BGA Rework

Description: The Summit 750 system was developed for users who demand the high performance characteristics of the Summit 1800 at a lower price. This has been achieved by converting some of the automated functions to manual operations without sacrificing the essential capabilities of the system. The system's

• Equipment Type: Complete System
• Soldering Process: Rework / Desoldering

Description: The Summit 1800 is a highly flexible system with enhanced features that include increased Field of View for larger (2.5" [63mm] square) components, Motorized Component Rotation (Theta), independent Motorized Top Heater and Pick-up tube, and programmable high, medium and low Top Heater Flow Control.

• Equipment Type: Complete System
• Soldering Process: Rework / Desoldering

Description: The IR 1000 is capable of installing and removing passives, QFPs, SOICs, PLCCs, MLFs, TSOPs, and coarse pitched BGAs. The IR 1000 incorporates a 500 W top heater and a 400 W pre-heater.The system allows for simple one zone profiles up to more complicated multi zone profiles. It features

• Equipment Type: Complete System
• Soldering Process: Rework / Desoldering

Description: The Metcal BGA rework nozzle or nozzle kit is another quality product from Metcal. Used with the BGA chip.

Description: The MRS-1100A Modular Rework System is an integrated convection rework system for the removal and reflow of BGA/CSP and SMT components. The MRS-1100A is comprised of a hand held convection tool, preheater, adjustable tool holder, and free-standing board holder to create a

• Equipment Type: Complete System
• Output Temperature: 77 to 660 F
• Soldering Process: Rework / Desoldering

Description: BGA REWORK AND REPAIR STATION

• Output Temperature: 150 to 750 F

Description: The Metcal BGA BGA-450-450 reflow nozzle is another quality product from Metcal. Offers a quad tip. Tip has a width of 45 x 45 mm. This reflow nozzle is designed to work with BGA-3590 - Rework System, CSP-3500 - Rework System.

Description: The Metcal BGA BGA-276-276 reflow nozzle is another quality product from Metcal. Offers a quad tip. Tip has a width of 27.6 x 27.6 mm. This reflow nozzle is designed to work with BGA-3590 - Rework System, CSP-3500 - Rework System.

Description: The Metcal BGA BGA-315-315 reflow nozzle is another quality product from Metcal. Offers a quad tip. Tip has a width of 31.5 x 31.5 mm. This reflow nozzle is designed to work with BGA-3590 - Rework System, CSP-3500 - Rework System.

Description: HOT AIR REWORK BGA NOZZLE SET 1

• Equipment Type: Accessory / Other

Description: HOT AIR REWORK BGA NOZZLE SET 2

• Equipment Type: Accessory / Other

Description: Indium Corporation manufactures a complete line of TACFlux® , which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chip), BGA

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: TACFlux® 008 is an electronics-grade no-clean creamy flux. Its many uses include: rework and repair of various electronics assemblies and components, die-attach, SMT component-attach (including BGAs & flip-chips), BGA ball-attach, preform soldering, and virtually any application

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: These adapters provide surface mount lands for attaching the BGA device. They employ high temperature FR4/G10 substrate which allows package soldering and rework without damage. Gold plated press fit pins and short trace lengths insure high integrity in mechanical and electrical

• Product Type: Prototyping Adapters
• RoHS Compliant: Yes

Description: NOZZLE BGA 4X4

• Equipment Type: Accessory / Other

Description: appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints. This publication is to be read in conjunction with IEC 61188-5-1:2002.

Description: appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints. This publication is to be read in conjunction with IEC 61188-5-1:2002.

Description: The widest variety of nozzles available for BGA rework. Custom nozzles available on request.Package of one

• Equipment Type: Accessory / Other

Description: VJ Electronix proudly offers the IR Board Heater Series designed to work in conjunction with hand soldering and desoldering tools for manual rework of BGA, µBGA, etc. or as preheaters for use with equipment such as selective soldering systems for preheating boards to help

• Fuel / Energy Source: Electric
• Heater Type: Radiant Heater, Radiant Flat Panel Heater

Description: Rosin-based, no-clean flux, halide-free, ROL0, for BGA/PGA and rework. Product Overview Kester TSF-6522RH is a rosin-based, no-clean tacky soldering flux formulated to meet the IEC 61249-2-21 definition for halide-free materials. It can be applied using a doctor blade, drum fluxer, or

Description: De-soldering braid packaged in static dissipative bobbins. Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is designed for removing solder from BGA pads and chips

• Welding Process / Form: Other

Description: De-soldering braid packaged in static dissipative bobbins. Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is designed for removing solder from BGA pads and chips

• Welding Process / Form: Other

Description: De-soldering braid packaged in static dissipative bobbins. Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is designed for removing solder from BGA pads and chips

• Welding Process / Form: Other

Description: De-soldering braid packaged in static dissipative bobbins. Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is designed for removing solder from BGA pads and chips

• Welding Process / Form: Other

Description: (BGA), Micro-BGA, flip-chip, fine-pitch, and high density component placement capabilitity (0201), in-circuit and functional testing. We are equipped with in-house x-ray inspection, and BGA rework tools. 50,000 ft2 ISO Certified, UL Approved Facility Located in Export

• Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
• Location: North America, United States Only, Northeast US Only, South Asia Only
• Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
• Material Acquisition: Customer Supplied, Vendor Supplied

Description: PoP Paste Indium5.79 is a no-clean solder paste designed for use in package-on-package and finerpitch (0.4mm and larger) BGA rework applications. PoP Paste Indium5.79 has a rheology designed to provide a long-lasting dipping process. Features Eliminates defects due to package

• Approvals / Conformance: Other

Description: -free wave soldering Lead-free rework Lead-free alloys for BGA/CSP components Lead-free mechanical reliability Tin whiskers Lead-free reliability in aerospace and military environments Lead-free reliability in automotive environments Testability of lead-free printed circuit assemblies

Description: COB, Wire Bonding, MCM, FlipChip Integration/Box Build AOI and X-Ray Capability Burn-In and Temperature Cycling Pin Insertion Component Programming Component Rework Capability Component Procurement/Warehous ing New Product

• Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
• Location: North America, United States Only, Northeast US Only
• Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
• Material Acquisition: Customer Supplied, Vendor Supplied

Description: Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000 is a highly conformable shear-thinning material

• Features: Electrically Conductive Compound (Adhesive, Grease), Thermal Compound / Interface (Thermally Conductive)
• Industry: Electronics

Description: -free termination finishes and/or Pb-free BGAs, i.e., assembling Pb-free parts using eutectic/near-eutect ic SnPb processes (also known as mixed metallurgy). b COTS products: COTS products likely built with Pb-free materials and assembly processes. c Pb-free design and assembly: Products

Description: -circuit testing Programming of programmable electronic devices Conformal coating Printed circuit board rework and repair Our surface mount (SMT) parts capabilities allow us to pick and place the full range of parts presently available, from 0201 two-terminal devices to full-size fine pitch

• Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Other
• Location: North America, United States Only, Northeast US Only
• Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
• Material Acquisition: Customer Supplied, Vendor Supplied

Description: -circuit testing Programming of programmable electronic devices Conformal coating Printed circuit board rework and repair Our surface mount (SMT) parts capabilities allow us to pick and place the full range of parts presently available, from 0201 two-terminal devices to full-size fine pitch

• Cable Types / Application: Audio / Visual, Coaxial / RF, Computer / Networking, Consumer Electronics / Appliances, Fiber Optic, Grounding Cable, Medical, Power Cable, Robotics, Ribbon Cable
• Location: North America, United States Only, Northeast US Only
• Supplier Capability: Design Assistance, CAD Documentation / Drawings, Prototype Quantities, Production Quantities, Testing and Evaluation, Just-In-Time Capability

Description: -circuit testing Programming of programmable electronic devices Conformal coating Printed circuit board rework and repair Our surface mount (SMT) parts capabilities allow us to pick and place the full range of parts presently available, from 0201 two-terminal devices to full-size fine pitch

• Location: North America, United States Only, Northeast US Only
• PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible  Boards, SMT Components, THT Components
• Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability

Description: Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD

• Fluxes & Cleaners: Soldering Flux / Rosin
• Form / Shape: Paste