Products & Services
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: of common brazing applications are readily met by Handy Flux, the general purpose flux that has remained an industry standard for over 70 years. It is a powerful general purpose flux. For low temperature brazing, Sure Flo Flux is a creamy and smooth composition that provides excellent
- Melting Range: 600 to 1,100 F
- Approvals / Conformance: AWS
- Type: Brazing Flux
- Features: Other, Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: preheat temperatures and dwell times. Several proprietary additives are formulated into ALPHA EF-6000 to reduce surface tension between the solder mask and solder, significantly minimizing the tendency for solder balling. Its thermally stable formulation also helps reduce
- Type: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Halogen-free, rosin-free, low-solids, no-clean flux formulated for wave soldering, ideal for touch-up and rework with flux pens. Product Overview ALPHA NR205 has been specifically formulated to resist degradation in surface insulation resistance and electromigration, even when the flux is not
- Type: Soldering Flux / Rosin
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Supplier: Accuris
Description: SLEEVE, TERMINATION, ELECTRICAL, LOW TEMPERATURE, FLUXED SOLDER PREFORM, HEAT SHRINKABLE
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Supplier: IPC International, Inc.
Description: Explains what a low residue flux is and how it compares to other fluxes. Describes changes to the existing hand soldering process and explains hand soldering theory with low residue fluxes. Discusses visual inspection criteria for solder joints and flux residues,
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Supplier: Henkel Corporation - Electronics
Description: MULTICORE LM100 no clean flux solder paste is designed for use with low temperature Pb-free solder alloys. LM100 is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.
- Type: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: semiconductor-grade flux, specifically optimized to remove surface oxides from solder bumps on wafers. Working with the natural surface tension of solder, WS-3401 produces uniform hemispherical bumps without solder-robbing or solder-bridging. The rheology is suited to
- Features: Other
- Type: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: TACFlux® 055 is an air reflow, halogen-free, no-clean flux used with Sn/Bi and Sn/Bi/Ag alloys. TACFlux® 055 provides excellent wetting in air and nitrogen and provides the low activation temperature necessary for the low melting Sn/Bi and Sn/Bi/Ag alloys.
- Features: Other
- Type: Soldering Flux / Rosin
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Supplier: Newark, An Avnet Company
Description: SOLDER PASTE, 96.5/3/0.5 SN/AG/CU, 500G; Flux Type:Halogen Free, No Clean, Low Voiding; Solder Alloy:96.5, 3, 0.5 Sn, Ag, Cu; Melting Temperature:217°C; Weight - Metric:500g; Weight - Imperial:17.6oz; Product Range:- RoHS Compliant: Yes
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with a hot
- Melting Range: 300 to 600 F
- Features: Paste
- Type: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: Chem-Wik® Rosin is especially designed for today's heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. Chem-Wik® Rosin responds as much as 50% faster than conventional desoldering
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Supplier: Allied Electronics, Inc.
Description: Chem-Wik® Rosin is especially designed for today's heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. Chem-Wik® Rosin responds as much as 50% faster than conventional desoldering
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Supplier: Ellsworth Adhesives
Description: MicroCare PowerClean™ Lead-Free Flux Remover is a strong defluxer of lead-free, high-temperature solder flux residues. Cleans inks, oils and some conformal coatings while eliminating white residues. Nonflammable, fast-drying, low aroma, and ozone-safe. 10 oz Aerosol.
- Type: Defluxer / Flux Remover
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Supplier: Nordson EFD
Description: low-temperature and high-temperature reflow and leaded and lead-free alloys in all flux types and alloy particle sizes. Whether soldering electrical connections in recessed areas on PCBs or tabbing and stringing solar cells, EFD makes pastes that exceed soldering expectations.
- Features: Other
- Joining Process / Product Form: Paste
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE LM 100, no clean flux, RoHS-compliant, Designed for use with low temperature Pb-free solder alloys LOCTITE® LM 100 is a RoHS-compliant solder paste designed for use with low-temperature, Pb-free alloys. Formulated to provide excellent dispensability,
- Joining Process / Product Form: Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: to address assembly challenges. These preforms are designed to fit over or be inserted into difficult to solder processes such as connector pins and cable termination interconnects. Industrial solder preforms are offered in a wide range of alloys, with melting temperatures
- Solder Alloy: Lead Free
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Supplier: ESAB Welding and Cutting Products
Description: Features Cadmium free, low temperature, food grade, solder for high strength on stainless steels, and dissimilar metals. Deposits closely match stainless, and stay bright after prolonged service. Use with All-State Duzall flux or All-state 430 flux.
- Features: Other
- Joining Process / Product Form: Solid Wire
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Supplier: IPC International, Inc.
Description: DVD-43C explains proper workstation practices, personal safety considerations, ESD prevention, soldering iron types, temperature selection, tip types and applications, heat transfer principles, how to avoid thermal damage, lead free solder types, sizes and applications, flux theory,
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Joining Process / Product Form: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Joining Process / Product Form: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: MacDermid Alpha Electronics Solutions
Description: Enables low temperature SMT assembly technology to minimize rework in multiple reflow applications. Product Overview ALPHA CVP-520 is designed for near-eutectic low-temperature alloys such as SnBi0.4Ag, enabling peak reflow profiles between 155°C and 190°C. The flux
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE MP 218, Solder paste, High activity, Soft residue, Colorless, Sn/Pb soldering LOCTITE® MP 218 is a high activity, soft residue, colorless solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable for a large
- Features: Other
- Joining Process / Product Form: Paste
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Supplier: Palomar Technologies, Inc
Description: temperature controller is combined with customized programmable logic controller (PLC) to provide automatic process control. The 1200 table top furnace is ideal for small labs and R&D facilities. Void-free solder joints are most reliably obtained through a carefully controlled and
- Process Temperature: 450 C
- Height: 482.59973939614076 mm
- Width / Tube O.D.: 774.6995816622259 mm
- Length (Chamber / Tube): 634.9996571001852 mm
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Supplier: IPC International, Inc.
Description: theory, low residue fluxes, wetting principles, soldering through-hole components onto printed circuit boards, tip tinning, tool maintenance, reheating solder, heat sinks / thermal shunts, soldering thick boards, preheating, and flux residue cleaning. It also explains PTH
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Supplier: Henkel Corporation - Electronics
Description: No-clean, Pb-freePb-free solder paste designed for low-temperature, Pb-free solder alloys. This material is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.
- Features: Lead Free, Other, Paste
- Type: Soldering Flux / Rosin
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Supplier: IPC International, Inc.
Description: DVD-42C explains proper workstation practices, personal safety considerations, ESD prevention, soldering iron types, temperature selection, tip types and applications, heat transfer principles, how to avoid thermal damage, tin-lead solder types, sizes and applications, flux theory,
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Supplier: Palomar Technologies, Inc
Description: temperature controller is combined with customized programmable logic controller (PLC) to provide automatic process control. The 1200 table top furnace is ideal for small labs and R&D facilities. Void-free solder joints are most reliably obtained through a carefully controlled and
- Temperature Range: 842 F
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Supplier: Waytek, Inc.
Description: Sealed Crimp & Solder Connectors are crimped for mechanical reliability, soldered for superior strength and conductivity, and sealed for maximum durability. Lead-Free Sealed Crimp & Solder Butt Connector Category: Butt Connectors Lead-free solder has lower melt
- Connector Type: Automotive Connector
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 700 is a system recommended exclusively for torch brazing aluminum. Flux binder series for the torch and induction brazing of aluminum. Typically formulated with 40% to 45% filler metal concentration by weight, these low temperature systems have excellent fluxing properties
- Melting Range: 930 to 1,100 F
- Type: Brazing Flux
- Features: Paste
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Supplier: Waytek, Inc.
Description: Lead-Free Sealed Crimp & Solder Butt Connector 31971 Category: Butt Connectors Lead-free solder has lower melt temperature - 280°F (138°C) vs 293°F (145°C) Pre-fluxed, low temperature solder delivers superior current flow and tensile strength Translucent,
- Connector Type: Automotive Connector
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Supplier: Waytek, Inc.
Description: solder has lower melt temperature - 280°F (138°C) vs 293°F (145°C) Pre-fluxed, low temperature solder delivers superior current flow and tensile strength Translucent, adhesive-lined heat shrink tubing allows for visual inspections and seals against corrosion
- Connector Type: Automotive Connector
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 100 is used for low temperature, general purpose brazing alloys. This series contains general purpose flux binder systems. Suitable for use with a variety of heat sources including torch induction, resistance and occasionally furnace. Brazing pastes made with these systems
- Melting Range: 950 to 1,500 F
- Type: Brazing Flux
- Features: Paste
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Supplier: Waytek, Inc.
Description: Sealed Crimp & Solder Connectors are crimped for mechanical reliability, soldered for superior strength and conductivity, and sealed for maximum durability. Crimp, Solder & Seal Heat Shrink Terminal Category: Ring Terminals Lead free solder has lower melt temperature:
- North American (AWG): 22 to 18 AWG
- Material: Copper
- Features: Heat Shrink Type, Insulated, Other, RoHS
- Terminal Type: Ring Terminal
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Supplier: ATV Technologie GmbH
Description: Process temperature up to 450°C Temperature ramp-up rate 3K/sec. Temperature cool-down rate 2K/sec. Excellent temperature uniformity IR Heating Small footprint (No footprint change up to 3 Process Chambers) Common Applications SRO i-Line IGBT/DBC Power Semiconductors
- Temperature Range: 450 F
- External: Bench / Cabinet
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Supplier: Allied Electronics, Inc.
Description: Features Low temperature pre-measured solder with flux for greater tensile strength and superior current flow Durable insulation with Watertight connection Ultimate tensile strength with Superior conductivity
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Featured Products Top
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solution for quick repairs and consumer electronics assembly. Its low-residue formula eliminates post-soldering cleanup but works best in controlled environments with stable temperatures. The inactive residues don't conduct electricity, making them ideal for smartphone circuit boards. (read more)
Browse Welding, Brazing, and Soldering Equipment Datasheets for ODG (Origin Data Global) -
, this new preform technology is offered in all SAC, Innolot and low-temp SnBi alloys. For more information on ALPHA® AccuFlux™ BTC-578 Solder Preforms, visit the Alpha website (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions. This (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
abrasion resistant when directly contacted at elevated temperatures and chemically resistant to the highly active fluxes. Polyonics label materials for PCB and electronics manufacturing have been tested and approved by leading flux providers such as Alpha Metals and Kester, and cleaner providers (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Polyonics -
Ultra-Low voiding performance Excellent electromigration characteristics Good coalescence and wetting performance Excellent solder joint and flux residue cosmetics Zero-halogen, No halogens (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
lower soldering temperatures and to protect other temperature sensitive PCB components. An additional key feature is that the solder tails are located outside of the insulator material in order to facilitate visual inspection. These strong, lightweight holders also employ reliable spring tension for low (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
ALPHA HRL3 is a lead-free, low temperature, high reliability alloy for use application where low temperature processing is desired. ALPHA HRL3 is available in solder sphere format for ball mount application. The alloy was designed to exhibit improved drop shock and thermal (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
The pressure transducer PHPS8500 is a pressure and temperature sensing device specially developed for ultra-low pressure ranges and demanding space constrictions. High (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power
Conduct Research Top
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Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
This paper touches on identifying favorable flux properties, down-selecting low solids fluxes for lead-free selective wave soldering, the selective soldering process itself, and testing criteria. Topics reviewed will be the flux selection, optimizing the selective soldering process by varying
More Information Top
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Soldering aluminum and its alloys in fabricating cryogenic-engineering products
The systems ZnCI2-NH4CI and KOH-NaOH meet the requirements for low - temperature soldering flux melts fairly well.
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Corrosion of Aluminum and Aluminum Alloys
The usual composition variations of the chloride- free, low - temperature soldering fluxes have little or no effect on joint corrosion resistance.
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Low temperature soldering
Two solderability test methods were used to evaluate the newly developed fluxes for low temperature soldering : (a) spreadingtest to compare the relative strength of the fluxes, and (b) wetting balance to determine the activation temperature of the fluxes.
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TPX: Contractor preliminary design review. Volume 1, Presentation and design description. Final report
Non-vaouum EB rcquircs liend to be witlii 3-6cm of weld Flux required Low temperature solders have low strcngtl Not reoommended for 908 alloy (could b used with 816 alloys) Poor strength, poor reliability .