation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying problems to increase the thermal conductivity. DTT13 is a great alternative to thermal grease and... [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Specific Gravity: 3.3
  • Viscosity Index: 20000
  • Use Temperature: -76 to 356
Thermal Conductive Putty -- H-PUTTY
from Shiu Li Technology Co., Ltd

Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line thickness of... [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Thermal Conductivity: 3.5
  • Use Temperature: -76 to 356
  • Dielectric Strength: 1.18E7
Thermal Conductive Putty -- S-PUTTY
from Shiu Li Technology Co., Ltd

Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues with overflow and solve drying problems to... [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Thermal Conductivity: 3.5
  • Use Temperature: -76 to 356
  • Dielectric Strength: 1.18E7
Thermal Grease -- G3380A/B/K/T
from Shiu Li Technology Co., Ltd

LiPOLY G3380 thermal interface grease has low thermal resistance and great thermal conductivity. G3380 has been used extensively in Consumer electronics and Microprocessors for their thermal control techniques. The grease can cover several coats on the component interface. When the component's... [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Specific Gravity: 2.2 to 2.7
  • Viscosity Index: 16 to 181
  • Use Temperature: -76 to 356
Thermal Grease -- TT3000
from Shiu Li Technology Co., Ltd

LiPOLY TT3000 is a Nano type thermal interface material based on a unique formula. TT3000 is a highly reliable thermal grease made of Non-Solvent silicone oil compounds and thermal fillers. TT3000 provides superior performance and reliability while mitigating against pump-out and floating issues on... [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Dielectric Strength: 7.87E6
  • Thermal Conductivity: 6
  • Composition / Chemistry: Specialty, Proprietary or Other; Non-Solvent Silicone Oil; Synthetic or Semi-synthetic; Silicone
Two-Part Curable Thermal Grease -- D2000
from Shiu Li Technology Co., Ltd

LiPOLY D2000 is a two-part curable thermal grease. Fast curing at both room and high temperature without pumping effect. With a thermal conductivity of 2.0 W/m*K, D2000 provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the LiPOLY dispensing robot... [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Thermal Conductivity: 2
  • Use Temperature: -67 to 401
  • Dielectric Strength: 1.38E7
Two-Part Fast Curing Thermal Conductive Gel -- PK223DM
from Shiu Li Technology Co., Ltd

LiPOLY PK223DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 2.0 W/m*K, PK223DM provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the LiPOLY dispensing robot or by syringe. [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Thermal Conductivity: 2
  • Use Temperature: -76 to 392
  • Composition / Chemistry: Specialty, Proprietary or Other; Silicone; Synthetic or Semi-synthetic; Silicone
Two-Part Fast Curing Thermal Conductive Gel -- PK404DM
from Shiu Li Technology Co., Ltd

LiPOLY PK404DM is a two-pack liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 3.6 W/m*K, PK404DM provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the LiPOLY dispensing robot or by syringe. [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Thermal Conductivity: 3.6
  • Use Temperature: -67 to 401
  • Composition / Chemistry: Specialty, Proprietary or Other; Silicone; Synthetic or Semi-synthetic; Silicone
Two-Part Fast Curing Thermal Conductive Gel -- PK605DM
from Shiu Li Technology Co., Ltd

LiPOLY PK605DM is a two-pack liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 5.0 W/m*K, PK605DM provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the LiPOLY dispensing robot or by syringe. [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Thermal Conductivity: 5
  • Use Temperature: -67 to 401
  • Composition / Chemistry: Specialty, Proprietary or Other; Silicone; Synthetic or Semi-synthetic; Silicone
Two-Part Fast Curing Thermal Conductive Gel -- PK700DM
from Shiu Li Technology Co., Ltd

LiPOLY PK700DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 7.0 W/m*K, PK700DM provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the LiPOLY dispensing robot or by syringe. [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Thermal Conductivity: 7
  • Use Temperature: -76 to 392
  • Composition / Chemistry: Specialty, Proprietary or Other; Silicone; Synthetic or Semi-synthetic; Silicone
Two-Part Thermal Conductive Sealing Glue -- TPS586/5868
from Shiu Li Technology Co., Ltd

LiPOLY TPS586/5868 is a two-part sealing gap filler, provides low viscosity and high fluidity. The high deformation material, which can filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar gap. [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Specific Gravity: 2.3 to 2.8
  • Viscosity Index: 6 to 8
  • Use Temperature: -76 to 356
Two-Part Thermal Conductive Sealing Glue -- TPS589
from Shiu Li Technology Co., Ltd

LiPOLY TPS589 is a two-part sealing gap filler, provides low viscosity and high fluidity. The high deformation material, which can be filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar gap. [See More]

  • Type / Function: Heat Transfer, Thermal Oil, Coolant
  • Specific Gravity: 1.8
  • Viscosity Index: 5
  • Use Temperature: -76 to 356