Products & Services
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Supplier: Indium Corporation
Description: Wave Solder Flux 1072 is a halide-free, VOC-free, rosin flux specifically developed for wave soldering, surface mount, mixed technology and through-hole electronic assemblies. This unique formulation is a new advancement in flux chemistry, combining the
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Indium Hi Grade Wave Solder Flux 1075 VOC-Free is a non-halide, rosin/resin free flux specifically developed for wave soldering, surface mount, mixed technology and through-hole electronic assembly.
- Joining Process / Product Form: Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Accuris
Description: Soldering Fluxes Zinc Chloride, Ammonia-Free Solder Flux
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA EF-2100 is a non-toxic, Volatile Organic Compound (VOC) free, halide-free, rosin/resin-free, low-solids, no-clean liquid flux designed for defect-free soldering. It serves as a drop-in replacement for users of EF-2210, EF-2202, WB-400, and
- Solder Alloy: Lead Free
- Features: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview Kester TSF-6592HF is a no-clean paste flux designed as a lead-free solution for a range of interconnect applications, including flip chip attach, sphere or ball attach, and rework or repair of Chip Scale Packaging's (CSPs), Ball Grid Arrays (BGAs), and Surface Mount
- Solder Alloy: Lead Free
- Product Form: Paste
- Features: Soldering Flux / Rosin
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Supplier: RS Components, Ltd.
Description: Flux dispensing pen,lead free,9g
- Solder Alloy: Lead Free
- Features: Other
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Supplier: Newark, An Avnet Company
Description: LEAD FREE POCKET SOLDER, TYPE ROM1; Flux Type:Rosin; Flux Applications:Soldering; Dispensing Method:Wipe; Volume:-; Weight:-; Product Range:-; Accessory Type:Pocket Solder; Flux Percent:3% RoHS Compliant: Yes
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Supplier: Allied Electronics, Inc.
Description: Features Flux is non-corrosive and halide-free Can be used for soldering with lead-free or tin/lead solders Excellent material compatibility Fast drying RoHS Compliant High thermal stability
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Supplier: Indium Corporation
Description: Fluxes (with different activity levels) are available in no-clean, water-washable, and VOC-Free varieties. The solder is melted in a solder pot and pumped to produce a "wave." The board is conveyed over the flux, preheat, and solder wave stations to complete the
- Joining Process / Product Form: Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Features Excellent cleanability, residue can be removed with room temperature DI water Stencil-printable, high tack Offers high yields in BGA bumping process Halide-free with excellent solderability Wide process window Introduction WS-363 Interconnect Flux is a high viscosity
- Fluxes & Cleaners: Halogen / Halide Free, Soldering Flux / Rosin
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Supplier: Newark, An Avnet Company
Description: Crystal 400 Lead Free Solder Wire - 20 Gauge; Flux Type:-; Solder Alloy:-; External Diameter - Metric:-; External Diameter - Imperial:-; Melting Temperature:217°C; Weight - Metric:500g; Weight - Imperial:-; Product Range:
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Supplier: MacDermid Alpha Electronics Solutions
Description: A VOC-free, high-activity water-soluble organic acid flux for printed circuits and electronics. Can be wave, spray, or dip applied. Product Overview ALPHA 3355-VF is a VOC-free, water-soluble flux formulated to reduce VOC emissions while delivering exceptional
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: with no intentional addition of bromine and chlorine, conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications. Product Features Low Occurrence of Solder Ball Spatter, Smoke and Odor Conforms to Halogen-Free Requirement Conforms to
- Features: Flux Cored Wire, Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: Solder Wire; no-clean flux; lead-free; .025 dia; core 66; 1 lb
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Supplier: Newark, An Avnet Company
Description: LIQUID FLUX; Flux Type:Water Soluble; Flux Applications:Lead Free Soldering; Dispensing Method:Bottle; Volume:5gallon (US); Weight:-; Product Range:- RoHS Compliant: Yes
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Supplier: Allied Electronics, Inc.
Description: Solder Wire; water-soluble flux; lead-free; .031 dia; core 66; 1 lb
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Supplier: Allied Electronics, Inc.
Description: Solder Wire; water-soluble flux; lead-free; .02 dia; core 66; 1 lb
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Supplier: Henkel Corporation - Electronics
Description: MULTICORE LM100 no clean flux solder paste is designed for use with low temperature Pb-free solder alloys. LM100 is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without
- Features: Other, Solid Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without
- Features: Other, Solid Wire
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Supplier: Newark, An Avnet Company
Description: Rework Solder Paste 5CC-Lead Free; Flux Type:No Clean; Solder Alloy:96.5, 3, 0.5 Sn, Ag, Cu; Melting Temperature:220°C; Weight - Metric:15g; Weight - Imperial:0.033lb; Product Range:- RoHS Compliant: Yes
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without
- Features: Other, Solid Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without
- Features: Other, Solid Wire
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Supplier: DigiKey
Description: Flux - No Clean, Lead Free
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: IPC International, Inc.
Description: DVD-43C explains proper workstation practices, personal safety considerations, ESD prevention, soldering iron types, temperature selection, tip types and applications, heat transfer principles, how to avoid thermal damage, lead free solder types, sizes and applications, flux
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Supplier: IPC International, Inc.
Description: modified techniques for soldering through-hole components into plated-through holes, and wires to pierced terminals, then demonstrates PTH rework / vacuum extraction - focusing on damage prevention from increased soldering temperatures. Section 3 compares tin-lead / lead-free solder
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Supplier: Ellsworth Adhesives
Description: MicroCare UltraClean™ VOC-Free Flux Remover is a high-purity, halogen-free, fast-drying, non-chlorinated cleaning fluid ideal for "no-clean" fluxes, rosin fluxes and difficult to clean, lead-free solder pastes. Low odor, ultra-low GWP, ozone-safe, plastic-safe, and
- Type: Defluxer / Flux Remover
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with a hot
- Melting Range: 300 to 525 F
- Joining Process / Product Form: Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: IPC International, Inc.
Description: antimony (Sb) allowed as impurities in section 3.3 Alloy Impurities Transfer all information references on solder powder particle size distribution and solder paste products to IPC J-STD-005, Requirements for Solder Pastes Remove Table 3-1 “Particle Size Distributions of
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Supplier: IPC International, Inc.
Description: This tightly focused program is designed for continuing education and is also a valuable resource for others working in lead free electronics assembly. Use it to keep even experienced production personnel from falling into the seven most common processing errors committed during lead
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Description: IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic
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Supplier: CSA Group
Description: IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic
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Description: ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder
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Supplier: Techsil Limited
Description: non-hygroscopic, halide free and RoHS compliant. Product Benefits No-clean residue does not need to be removed for typical applications. Low residues, leaving the board and joints shiny and bright. Excellent wettability Usable for both lead free and leaded alloys Rosin/Resin
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore WS300 TACKY FLUX ) LOCTITE WS 300 RWF BU is a water wash flux system specially formulated with fine-powder lead-free alloys. High performance, water washable solder paste. Residues are easily removed with DI water without the need for a saponifier.
- Fluxes & Cleaners: Soldering Flux / Rosin
Find Suppliers by Category Top
Featured Products Top
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ALPHA OM-362, next-generation ultra-low voiding solder paste This lead-free, zero-halogen, no-clean paste can deliver less than 10 (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
equipment Process Control: Adjust soldering temperatures for lead-free solder (10–20°C higher than leaded solder). And don’t allow to the use of restricted substances in fluxes or cleaning agents. Equipment Cleaning: Clean the residues to prevent historical contamination (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
using a solder containing lead. 2. MAKE SURE YOU HAVE THE RIGHT FLUX At Ambrell, we recommend using flux cored aluminum braze rings. However, the rule of thumb is to make sure that the recommended temperature for the flux you select is similar to the melting point of (read more)
Browse Induction Heaters Datasheets for Ambrell Induction Heating Solutions
Conduct Research Top
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Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
This paper touches on identifying favorable flux properties, down-selecting low solids fluxes for lead-free selective wave soldering, the selective soldering process itself, and testing criteria. Topics reviewed will be the flux selection, optimizing the selective soldering process by varying
More Information Top
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Development of Flux-Free Reflow Soldering Process Using Hydrogen Radicals
As a method for realizing flux free soldering , we propose that irradiation technology of hydrogen radicals in this study.
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High yield thermode bond process under activated atmosphere and inline thermal interface measurement for high power optoelectronic devices
Part one: Flux free soldering is an important bonding technology for high power optoelectronic and high frequency devices.
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News in the soldering of different materials
S. P. Yatsenko and V. M. Skachkov, “Method of flux free soldering of different materials,” RF Patent 2442680, Byul.
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Corrosion behaviour of soldered joints of magnesium alloys and dissimilar materials
The present study shows results of a new flux free soldering technology and the study of the corrosion properties of these sol- dered samples.
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Joining Technologies for Al‐Foam—Al‐Sheet Compound Structures
In the course of the investigations, a special flux free soldering process of Euromat Ltd. was appliedÐS-BondTM 220.
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Demonstration of board-level optical link with ceramic optoelectronic multi-chip module
An approach for the flux free solder -bumped flip chip assembly process of the optoelectronic components will be shown.
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Novel optical transmitter and receiver for parallel optical interconnects on PCB-level
An approach for the flux free solder -bumped flip chip assembly process of optoelectronic components will be shown.
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Pneumatic dispensing of nano- to picoliter droplets of liquid metal with the StarJet method for rapid prototyping of metal microstructures
Due to the necessity of high contact angles of the molten solder toward silicon, flux free solder has been selected as material.
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Highly precise and robust packaging of optical components
Because of the small thermally induced oxidation, a flux free soldering process is possible.
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The surface tension and density of molten tin with low additions of barium
INTRODUCTION Interest in investigating the surface tension of tin and tin based alloys has grown over the last decade [1–4], since such melts can be used in the production of low–melting point solders for flux free soldering of aluminium and its alloys…