BGA Rework

Description: The Metcal BGA rework nozzle or nozzle kit is another quality product from Metcal. Used with the BGA chip.

• Process Capability: Soldering Equipment

Description: It is an ideal BGA rework machine.

• Equipment Type: Complete System
• Process Capability: Rework / Desoldering, Soldering Equipment

Description: The Metcal BGA BGA-450-450 reflow nozzle is another quality product from Metcal. Offers a quad tip. Tip has a width of 45 x 45 mm. This reflow nozzle is designed to work with BGA-3590 - Rework System, CSP-3500 - Rework System.

• Process Capability: Soldering Equipment

Description: The Metcal BGA BGA-220-220 reflow nozzle is another quality product from Metcal. Offers a quad tip. Tip has a width of 22 x 22 mm. This reflow nozzle is designed to work with BGA-3590 - Rework System, CSP-3500 - Rework System.

• Process Capability: Soldering Equipment

Description: The Metcal BGA BGA-315-315 reflow nozzle is another quality product from Metcal. Offers a quad tip. Tip has a width of 31.5 x 31.5 mm. This reflow nozzle is designed to work with BGA-3590 - Rework System, CSP-3500 - Rework System.

• Process Capability: Soldering Equipment

Description: The MRS-1100A Modular Rework System is an integrated convection rework system for the removal and reflow of BGA/CSP and SMT components. The MRS-1100A is comprised of a hand held convection tool, preheater, adjustable tool holder, and free-standing board holder to create a

• Output Temperature: 77 to 660 F
• Equipment Type: Complete System
• Process Capability: Rework / Desoldering, Soldering Equipment

Description: BGA REWORK AND REPAIR STATION

• Output Temperature: 150 to 750 F
• Process Capability: Soldering Equipment

Description: Explains the practical uses of rework stations for high volume rework, BGAs and ultra fine-pitch QFPs. Continues with an examination of rework issues, including heat source, preheating and component alignment. Explains step-by-step procedures for fine pitch QFP removal,

Description: The IR 1000 is capable of installing and removing passives, QFPs, SOICs, PLCCs, MLFs, TSOPs, and coarse pitched BGAs. The IR 1000 incorporates a 500 W top heater and a 400 W pre-heater.The system allows for simple one zone profiles up to more complicated multi zone profiles. It features

• Equipment Type: Complete System
• Process Capability: Rework / Desoldering, Soldering Equipment

Description: NOZZLE, BGA, 33X33MM; For Use With:MARTIN Rework Systems; Tip / Nozzle Style:BGA; Tip / Nozzle Width:33mm; Tip / Nozzle Length:33mm; Product Range:-; SVHC:No SVHC (15-Jun-2015) RoHS Compliant: Yes

Description: DESOLDERING NOZZLE, BGA, 35MM X 35MM; For Use With:Weller WTQB1000 Rework System; Tip / Nozzle Style:BGA; Tip / Nozzle Width:35mm; Tip / Nozzle Length:35mm; Product Range:- RoHS Compliant: NA

Description: DESOLDERING NOZZLE, BGA, 40MM X 40MM; For Use With:Weller WTQB1000 Rework System; Tip / Nozzle Style:BGA; Tip / Nozzle Width:40mm; Tip / Nozzle Length:40mm; Product Range:- RoHS Compliant: NA

Description: DESOLDERING NOZZLE, BGA, 15MM X 15MM; For Use With:Weller WTQB1000 Rework System; Tip / Nozzle Style:BGA; Tip / Nozzle Width:15mm; Tip / Nozzle Length:15mm; Product Range:- RoHS Compliant: NA

Description: Indium Corporation manufactures a complete line of TACFlux® , which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chip), BGA

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and

Description: IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the

Description: IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the

Description: The widest variety of nozzles available for BGA rework. Custom nozzles available on request.Package of one

• Features: Accessory / Other
• Process Capability: Soldering Equipment

Description: VJ Electronix proudly offers the IR Board Heater Series designed to work in conjunction with hand soldering and desoldering tools for manual rework of BGA, µBGA, etc. or as preheaters for use with equipment such as selective soldering systems for preheating boards to help

• Features: Electric, Other
• Heater Type: Radiant Flat Panel Heater, Radiant Heater

Description: Rosin-based, no-clean flux, halide-free, ROL0, for BGA/PGA and rework. Product Overview Kester TSF-6522RH is a rosin-based, no-clean tacky soldering flux formulated to meet the IEC 61249-2-21 definition for halide-free materials. It can be applied using a doctor blade, drum fluxer, or

Description: Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA

• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: TACFlux® 008 is an electronics-grade no-clean creamy flux. Its many uses include: rework and repair of various electronics assemblies and components, die-attach, SMT component-attach (including BGAs & flip-chips), BGA ball-attach, preform soldering, and virtually any application

• Fluxes & Cleaners: Halogen / Halide Free, Soldering Flux / Rosin

Description: rework or repair of CSPs, BGAs, and SMDs. It is ideal for any lead-free soldering process that requires a very tacky flux and is optimized for consistent, high-speed printing.

Description: Micro-BGA, flip-chip, fine-pitch, and high density component placement capabilitity (0201), in-circuit and functional testing. We are equipped with in-house x-ray inspection, and BGA rework tools. 50,000 ft2 ISO Certified, UL Approved Facility Located in Export Zone at NSEZ,

• Testing Services: Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
• Production Capabilities: Cabling, High Volume, Mid Volume, Prototype / Low Volume, Quick Turn
• Design Services: Conceptual Product Development, Electrical Design Services, Mechanical Design Services, Software Design Services
• Material Acquisition: Customer Supplied, Vendor Supplied

Description: Ideal for inspecting BGAs, CSPs and other components for solder bridging, cold solder joints, missing solder balls and solder voids. Use as a stand-alone inspection system with composite video compatible monitor (not included) or in conjunction with the PACE TF or IR series BGA Area

• Features: Accessory / Other
• Process Capability: Soldering Equipment

Description: CircuitWorks® No-Clean Tacky Flux is a Type ROL0 formulation designed for BGA rework requiring high-reliability, stability and cleanliness. CircuitWorks® No-Clean Tacky Flux gel composition holds the BGA component in position even with board movement. Its lower viscosity allows

Description: package types Chip Scale Package (CSP) BGA and uBGA double-sided/mirrored BGA assembly COB and MCM Direct and multiple chip attach High pin count press fit Gold and aluminum wedge-bonding Wire-bonding Flex Circuits Wave solder Selective soldering Aqueous cleaning

• Industry / Application: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech, Telecommunications
• Capabilities: Ceramic Manufacturing, Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
• Services: Computer Aided Design (CAD) / Solid Modeling, Design / Development, High Volume Production, Just-in-Time Delivery, Kitting, Low Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Testing / Inspection, Turnkey Product Manufacturing, Warehousing / Stocking
• Features: North America, Northeast US Only, United States Only

Description: wave soldering Lead-free rework Lead-free alloys for BGA/CSP components Lead-free mechanical reliability Tin whiskers Lead-free reliability in aerospace and military environments Lead-free reliability in automotive environments Testability of lead-free printed circuit assemblies

Description: Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000 is a highly conformable shear-thinning material which requires

• Features: Electrically Conductive, Thermally Conductive
• Industry: Electronics

Description: finishes and/or Pb-free BGAs, i.e., assembling Pb-free parts using eutectic/near-eutectic SnPb processes (also known as mixed metallurgy). b COTS products: COTS products likely built with Pb-free materials and assembly processes. c Pb-free design and assembly: Products designed and qualified

Description: circuit board rework and repair Our surface mount (SMT) parts capabilities allow us to pick and place the full range of parts presently available, from 0201 two-terminal devices to full-size fine pitch devices including flip chips and micro BGAs.

• PCB Type: Double-Sided Boards, Flexible Boards, Multi-Layer Boards, Rigid-Flexible Boards, SMT Components, Single-Sided Boards, THT Components
• Features: North America, Northeast US Only, United States Only

Description: Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD provides a

• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin