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  • Ceramics Capillary for Improving Wire Bonding Efficiency
    Wire bonding technology in semiconductors packaging, developed in the 1950's is one of the oldest and lowest cost interconnection solutions. It uses wire to bond by machines made from ASM Pacific, K&S, etc. similar to high-tech sewing machines; thin threads sew one chip onto another chip
  • Advanced Motion Control for Wire Bonding
    on the total machine performance. Dedicated motion control solution from ETEL, as well as position encoders from HEIDENHAIN can greatly help wire bonder designers to face the new market requirements derived from chip miniaturization and its enhanced complexity.
  • Brief Introduction for Gold Wire Bonding and Laser Welding of Pressure Sensors
    , it is called "Gold wire ball bonding". In the sensor production process, the bonding pads on the chip and the sintered seat tube legs are bonded with a gold wire ball bonding machine, so that power supply and signal acquisition to the chip are realized by sintering the seat tube legs.
  • Two Solutions to Static Problems in Semiconductor Die Bonder Operation
    One phase of the semiconductor manufacturing process involves a die bonding machine. Several manufacturers produce this type of equipment with similar designs for the actual bonding operation. A fine gold wire (approximately 2 mil. in diameter) is attached from the semiconductor component
  • What Is The Industrial Internet Of Things?
    The age of connectivity is here. From smartphones and self-driving cars to self-regulating factory equipment, futuristic gadgets aren't just for James Bond anymore. The Internet of Things (IoT) and Industrial Internet of Things (IIoT) are already dramatically changing how we interact

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