Products & Services
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Supplier: Accuris
Description: WELDING MACHINES, ULTRASONIC BONDING, MINIATURE WIRE
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Supplier: Accuris
Description: WELDING MACHINES, THERMOCOMPRESSION, DIFFUSION BONDING, MINIATURE WIRE
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Supplier: Palomar Technologies, Inc
Description: using Auto Focus and automated height learning High-speed: 7 Wires Per Second 45-60° to 90° wire feed clamp interchangeability Round wire and ribbon wire can be performed using the same clamp Adaptive Bond Deformation standard Voice Coil driven bond head for precision
- Automation: Automatic
- Wire Bonder Type: Wedge Bonder
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Description: production requirement. Products have passed the ROHS and REACH environmental certification of the European Chemicals Agency, in accordance with EU Regulation No. 1907/2006. Main supplier of K&S and ASM Bonder machine manufacturer.
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Supplier: Palomar Technologies, Inc
Description: process validation and intuitive operations control. i2Gi is implemented on the 8000i Wire Bonder and available as a Bonder Performance Upgrade (BPU) for 8000 Wire Bonders. The planarBump™ feature, a patented technology that uses gold wire to produce tailless ball bumps, makes
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Supplier: Haida International Equipment Co., Ltd.
Description: Product Description Of Computer Servo Tensile Test Machine 5000kg Capacity Tensile Testing Machine is used in rubber, plastics, wire and cable, textiles, waterproof material, non-woven fabrics and other non-metallic materials and metal wire, metal foil, sheet metal and
- Force / Load Capacity: 2,205 to 11,025 lbs
- Test Speed: 0.003937007874015741 to 11.811023622047225 in/min
- Mechanical Test: Adhesion (Bond / Peel), Compressive, Creep / Stress Relaxation, Ductility, Fatigue / Cyclic, Flexure / Bending, Friction / Wear, Shear / Torsion, Tensile, Universal
- Display / User Interface: Application Software, Computer Interface
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Description: IEC 60204-32 applies to the application of electrical and electronic equipment and systems to hoisting machines and related equipment. The equipment covered by this standard commences at the point of connection of the supply to the electrical equipment of the hoisting machine
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Supplier: CSA Group
Description: IEC 60204-32 applies to the application of electrical and electronic equipment and systems to hoisting machines and related equipment. The equipment covered by this standard commences at the point of connection of the supply to the electrical equipment of the hoisting machine
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Supplier: Haida International Equipment Co., Ltd.
Description: The high low temperature universal test machine is controlled by computer and is widely used in rubber, plastic, wire and cable, textile, waterproof materials, non-woven fabrics and other non-metallic materials and metal wire, metal foil, metal sheet and metallic rods of the
- Force / Load Capacity: 4,410 lbs
- Test Speed: 0.003937007874015741 to 11.811023622047225 in/min
- Test Temperature: -40 to 150 F
- Mechanical Test: Adhesion (Bond / Peel), Flexure / Bending, Shear / Torsion, Universal
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Supplier: Tanfel
Description: Tanfel offers a full solution for your custom fabricated metal product needs. A variety of materials and finishes are available along with tool fabrication, design support and a variety of other value added services.
- Materials: Aluminum, Brass, Bronze, Copper, Nickel Alloy, Stainless Steel, Titanium, Zinc
- Secondary Services: Anodizing, Bonding, Braiding, Cutting, Slitting
- Additional Services: CAD / CAM Support, Design Assistance, High Volume Production, Just-In-Time Delivery, Low Volume Production, Prototype Services, Reverse Engineering
- Processes: Drawing, Finishing, Heat Treating
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Supplier: Haida International Equipment Co., Ltd.
Description: machine can do tensile test, tear test, peel test, bond test with different clamps for metal,wire,steel,cable,plastic and other kind of materials. This universal test machine can do different test as per customer requirement such as tensile test,elongation test, peel test, tear
- Force / Load Capacity: 11,025 lbs
- Test Speed: 0.0003937007874015742 to 11.811023622047225 in/min
- Display / User Interface: Computer Interface
- Mechanical Test: Universal
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Supplier: Allied Electronics, Inc.
Description: extremely flexible tapes can be securely applied to acute angles and tight curves and used for wrapping and flagging cables and wires. Tape Length: 26.2 feet (unless otherwise noted). TZ Machines: PT-200, 300, 310, 320, 330, 340, 350, 520, 530, 550, 580C, 1100, 1200, 1300, 1500PC,
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Supplier: Aerotech, Inc.
Description: die bonding, wire bonding, WLP and DNA profiling
- Stroke or X-Axis Travel: 7.87402 to 19.68505 inch
- Y-Axis Travel: 7.87402 to 19.68505 inch
- Rated Speed: 78.740157480315 in/sec
- Carriage Load: 33.075 lbs
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Supplier: ValueTronics International, Inc.
Description: The EQUITEST5071 is a HiPot from HT Instruments. HiPot, or high potential, is a class of electronic test equipment used to verify electrical insulation. Engineers use HiPot-testing instruments on cables, wires, circuit boards, appliances, electric motors, and transformers. As a product ages,
- Features: Current Leakage Tester, Ground Bond Testers
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Supplier: Arnold Magnetic Technologies
Description: stators. We offer glue bonding or TIG welded stator cores. Every one of our stators is wound, assembled, and tested by an experienced technician. Stator Capabilities Stator Core Construction Epoxy Bonding Welding Riveting Stator Construction Hand Wire Insertion Machine
- Other Output Power: 200 HP
- Motor Type: AC Motor, DC Motor
- Features: Brushless
- AC Construction: Induction
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Supplier: Thermal Wire and Cable LLC
Description: fiber bonding which ultimately reduces fraying and itching associated with other conventional high temperature wires. Thermal Wire and Cable's TGGT lead wires are unaffected by flame, fuels, solvents most acids, alkalis and oils and pass IEEE-383 70,000 BTU/HR Flame Test.
- North American (AWG): 22 AWG
- Number of Conductors: 1 #
- Rated Voltage: 0.3 kilovolts
- Rated Amperage: 12 amps
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Supplier: Henkel Corporation - Industrial
Description: AQUENCE 034-088-050 (5093) is a resin emulsion adhesive designed to bond various filter media to metal wire and chipboard. This product machines well on wheel coaters and exhibits excellent wet tack and strong fiber tearing bonds. All ingredients in Adhesin 51-3093 are approved under
- Features: Other
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Description: microcavities or small structures, and it is satisfied with the machining requirements of micro holes and fine molds. Micro EDM processing drum is made of fine tungsten wire or alloy wire. During processing, a micro energy pulse power supply and a dedicated EDM engine oil are added
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Supplier: Hitachi High Technologies America, Inc.
Description: observation, circuit modification, vector scan processing, nano-micro patterning, nano molding, and 3D nano fabrication using deposition function. Cross-sectional processing of wire bonding (Processing size: W: 95 µm, D: 55 µm; Machining time: 20 min)
- Application: Biological / Life Science, Medical / Forensic
- Grade: Research
- Microscope Type: Scanning Electron Microscope (SEM)
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Supplier: Stoelting Cleaning Equipment
Description: The heart of every Lewis machine, our magnetostrictive transducers are designed for heavy duty, continuous operation. They can run hot or cold and withstand tremendous shock. Standard Features Zero spaced nickel laminations wound with high temperature magnet wire and silver brazed to a
- Transducer Style: Array (Linear / Phased)
- Features & Format: Rotating / IRIS
- Application: Ultrasonic Cleaning / Liquid Processing
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Supplier: Locon Sensor Systems, Inc.
Description: is adjustable from 0 to 8mm, depending on the sensor model. Because of their extremely precise sensing capabilities, Locon Sensors capacitive bonding sensors can detect even the smallest gold wires in any bonding machine to attach bare wafer chips to a base plate. Locon
- Operating Distance: 0 to 0.3149608 inch
- Operating Temperature: -22 to 176 F
- Sensor Technology: Capacitive Proximity Sensor
- Body Shape: Cylindrical, Threaded Barrel
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Supplier: Haida International Equipment Co., Ltd.
Description: system is featured in curve process, multi-sensor support, image interface, flexible data process and powerful system function. Installation and adjustment: 1. the test machine from its packaging, check whether the crash test machine in transit, damage phenomena 2. the test
- Force / Load Capacity: 1,102.5 to 4,410 lbs
- Stroke / Travel: 39.3701 inch
- Test Speed: 0.003937007874015741 to 19.68503937007871 in/min
- Mechanical Test: Adhesion (Bond / Peel), Compressive, Creep / Stress Relaxation, Ductility, Fatigue / Cyclic, Flexure / Bending, Friction / Wear, Shear / Torsion, Tensile, Universal
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Supplier: KOBOLD Instruments, Inc.
Description: O-ring seals which results in an extremely high cycle life. The semiconductor strain gauges are kiln-fused to the diaphragm making a highly stable molecular bond. Molecular bonding of the sensing element produces a pressure sensor that will have exceptional long term stability in demanding
- Working Pressure Range: 0 to 10,000 psi
- Accuracy: 0.25 ±% FS
- Operating Temperature: 0 to 185 F
- Signal Output: Analog Voltage
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Supplier: Durabond Slide
Description: Direct replacement linear slides are in stock for all Torin mechanical spring coilers, spring manufacturing machines, and wire machinery. Advantages of DuraBond Replacement Slides Low Maintenance Rulon bearing surfaces are resistant to contamination and require no lubrication thus
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Supplier: Dexter Magnetic Technologies, Inc.
Description: Motors-Actuators Dexter magnetic technology for the motor / VCM market delivers the ability to push the limits on miniaturization, efficiency and performance. Many of the designs we have created enable our customers to achieve extreme performance in devices such as a wire bonding
- Industrial Magnets: Magnetic Assembly
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Description: The LineCam12 is an advanced linescan SWIR camera with 14-bit digital data at 37klines/s on USB3 or Camera Link™ outputs. The SWIR camera currently comes in two varieties: 250 μm tall pixels for spectroscopy and 12.5 μm square pixels for machine vision applications. The camera has incredible
- Horizontal Resolution: 1,024 lines
- Maximum Frame Rate: 37 to 48 fps
- Width / Diameter: 4.0157502 inch
- Height: 4.0157502 inch
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Supplier: DigiPas Technologies Inc.
Description: and maintenance of wire bonders in semiconductor backend assembly require high machine positional stability. Precise levelling for wire bonding machine prevents unnecessary structural vibration affecting wire-bond quality and production yield. The DWL-3500XY
- Angular Range: 0 to 20 degrees
- Angular Resolution: 0.001 degrees
- Measuring Technology: Electronic
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Supplier: Interplex Etch Logic, LLC
Description: Panel Assemblies Au & Al Wire Bonding Electro Mechanical Assembly Custom Lead Attach Full Turn-Key Manufacturing Full Program Management Interplex Technologies continued success has been the result of our commitment to two principles: maintaining a high standard of quality in all of
- Industry / Application: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Instruments / Sensors, Material Handling, Medical / Health Care, Military / Defense
- Services: Certification / Qualification, Design / Development, High Volume Production, Just-in-Time Delivery, Low Volume Production, Packaging, Sourcing, Turnkey Product Manufacturing
- Features: East Asia / Pacific Only, Europe Only, Near East Only, North America, South Asia Only, United States Only
- Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Machining, Mechanical Assembly, Molding, Stamping, Welding and Fabrication
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Supplier: TMP Technologies, Inc.
Description: and assembly processes from most foam materials available in bun and roll stock. These processes include: Cutting Contour Slitting and skiving Hot Wire shaping Embossing and convoluting Vertical cutting Compression forming Pressure cutting Peeling and buffering High speed rotary, kiss and die
- Applications: Automotive / Transportation, Consumer / Furniture, Cushioning, Medical, Packaging, Sealing / Gasketing, Wicking / Reservoir
- Capabilities: Contour Cutting, Convolutions, Die Cutting, Finished Product Assembly, Hot Wire Cutting, Laminating, Routing, Slitting, Water / Abrasive Jet Machining
- Features: North America, Northeast US Only, Other, United States Only
- Foam Type: Open Cellular
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Supplier: Abrisa Technologies
Description: wire bonding or soldering, connectors, screen printed ceramic frit or epoxy ink graphics, laser marking and applied gaskets.
- Features: Electric, Other
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Supplier: Allied Electronics, Inc.
Description: These extremely flexible tapes can be securely applied to acute angles and tight curves and used for wrapping and flagging cables and wires. Tape Length: 26.2 feet (unless otherwise noted). TZ Machines: PT-200, 300, 310, 320, 330, 340, 350, 520, 530, 550, 580C, 1100, 1200, 1300,
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Supplier: Allied Electronics, Inc.
Description: flexible tapes can be securely applied to acute angles and tight curves and used for wrapping and flagging cables and wires. Tape Length: 26.2 feet (unless otherwise noted). TZ Machines: PT-200, 300, 310, 320, 330, 340, 350, 520, 530, 550, 580C, 1100, 1200, 1300, 1500PC, 1700, 1750,
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Supplier: Allied Electronics, Inc.
Description: flexible tapes can be securely applied to acute angles and tight curves and used for wrapping and flagging cables and wires. Tape Length: 26.2 feet (unless otherwise noted). TZ Machines: PT-200, 300, 310, 320, 330, 340, 350, 520, 530, 550, 580C, 1100, 1200, 1300, 1500PC, 1700, 1750,
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Featured Products Top
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Precision processing of brittle materials requires cutting equipment that can achieve high accuracy while minimizing chipping, material loss, and surface damage. Vimfun SGR15 desktop diamond wire cutting machine is designed for precision slicing and contour cutting of optical glass (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
quality can reduce usable wafer output. This multi-wire cutting machine is designed for stable, high-volume slicing: • Continuous diamond wire system for precise multi (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
burden, while inconsistent cutting can reduce usable output and process reliability. This multi-wire cutting machine supports precision material processing across semiconductor applications (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
contour cutting machine uses advanced diamond wire cutting technology to process irregular shapes in silicon, glass, sapphire, quartz, jade, and other materials. Integrated CAD/CAM software enables complex profile editing and precision contour processing (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
optical glass cutting machine is designed to cut glass in a calm and controlled way, helping users achieve clean results without unnecessary damage. By using diamond wire technology, the SG (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
struggle with thickness limits or material restrictions, reducing design flexibility. This SGI 20 contour cutting machine is built for precise shape processing: • CNC contour (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
supervision can further reduce efficiency and consistency in precision applications. This glass wire cutting machine is engineered for controlled and reliable processing: • High (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
further restrict lab efficiency and iteration speed. This desktop wire cutting machine is designed for flexible and accurate processing: • Four-axis CNC control for multi (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
diamond wire technology to deliver precise profile cutting with excellent surface quality and reduced kerf loss. Unlike conventional cutting methods, the diamond wire moves in a controlled back-and-forth motion, enabling accurate machining of both internal and external contours. The fine wire (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
SH60-60 Precision Diamond Wire Saw Machine The SH60-60 diamond wire saw machine is designed for precision cutting of graphite and other hard or brittle materials. Using an (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw
Conduct Research Top
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Ceramics Capillary for Improving Wire Bonding Efficiency
Wire bonding technology in semiconductors packaging, developed in the 1950's is one of the oldest and lowest cost interconnection solutions. It uses wire to bond by machines made from ASM Pacific, K&S, etc. similar to high-tech sewing machines; thin threads sew one chip onto another chip
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Advanced Motion Control for Wire Bonding
on the total machine performance. Dedicated motion control solution from ETEL, as well as position encoders from HEIDENHAIN can greatly help wire bonder designers to face the new market requirements derived from chip miniaturization and its enhanced complexity.
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Brief Introduction for Gold Wire Bonding and Laser Welding of Pressure Sensors
, it is called "Gold wire ball bonding". In the sensor production process, the bonding pads on the chip and the sintered seat tube legs are bonded with a gold wire ball bonding machine, so that power supply and signal acquisition to the chip are realized by sintering the seat tube legs.
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Two Solutions to Static Problems in Semiconductor Die Bonder Operation
One phase of the semiconductor manufacturing process involves a die bonding machine. Several manufacturers produce this type of equipment with similar designs for the actual bonding operation. A fine gold wire (approximately 2 mil. in diameter) is attached from the semiconductor component
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What Is The Industrial Internet Of Things?
The age of connectivity is here. From smartphones and self-driving cars to self-regulating factory equipment, futuristic gadgets aren't just for James Bond anymore. The Internet of Things (IoT) and Industrial Internet of Things (IIoT) are already dramatically changing how we interact
More Information Top
Indicates content that may require registration and/or purchase.
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Advanced Wirebond Interconnection Technology
For example, an IC design engineer would have rarely seen a wire bonding machine place a ball bond on a bond pad he has designed.
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Motion stages for electronic packaging design and control
In the past two decades, the X-Y stage used in wire bonding machines has changed a lot to conquer the contradiction between precision and acceleration.
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Force Sensors for Microelectronic Packaging Applications
Based on the bonding method, wire bonding machines can be split into two groups, namely ball-wedge bonders and wedge-wedge bonders [19].
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The Ball Bond Shear Test: Its Methodology and Application
Results of a comprehensive ball shear testing program are presented including methods for ball shear implementation and wire bonding machine .
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Wire Bonding Using Offline Programming Method
Wire bond machines utilize precise control of bonding force, ultrasonic vibration, bonding temperature and bonding time to establish the connection between gold wire to bond pad or leadframe.
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Clustering with removing outliers - a case of an IC packaging company
In this paper, we apply the clustering tech- niques to partition the wire bond machines in a packaging company into groups so that management levels can improve the productivity based on the clustering results.
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Piezoelectrical wire feeding system for micropositioning in bonding machines
In this report a ne\ wire feeding system for line wire bonding machines and its development is presented.
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Adaptive fuzzy process control of integrated circuit wire bonding
This task is done with a special wire bonding machine , which has several parameters to set, such as temperature, ul- trasonic power, and tool contact force.
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Copper Wire Bonding Concerns and Best Practices
The initial investment for Cu wire bonding machines and pro- cess development and qualification is high.
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Applied Informatics and Communication
This paper presents an improved robust control of a high speed high precision XY-table linear motion system used in semiconductor wire bonding machine .