Products & Services
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: majority of common brazing applications are readily met by Handy Flux, the general purpose flux that has remained an industry standard for over 70 years. It is a powerful general purpose flux. For low temperature brazing, Sure Flo Flux is a creamy and smooth
- Fluxes & Cleaners: Brazing Flux
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Supplier: MacDermid Alpha Electronics Solutions
Description: Halogen-free, rosin-free, low-solids, no-clean flux formulated for wave soldering, ideal for touch-up and rework with flux pens. Product Overview ALPHA NR205 has been specifically formulated to resist degradation in surface insulation resistance and electromigration, even
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: A rosin-free, no-clean, alcohol-based liquid flux designed to enhance board cosmetics and prevent solder balling and bridging. Product Overview ALPHA EF-6000 is an active, rosin-free, low solid, low residue no-clean flux. With a wide thermal process window, it
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: MULTICORE LM100 no clean flux solder paste is designed for use with low temperature Pb-free solder alloys. LM100 is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: -corrosive to underbump metallization Introduction Wafer Flux WS-3401 is a low viscosity semiconductor-grade flux, specifically optimized to remove surface oxides from solder bumps on wafers. Working with the natural surface tension of solder, WS-3401 produces
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Features Sprayable and dispensable Excellent wetting ability Wide refl ow temperature ranges Introduction FC-WS-HT-A1 is a water-washable, halide-free, sprayable liquid fl ux designed for Sn/Pb and Pb-Free wafer level solder bump formation. It can be used in a nitrogen atmosphere.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: TACFlux® 055 is an air reflow, halogen-free, no-clean flux used with Sn/Bi and Sn/Bi/Ag alloys. TACFlux® 055 provides excellent wetting in air and nitrogen and provides the low activation temperature necessary for the low melting Sn/Bi and Sn/Bi/Ag alloys.
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: TACFlux®057 is an air reflow, halogen-free, no-clean flux used with SnBi and SnBiAg alloys. TACFlux®057 provides excellent wetting in air and nitrogen and provides the low activation temperature necessar y for the low melting SnBi and SnBiAg alloys.
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
- Halogen / Halide Free: Yes
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 700 is a system recommended exclusively for torch brazing aluminum. Flux binder series for the torch and induction brazing of aluminum. Typically formulated with 40% to 45% filler metal concentration by weight, these low temperature systems have excellent
- Fluxes & Cleaners: Brazing Flux
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 100 is used for low temperature, general purpose brazing alloys. This series contains general purpose flux binder systems. Suitable for use with a variety of heat sources including torch induction, resistance and occasionally furnace. Brazing pastes made with these
- Fluxes & Cleaners: Brazing Flux
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Supplier: Henkel Corporation - Electronics
Description: No-clean, Pb-freePb-free solder paste designed for low-temperature, Pb-free solder alloys. This material is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Accuris
Description: SLEEVE, TERMINATION, ELECTRICAL, LOW TEMPERATURE, FLUXED SOLDER PREFORM, HEAT SHRINKABLE
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Supplier: Nordson EFD
Description: for low-temperature and high-temperature reflow and leaded and lead-free alloys in all flux types and alloy particle sizes. Whether soldering electrical connections in recessed areas on PCBs or tabbing and stringing solar cells, EFD makes pastes that exceed
- Approvals / Conformance: Other
- Form / Shape: Paste
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE LM 100, no clean flux, RoHS-compliant, Designed for use with low temperature Pb-free solder alloys LOCTITE® LM 100 is a RoHS-compliant solder paste designed for use with low-temperature, Pb-free alloys. Formulated to provide excellent dispensability,
- Form / Shape: Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: . Extensive List of Lead and Lead-Free Alloys Available with or without Integrated Flux Coating or Core Easily Implemented into Any Solder Process Ultra-Low Temperature Alloys Available Primarily used for fuse function.
- Lead Free: Yes
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE GC 10, No-clean and Halogen-free Solder Paste, a RoHS-compliant, Excellent resistance in high humidity, Pb-free soldering LOCTITE® GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long
- Form / Shape: Paste
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE MP 218, Solder paste, High activity, Soft residue, Colorless, Sn/Pb soldering LOCTITE® MP 218 is a high activity, soft residue, colorless solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable
- Form / Shape: Paste, Other
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Supplier: ESAB Welding and Cutting Products
Description: Features Cadmium free, low temperature, food grade, solder for high strength on stainless steels, and dissimilar metals. Deposits closely match stainless, and stay bright after prolonged service. Use with All-State Duzall flux or All-state 430 flux.
- Alloy: Other
- Form / Shape: Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: MacDermid Alpha Electronics Solutions
Description: Enables low temperature SMT assembly technology to minimize rework in multiple reflow applications. Product Overview ALPHA CVP-520 is designed for near-eutectic low-temperature alloys such as SnBi0.4Ag, enabling peak reflow profiles between 155°C and 190°C. The flux
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Supplier: Ellsworth Adhesives
Description: MicroCare PowerClean™ Lead-Free Flux Remover is a strong defluxer of lead-free, high-temperature solder flux residues. Cleans inks, oils and some conformal coatings while eliminating white residues. Nonflammable, fast-drying, low aroma, and ozone-safe. 10 oz
- Type: Defluxer / Flux Remover
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Supplier: Palomar Technologies, Inc
Description: Overview The SST 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to use and designed for a wide variety of
- Application: Brazing / Soldering, Curing, Other
- Configuration: Top Loading
- Controller Type: Programmable
- Height: 483 mm
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Supplier: ESAB Welding and Cutting Products
Description: Features Aluminum solder for joining aluminum at low temperatures without flux (All-State 53 flux will improve flow). For high strength and long service without galvanic action between base metal and solder.
- Alloy: Other
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Supplier: ESAB Welding and Cutting Products
Description: Features Cadmium free, low temperature, food grade solder in mesh form premixed with flux. For use on stainless and dissimilar metals.
- Alloy: Other
- Form / Shape: Paste
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Supplier: RS Components, Ltd.
Description: 183-188°C. Low odour formulation with 1.1% flux content. Soldering iron typical tip temperature for this solder wire is 320-360°C Wire Diameter = 0.71mm Percent Lead = 40% Product Form = Wire Melting Point = +183°C Percent Tin = 60% Flux Type = Colophony
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 F
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Supplier: RS Components, Ltd.
Description: 183-188°C. Low odour formulation with 1.1% flux content. Soldering iron typical tip temperature for this solder wire is 320-360°C Wire Diameter = 1.27mm Percent Lead = 40% Product Form = Wire Melting Point = +183°C Percent Tin = 60% Flux Type = Colophony
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 F
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Supplier: RS Components, Ltd.
Description: A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards. Thermal damage to components can be minimised due to lower temperatures. 5 cores of Ersin® flux Wire Diameter = 0.71mm Percent Lead = 36% Product Form =
- Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 354 F
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Supplier: RS Components, Ltd.
Description: A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards. Thermal damage to components can be minimised due to lower temperatures. 5 cores of Ersin® flux Wire Diameter = 1.22mm Percent Lead = 36% Product Form =
- Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 354 F
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Supplier: Palomar Technologies, Inc
Description: Overview The SST 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to use and designed for a wide variety of
- Temperature Range: 842 F
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Supplier: Waytek, Inc.
Description: Lead-Free Sealed Crimp & Solder Butt Connector 31971 Category: Butt Connectors Lead-free solder has lower melt temperature - 280°F (138°C) vs 293°F (145°C) Pre-fluxed, low temperature solder delivers superior current flow and
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Supplier: Waytek, Inc.
Description: Category: Butt Connectors Lead-free solder has lower melt temperature - 280°F (138°C) vs 293°F (145°C) Pre-fluxed, low temperature solder delivers superior current flow and tensile strength Translucent, adhesive-lined heat shrink tubing allows
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Supplier: Waytek, Inc.
Description: lower melt temperature: 280°F (138°C) vs °293F (145°C) Pre-fluxed, low temperature solder delivers superior current flow and tensile strength Translucent, adhesive-lined heat shrink tubing allows for visual inspections and seals against corrosion
- Features: RoHS, Insulated, Heat Shrink Type
- Material: Copper, Other
- North American (AWG): 18 to 22 AWG
- Terminal Type: Ring Terminal
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Supplier: Waytek, Inc.
Description: has lower melt temperature: 280°F (138°C) vs °293F (145°C) Pre-fluxed, low temperature solder delivers superior current flow and tensile strength Translucent, adhesive-lined heat shrink tubing allows for visual inspections and seals against corrosion
- Features: RoHS, Insulated, Heat Shrink Type
- Material: Other
- North American (AWG): 14 to 16 AWG
- Terminal Type: Ring Terminal
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Featured Products Top
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solution for quick repairs and consumer electronics assembly. Its low-residue formula eliminates post-soldering cleanup but works best in controlled environments with stable temperatures. The inactive residues don't conduct electricity, making them ideal for smartphone circuit boards. (read more)
Browse Welding, Brazing, and Soldering Equipment Datasheets for ODG (Origin Data Global) -
, this new preform technology is offered in all SAC, Innolot and low-temp SnBi alloys. For more information on ALPHA® AccuFlux™ BTC-578 Solder Preforms, visit the Alpha website (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions. This (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
abrasion resistant when directly contacted at elevated temperatures and chemically resistant to the highly active fluxes. Polyonics label materials for PCB and electronics manufacturing have been tested and approved by leading flux providers such as Alpha Metals and Kester, and cleaner providers (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Polyonics -
Ultra-Low voiding performance Excellent electromigration characteristics Good coalescence and wetting performance Excellent solder joint and flux residue cosmetics Zero-halogen, No halogens (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
lower soldering temperatures and to protect other temperature sensitive PCB components. An additional key feature is that the solder tails are located outside of the insulator material in order to facilitate visual inspection. These strong, lightweight holders also employ reliable spring tension for low (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
ALPHA HRL3 is a lead-free, low temperature, high reliability alloy for use application where low temperature processing is desired. ALPHA HRL3 is available in solder sphere format for ball mount application. The alloy was designed to exhibit improved drop shock and thermal (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
The pressure transducer PHPS8500 is a pressure and temperature sensing device specially developed for ultra-low pressure ranges and demanding space constrictions. High (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power
Conduct Research Top
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Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
This paper touches on identifying favorable flux properties, down-selecting low solids fluxes for lead-free selective wave soldering, the selective soldering process itself, and testing criteria. Topics reviewed will be the flux selection, optimizing the selective soldering process by varying
More Information Top
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Soldering aluminum and its alloys in fabricating cryogenic-engineering products
The systems ZnCI2-NH4CI and KOH-NaOH meet the requirements for low - temperature soldering flux melts fairly well.
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Corrosion of Aluminum and Aluminum Alloys
The usual composition variations of the chloride- free, low - temperature soldering fluxes have little or no effect on joint corrosion resistance.
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Low temperature soldering
Two solderability test methods were used to evaluate the newly developed fluxes for low temperature soldering : (a) spreadingtest to compare the relative strength of the fluxes, and (b) wetting balance to determine the activation temperature of the fluxes.
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TPX: Contractor preliminary design review. Volume 1, Presentation and design description. Final report
Non-vaouum EB rcquircs liend to be witlii 3-6cm of weld Flux required Low temperature solders have low strcngtl Not reoommended for 908 alloy (could b used with 816 alloys) Poor strength, poor reliability .