Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Palomar Technologies, Inc
Description: Overview The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single machine. The large 304 x 152mm work area provides users flexibility to work with many
- Automation: Automatic
- Type: Wedge Bonder
-
Supplier: Palomar Technologies, Inc
Description: Overview The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its patented Dual Z-Axis bond head enables very
-
Description: production requirement. Products have passed the ROHS and REACH environmental certification of the European Chemicals Agency, in accordance with EU Regulation No. 1907/2006. Main supplier of K&S and ASM Bonder machine manufacturer.
-
-
Supplier: Accuris
Description: WELDING MACHINES, ULTRASONIC BONDING, MINIATURE WIRE
-
Supplier: Accuris
Description: WELDING MACHINES, THERMOCOMPRESSION, DIFFUSION BONDING, MINIATURE WIRE
-
Supplier: Tanfel
Description: Tanfel offers a full solution for your custom fabricated metal product needs. A variety of materials and finishes are available along with tool fabrication, design support and a variety of other value added services.
- Additional Services: CAD / CAM Support, Design Assistance, Just-In-Time Delivery, Prototype Services, Low Volume Production, High Volume Production, Reverse Engineering
- Capabilities: Machining Wire, Spring Wire
- Location: North America, United States Only, Southwest US Only, South / Central America Only, Europe Only
- Materials: Aluminum, Brass, Bronze, Copper, Nickel Alloy, Stainless Steel, Titanium, Zinc
-
Supplier: Haida International Equipment Co., Ltd.
Description: Product Description Of Computer Servo Tensile Test Machine 5000kg Capacity Tensile Testing Machine is used in rubber, plastics, wire and cable, textiles, waterproof material, non-woven fabrics and other non-metallic materials and metal wire, metal foil, sheet
- Application Software: Yes
- Display / Interface: Computer Interface
- Force / Load Capacity: 2205 to 11025 lbs
- Mechanical Test: Tensile, Compressive, Adhesion (Bond / Peel), Ductility, Creep / Stress Relaxation, Fatigue / Cyclic, Friction / Wear, Flexure / Bending, Shear / Torsion, Universal
-
Supplier: Haida International Equipment Co., Ltd.
Description: The high low temperature universal test machine is controlled by computer and is widely used in rubber, plastic, wire and cable, textile, waterproof materials, non-woven fabrics and other non-metallic materials and metal wire, metal foil, metal sheet and metallic rods of the
- Display / Interface: Digital Readout / Interface
- Force / Load Capacity: 4410 lbs
- Mechanical Test: Adhesion (Bond / Peel), Flexure / Bending, Shear / Torsion, Universal, Specialty / Other
- Test Temperature: -40 to 150 F
-
Supplier: ValueTronics International, Inc.
Description: The EQUITEST5071 is a HiPot from HT Instruments. HiPot, or high potential, is a class of electronic test equipment used to verify electrical insulation. Engineers use HiPot-testing instruments on cables, wires, circuit boards, appliances, electric motors, and transformers. As a product ages,
-
Description: -supply-switch ) including systems for power supply and control feeders situated outside of the hoisting machine, for example, flexible cables or conductor wires or conductor bars. This standard is applicable to equipment or parts of equipment not exceeding 1 000 V a.c. or 1 500 V d.c.
-
Description: connection of the supply to the electrical equipment of the hoisting machine (crane-supply-switch ) and includes systems for power supply and control feeders situated outside of the hoisting machine, for example, flexible cables or conductor wires or conductor bars. This
-
Description: hoisting machine, for example, flexible cables or conductor wires or conductor bars. This document is applicable to equipment or parts of equipment not exceeding 1 000 V AC or 1 500 V DC between lines and with nominal frequencies not exceeding 200 Hz. This document does not cover all
-
Supplier: CSA Group
Description: -supply-switch ) including systems for power supply and control feeders situated outside of the hoisting machine, for example, flexible cables or conductor wires or conductor bars. This standard is applicable to equipment or parts of equipment not exceeding 1 000 V a.c. or 1 500 V d.c.
-
Supplier: Haida International Equipment Co., Ltd.
Description: . Universal test machine can do tensile test, tear test, peel test, bond test with different clamps for metal,wire,steel,cable,pl astic and other kind of materials. This universal test machine can do different test as per customer requirement such as tensile
- Display / Interface: Computer Interface
- Force / Load Capacity: 11025 lbs
- Mechanical Test: Universal
- Test Speed: 3.94E-4 to 11.81 in/min
-
Description: small structures, and it is satisfied with the machining requirements of micro holes and fine molds. Micro EDM processing drum is made of fine tungsten wire or alloy wire. During processing, a micro energy pulse power supply and a dedicated EDM engine oil are added between the
-
Supplier: Haida International Equipment Co., Ltd.
Description: Universal Testing Equipment is widely used in wires & cables, hardware, metal, rubber, footwear, leather, apparel, fabric, tape paper products, pharmacy and so on, for tensile strength, tear resistance, peel strength, bend strength, shear force, ect with different fixtures according
- Application Software: Yes
- Display / Interface: Computer Interface
- Force / Load Capacity: 1102 to 4410 lbs
- Mechanical Test: Tensile, Compressive, Adhesion (Bond / Peel), Ductility, Creep / Stress Relaxation, Fatigue / Cyclic, Friction / Wear, Flexure / Bending, Shear / Torsion, Universal
-
Description: factory set and 16 user defined tables to enable flexibility for the given environment. This lattice matched InGaAs array is backside illuminated enabling detection from 0.4 to 1.7 µm with no bond pads or wires in the way of your signal and minimize stray reflections found in front
- Horizontal Resolution: 1024 lines
- Specialty Camera Type: Machine Vision Sensor, Line Scan
- Vertical Resolution: 1 lines
-
Supplier: Thermal Wire and Cable LLC
Description: which promotes fiber bonding which ultimately reduces fraying and itching associated with other conventional high temperature wires. Thermal Wire and Cable's TGGT lead wires are unaffected by flame, fuels, solvents most acids, alkalis and oils and pass IEEE-383 70,000
- North American (AWG): 22 AWG
- Number of Conductors: 1 #
- Operating Temperature: 250 C
- Product Type: Single Conductor Wire
-
Supplier: Thermal Wire and Cable LLC
Description: which promotes fiber bonding which ultimately reduces fraying and itching associated with other conventional high temperature wires. Thermal Wire and Cable's TGGT lead wires are unaffected by flame, fuels, solvents most acids, alkalis and oils and pass IEEE-383 70,000
- North American (AWG): 12 AWG
- Number of Conductors: 1 #
- Operating Temperature: 250 C
- Product Type: Single Conductor Wire
-
Supplier: Thermal Wire and Cable LLC
Description: consistency and uniformity. The overall glass braid is treated with a proprietary saturant that promotes fiber bonding. This proprietary saturant also reduces fraying, itching and Dermatitis associated with other conventional high temperature lead wires. MGT Cleanstrip-SD lead
- North American (AWG): 6 AWG
- Number of Conductors: 1 #
- Operating Temperature: 538 C
- Product Type: Single Conductor Wire
-
Supplier: Thermal Wire and Cable LLC
Description: consistency and uniformity. The overall glass braid is treated with a proprietary saturant that promotes fiber bonding. This proprietary saturant also reduces fraying, itching and Dermatitis associated with other conventional high temperature lead wires. MGT Cleanstrip-SD lead
- North American (AWG): 18 AWG
- Number of Conductors: 1 #
- Operating Temperature: 538 C
- Product Type: Single Conductor Wire
-
Supplier: Henkel Corporation - Industrial
Description: AQUENCE 034-088-050 (5093) is a resin emulsion adhesive designed to bond various filter media to metal wire and chipboard. This product machines well on wheel coaters and exhibits excellent wet tack and strong fiber tearing bonds. All ingredients in Adhesin 51-3093 are approved
- Industry: Other
-
Supplier: Aerotech, Inc.
Description: Design Features Linear brushless servomotors for superior performance and longevity Customizable Z and theta axes for increased flexibility Optional machine base and risers Optional electroless nickel for ESD protection and medical applications Compact design reduces overall machine
- Axis Configuration: X-Y Open Frame
- Bearing Type: Linear Guide Bearing
- Carriage Load: 33.08 lbs
- Drive Specifications: None
-
Supplier: Interplex Etch Logic, LLC
Description: Technology Assemblies Press-Fit Back Panel Assemblies Au & Al Wire Bonding Electro Mechanical Assembly Custom Lead Attach Full Turn-Key Manufacturing Full Program Management Interplex Technologies continued success has been the
- Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Machining, Mechanical Assembly, Molding, Stamping, Welding and Fabrication
- Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Instruments / Sensors, Material Handling, Medical / Health Care, Military / Defense
- Location: North America, United States Only, Europe Only, South Asia Only, Near East Only, East Asia / Pacific Only
- Services: Certification / Qualification, Design / Development, Just-in-Time Delivery, Low Volume Production, High Volume Production, Packaging, Sourcing, Turnkey Product Manufacturing
-
Supplier: TMP Technologies, Inc.
Description: Fabrication and Assembly TMP's core competency includes precision forming, lamination and assembly processes from most foam materials available in bun and roll stock. These processes include: Cutting Contour Slitting and skiving Hot Wire
- Cutting: Band Saw Cutting, Electrical Discharge Machining (EDM), Miter Cutting, Router, Water Jet Cutting
- Location: North America, United States Only, Northeast US Only
- Materials: Metals, Plastics, Rubber, Composites, Foam
- Services Offered: CAD / CAM Support, Design Assistance, Prototype Services, Low Volume Production, High Volume Production, Inspection / Quality Control
-
Supplier: Stoelting Cleaning Equipment
Description: The heart of every Lewis machine, our magnetostrictive transducers are designed for heavy duty, continuous operation. They can run hot or cold and withstand tremendous shock. Standard Features Zero spaced nickel laminations wound with high temperature magnet wire and
- Application: Ultrasonic Cleaning / Liquid Processing
- Features: Rotating / IRIS
- Style / Type: Array (Linear / Phased)
-
Supplier: Arnold Magnetic Technologies
Description: Stator Construction Hand Wire Insertion Machine Wire Insertion Varnishing Dip and Bake Varnishing VPI Varnishing Trickle Varnishing
- Commutation: Brushless
- Other Output Power: 200 HP
-
Supplier: Locon Sensor Systems, Inc.
Description: distance is adjustable from 0 to 8mm, depending on the sensor model. Because of their extremely precise sensing capabilities, Locon Sensors capacitive bonding sensors can detect even the smallest gold wires in any bonding machine to attach bare wafer chips to a base
- Body: Cylindrical
- Load: DC Load
- Operating Distance: 0.0 to 0.3150 inch
- Operating Temperature: -22 to 176 F
-
Supplier: Abrisa Technologies
Description: , fabrication, HIE™ chemical strengthening or heat tempering, transparent conductive coatings, AR coatings, bus bars, electrical connectivity, wire bonding or soldering, connectors, screen printed ceramic frit or epoxy ink graphics, laser marking and applied gaskets.
- Fuel / Energy Source: Electric
-
Supplier: Hitachi High Technologies America, Inc.
Description: -section observation, circuit modification, vector scan processing, nano-micro patterning, nano molding, and 3D nano fabrication using deposition function. Cross-sectional processing of wire bonding (Processing size: W: 95 µm, D: 55 µm; Machining time: 20 min)
- Application: Biological / Life Science, Medical / Forensic
- Microscope Type: Scanning Electron Microscope (SEM)
-
Supplier: Zhuhai Cersol Technology Co., Ltd.
Description: characteristics of positive temperature coefficient, so it is also called Metallization Ceramic Heater(MCH). Characteristic ? Ceramic heating element is the best substitute for metal heating plate. ? It is another new generation after alloy heating wire and PTC heating element
- Material Type: Alumina / Aluminum Oxide
-
Supplier: Dexter Magnetic Technologies, Inc.
Description: Motors-Actuators Dexter magnetic technology for the motor / VCM market delivers the ability to push the limits on miniaturization, efficiency and performance. Many of the designs we have created enable our customers to achieve extreme performance in devices such as a wire bonding
- Magnet Type: Magnetic Assembly
-
Supplier: GE Power Conversion
Description: technology, fuseless protection and low component count, MV7000 offers longer life expectancy even under load cycling. Power density: Up to 1.1 MVA/m3 for the complete drive. Redundancy: Secured continuous conduction of the PPI in failure mode. Safety: Case rupture free and arc ignition free due to
- AC Input Frequency: 50 Hz, 60 Hz
- AC Input Phase: Single Phase, Three Phase
- Configuration: Stand Alone
- Drive Type: AC Induction Motor, AC Synchronous Motor, AC Sensorless Vector Drive, AC Vector / Feedback Drive
-
Supplier: KOBOLD Instruments, Inc.
Description: precision machined out of a single piece of 17-4 PH stainless steel. There are no welds or O-ring seals which results in an extremely high cycle life. The semiconductor strain gauges are kiln-fused to the diaphragm making a highly stable molecular bond. Molecular bonding of the
- Accuracy: 0.2500 ±% FS
- Electrical Output: Analog Voltage
- Media: Liquid, Gas
- Operating Temperature: 0.0 to 185 F
-
Description: 4.8 Post Incident Inspection 15 5. Design and Construction of Foundations 15 6. Erection 15 6.1 Vertical Alignment 15 6.2 Guide Rails 15 6.3 Grounding and Bonding 15 6.4 Hoist-Tower Enclosures 15 6.5 Hoistway
-
Supplier: DigiPas Technologies Inc.
Description: foundries. Precise levelling with vibrometer diagnostic feature of DWL-3000XY enables machine to prevent unnecessary structural vibration affecting quality and production yield. Setup and maintenance of wire bonders in semiconductor backend assembly require high machine
- Angular Range: 0.0 to 20 degrees
- Angular Resolution: 1.00E-3 degrees
- Measuring Technology: Electronic
-
Supplier: DigiPas Technologies Inc.
Description: maintenance of wire bonders in semiconductor backend assembly require high machine positional stability. Precise levelling with vibrometer diagnostic feature checking for wire bonding machine prevents unnecessary structural vibration affecting
- Angular Range: 0.0 to 90 degrees
- Angular Resolution: 0.0100 degrees
- Measuring Technology: Electronic
-
Supplier: Durabond Slide
Description: Direct replacement linear slides are in stock for all Torin mechanical spring coilers, spring manufacturing machines, and wire machinery. Advantages of DuraBond Replacement Slides Low Maintenance Rulon bearing surfaces are resistant to contamination and
-
Supplier: CARLO GAVAZZI Automation Components
Description: available to indicate the problematic zone. Increased machine uptime. Integrated overvoltage protection prevents the solid state relay from breaking down due to uncontrolled transients. Long lifetime. Wire bonding technology reduces thermal and mechanical stresses of the output
- Mounting: DIN Rail
- Operating Temperature: -4 to 149 F
-
Supplier: International Thermal Systems LLC.
Description: Radiator Core Bake Ovens bond copper brass radiators and heat exchangers. A function of a Radiator Core Bake Oven is to bond copper brass radiators and heat exchangers. The Core Bake Oven is available in either a Batch or Continuous Conveyor configuration. With the
- Application: Baking
- Atmosphere: Air / Oxidizing, Inert
- Controller Type: Programmable
- External Configuration: Continuous (Convey, Shuttle)
-
Description: matched InGaAs array is backside illuminated enabling detection from 0.4 to 1.7 µm with no bond pads or wires in the way of your signal and minimize stray reflections found in front side illuminated arrays with many wire bonds near the active imaging area. The array can be
- Array Type: Linear Array
- Horizontal Pixels: 1024
- Maximum Frame Rate: 3.20E-5 to 4.80E-5 MHz
- Operating Temperature Range: -40 to 75 C
-
Supplier: CARLO GAVAZZI Automation Components
Description: handle up to 65 AAC per pole (or 75 AAC for 2-pole switching) in a 70mm wide footprint. Long lifetime. Wire bonding technology reduces thermal and mechanical stresses of the output chips resulting in a larger number of possible operational cycles compared to other assembly technologies
- Dielectric Strength (Isolation Voltage): 1 kilovolts
- Maximum Current: 85 amps
- Mounting: DIN Rail
- Operating Temperature: -40 to 176 F
-
Supplier: Zhejiang Lisheng Spring Co., Ltd.
Description: Materials Available Oil tempered(SAE 1070-1090), hard drawn sae 1060 – 1075, stainless steel 304, 316, 631, 17-7PH(SUS), beryllium copper, phosphor copper, 65Mn, A-286, Inconel Alloy X-750, X-718, Elgiloy, MONEL K-500, MONEL 400 etc Processing Steps Design ? Drawing ? Flat the wire ? CNC
- Metallic: Stainless Steel
- Type: Wave Washer
-
Supplier: Titan Tool Supply, Inc.
Description: Industrial robotics, Machine vision, Quality control applications, Group viewing, Electronics fabrication of printed circuit boards, Wire bonders, Computer related production and testing techniques and Three Coordinate Measuring Machines all require the
- Application: Measuring / Toolmaker
- Digital Display: Yes
- Eyepiece Style: Monocular
- Total Magnification: 0.3500 to 2 X
-
Supplier: Titan Tool Supply, Inc.
Description: Industrial robotics, Machine vision, Quality control applications, Group viewing, Electronics fabrication of printed circuit boards, Wire bonders, Computer related production and testing techniques and Three Coordinate Measuring Machines all require the
- Features: Integral Video Capability
- Viewing Angle: Direct (0°), Side (90°)
- Working Length: 0.0335 to 0.2000 m
-
Supplier: International Thermal Systems LLC.
Description: Conveyor Ovens offer a variety of conveyance configurations. Conveyor Ovens can be used for a wide variety of heat processes including drying, curing, aging, annealing, stress relieving, bonding, tempering, preheating and forming. In either a horizontal or vertical configuration
- Application: Annealing, Curing, Drying, Preheating, Other
- Atmosphere: Air / Oxidizing, Inert
- Controller Type: Programmable
- External Configuration: Continuous (Convey, Shuttle)
-
Supplier: FX PCB Co., Ltd.
Description: layer 4mil/4mil (1Oz) 3mil/3mil (1Oz) Annular Ring =4mil / BGA 0.15mm BGA 0.15mm BGA Tolerance of outline (board edge to board edge) +/-0.025mm / Tolerance of outline (Mark to board edge) +/-0.05mm +/-0.025mm Impedance control +/-10% / Drilling machine drilling
- Thickness: 0.0157 inches
- Type: Film / Flexible Substrate
Find Suppliers by Category Top
Featured Products Top
-
quality can reduce usable wafer output. This multi-wire cutting machine is designed for stable, high-volume slicing: • Continuous diamond wire system for precise multi (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
burden, while inconsistent cutting can reduce usable output and process reliability. This multi-wire cutting machine supports precision material processing across semiconductor applications (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
optical glass cutting machine is designed to cut glass in a calm and controlled way, helping users achieve clean results without unnecessary damage. By using diamond wire technology, the SG (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
struggle with thickness limits or material restrictions, reducing design flexibility. This SGI 20 contour cutting machine is built for precise shape processing: • CNC contour (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
supervision can further reduce efficiency and consistency in precision applications. This glass wire cutting machine is engineered for controlled and reliable processing: • High (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
further restrict lab efficiency and iteration speed. This desktop wire cutting machine is designed for flexible and accurate processing: • Four-axis CNC control for multi (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
diamond wire technology to deliver precise profile cutting with excellent surface quality and reduced kerf loss. Unlike conventional cutting methods, the diamond wire moves in a controlled back-and-forth motion, enabling accurate machining of both internal and external contours. The fine wire (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
SH60-60 Precision Diamond Wire Saw Machine The SH60-60 diamond wire saw machine is designed for precision cutting of graphite and other hard or brittle materials. Using an (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
high-precision material processing. Utilizing a closed-loop diamond wire cutting structure, the machine delivers fast cutting speed, smooth surface quality, minimal dust generation, and excellent cutting accuracy. Equipped with two (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
APPLICATIONS IoT (Internet of Things) Applications Smart locks Small appliances Smart lighting Smart meters Vending machines (read more)
Browse Wire to Board Connectors Datasheets for TE Connectivity
Conduct Research Top
-
Ceramics Capillary for Improving Wire Bonding Efficiency
Wire bonding technology in semiconductors packaging, developed in the 1950's is one of the oldest and lowest cost interconnection solutions. It uses wire to bond by machines made from ASM Pacific, K&S, etc. similar to high-tech sewing machines; thin threads sew one chip onto another chip
-
Advanced Motion Control for Wire Bonding
on the total machine performance. Dedicated motion control solution from ETEL, as well as position encoders from HEIDENHAIN can greatly help wire bonder designers to face the new market requirements derived from chip miniaturization and its enhanced complexity.
-
Brief Introduction for Gold Wire Bonding and Laser Welding of Pressure Sensors
, it is called "Gold wire ball bonding". In the sensor production process, the bonding pads on the chip and the sintered seat tube legs are bonded with a gold wire ball bonding machine, so that power supply and signal acquisition to the chip are realized by sintering the seat tube legs.
-
Two Solutions to Static Problems in Semiconductor Die Bonder Operation
One phase of the semiconductor manufacturing process involves a die bonding machine. Several manufacturers produce this type of equipment with similar designs for the actual bonding operation. A fine gold wire (approximately 2 mil. in diameter) is attached from the semiconductor component
-
What Is The Industrial Internet Of Things?
The age of connectivity is here. From smartphones and self-driving cars to self-regulating factory equipment, futuristic gadgets aren't just for James Bond anymore. The Internet of Things (IoT) and Industrial Internet of Things (IIoT) are already dramatically changing how we interact
More Information Top
-
Advanced Wirebond Interconnection Technology
For example, an IC design engineer would have rarely seen a wire bonding machine place a ball bond on a bond pad he has designed.
-
Motion stages for electronic packaging design and control
In the past two decades, the X-Y stage used in wire bonding machines has changed a lot to conquer the contradiction between precision and acceleration.
-
Force Sensors for Microelectronic Packaging Applications
Based on the bonding method, wire bonding machines can be split into two groups, namely ball-wedge bonders and wedge-wedge bonders [19].
-
The Ball Bond Shear Test: Its Methodology and Application
Results of a comprehensive ball shear testing program are presented including methods for ball shear implementation and wire bonding machine .
-
Wire Bonding Using Offline Programming Method
Wire bond machines utilize precise control of bonding force, ultrasonic vibration, bonding temperature and bonding time to establish the connection between gold wire to bond pad or leadframe.
-
Clustering with removing outliers - a case of an IC packaging company
In this paper, we apply the clustering tech- niques to partition the wire bond machines in a packaging company into groups so that management levels can improve the productivity based on the clustering results.
-
Piezoelectrical wire feeding system for micropositioning in bonding machines
In this report a ne\ wire feeding system for line wire bonding machines and its development is presented.
-
Adaptive fuzzy process control of integrated circuit wire bonding
This task is done with a special wire bonding machine , which has several parameters to set, such as temperature, ul- trasonic power, and tool contact force.
-
Copper Wire Bonding Concerns and Best Practices
The initial investment for Cu wire bonding machines and pro- cess development and qualification is high.
-
Applied Informatics and Communication
This paper presents an improved robust control of a high speed high precision XY-table linear motion system used in semiconductor wire bonding machine .
Indicates content that may require registration and/or purchase.