Flexible Heat Sinks

Description: which provides greater design flexibility. Instead, each fin is cut separately using the same tool which allows for lower tooling costs. Additionally skived heat sinks can be constructed of aluminum or copper allowing for full, one-piece copper solutions for high performance

• Device: Passive Heat Sink
• Heat Sink Fin Style: Other
• Height: 10 to 60 mm
• Length: 150 to 200 mm

Description: ThermaCool™ Heat Sinks have been sized for each of our standard products and to accommodate a range of desired operating conditions. Proper heat sink sizing is determined by a number of factors, including those listed below: Power Dissipated (Watts) - Determined by the

• Device: Passive Heat Sink
• Heat Sink Fin Style: Straight Fin
• Height: 0.0381 mm
• Mounting: Mounting Holes

Description: For high volume production, Aavid zipper fins are the most cost efficient method for high fin density heat sinks. These fins are made from a stamped material, typically aluminum or copper, and are folded into shape with interlocking grooves. The fins are then typically soldered,

• Device: Passive Heat Sink
• Heat Sink Fin Style: Other
• Material: Aluminum, Copper

Description: The Aavid portfolio of folded fins includes over 3,000 different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat sinks and other fabrications. These fins can be purchased

• Device: Passive Heat Sink
• Heat Sink Fin Style: Folded Fin
• Height: 0.7600 to 50.8 mm
• Material: Aluminum, Copper, Mixed Material, Other Materials

Description: for mounting holes, screws or rivets while optimizing the contact and thermal efficiency of the heat sink. Max Clips™ are quick, robust attachments that save on labor and hardware costs and increase design flexibility. Max Clips apply consistent, uniform pressure at the

• Device: Passive Heat Sink
• Heat Sink Fin Style: Straight Fin
• Height: 5.1 to 48 mm
• Length: 16.5 to 37.4 mm

Description: Ohmite introduces the powerful B60/ C60 series heatsink with cam clip (Pat. Pending) or custom mounting. The B60/C60 series offers flexibility, high performance, and a compact heat sink design with exchangeable cam clip system for TO-247 and TO-264 devices. The B60 series can be

• Device: Passive Heat Sink
• Height: 41 mm
• Length: 75 mm
• Material: Aluminum, Mixed Material

Description: selected to provide the desired resistance value based on the supply voltage. Benefits: Flexible heaters offer very good heat transfer to the heat sink in a very low profile and low mass package. Because they are flexible, they can also conform to, and heat,

• Heater Style: Etched Foil Elements
• Sleeve (Sheath) Material: Polyimide

Description: Ohmite M series high performance, configurable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides easy assembly, large surface area and small footprint. It is the ideal type of heat sink for high

• Height: 38.6 mm
• Length: 55 mm
• Material: Aluminum
• Mounting: Clips, Other

Description: Ohmite M series high performance, configurable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides easy assembly, large surface area and small footprint. It is the ideal type of heat sink for high

• Height: 38.6 mm
• Length: 27 mm
• Material: Aluminum
• Mounting: Clips, Other

Description: Dimensions = 58 x 32 x 46.3mm Mounting = Clip Colour = Black Special Features = Compact Heat Sink with Cam Clip, Flexible, High Performance Finish = Black Anodized Material = Aluminium

• Height: 46.3 mm
• Length: 58 mm
• Material: Aluminum
• Mounting: Clips, Other

Description: Dimensions = 58 x 32 x 46.3mm Mounting = Clip Series = C40 Surface Area = 41180mm² Special Features = Compact Heat Sink with Cam Clip, Flexible, High Performance Material = Aluminium

• Height: 46.3 mm
• Length: 58 mm
• Material: Aluminum
• Mounting: Clips, Other

Description: Features Compatible with mainstream north bridge. Dual sintered powder heatpipes, high performance. Flexible clips to ensure wide compatibility. All copper fins dissipate heat very quickly. Modding looking

Description: composite materials for heat sinks, die tabs and heat spreaders provide our customers with significant advantages over more conventional laminate or MMC materials. DiaCoolTM materials deliver a device-friendly coefficient of thermal expansion (CTE) and very high thermal

Description: Features Compatible with mainstream north bridge. Adding a 40mm fan to the heatsink to achieve better cooling performance. Flexible clips to ensure wide compatibility. Application For Compatible with mainstream north bridge

Description: cooling efficiency and a custom-designed fan ensure operation that's both cooler and quieter than most stock CPU fans. The small form factor and flexible tubing allow the Hydro Series H40 to fit in most PC gaming systems. It works with most modern AMD and Intel sockets, and the illustrated

• Device: Liquid Cooler/Cold Plate

Description: 2.5" HDD/SDD into 3.5" bays. Efficiency High efficiency. Cooling and noise reduction due to 2 mm Heatsink structure with Thermal Conductive Sheets. Flexible Mounting Adjustment Position of Anti-Vibration Screw Blocks can be adjusted by sliding to fit

Description: cooling for your gaming rig, take a look at the H40. Quiet, Compact and Compatible. Liquid cooling efficiency and a custom-designed fan ensure operation that's both cooler and quieter than most stock CPU fans. The small form factor and flexible tubing allow the Hydro Series H40 to

• Device: Cold Plate

Description: Ohmite introduces the CR series heatsink with cam clip (Pat. Pending). The CR series offers flexibility, high performance, and is comparable to popular Aavid MAX-clip heatsinks. The cam clip system for TO-247 and TO-264 devices is proprietary and provides tool or fixture free assembly. The CR

• Device: Passive Heat Sink
• Heat Sink Fin Style: Other
• Height: 50.04 to 74.93 mm
• Length: 25 to 75 mm

Description: bonded or cemented to heat sinks or other parts to be heated. They can be virtually any size, shape and configuration and are the ideal solution for many low- and medium-temperature applications that do not conform to standard heater shapes, sizes and dimensions. Custom products

• AC Voltage Required: 115 volts
• Length: 2 to 48 inch
• Maximum Operating (Sheath) Temperature: -70 to 450 F
• Sleeve (Sheath) Material: Rubber

Description: bonded or cemented to heat sinks or other parts to be heated. They can be virtually any size, shape and configuration and are the ideal solution for many low- and medium-temperature applications that do not conform to standard heater shapes, sizes and dimensions. Custom products

• AC Voltage Required: 115 volts
• Maximum Operating (Sheath) Temperature: -70 to 450 F
• Sleeve (Sheath) Material: Rubber
• Watt Density: 2.5 to 10 W/in²

Description: ) Custom resistance options up to 25 /in² (3.9 /cm²) Factory forming techniques offer three dimensional packaging capabilities Integral temperature sensors Custom profiled heat density and mechanical clamping offers uniform heat sink temperature which can improve processing

• AC Voltage Required: 18 volts
• Length: 8 inch
• Maximum Operating (Sheath) Temperature: -238 to 1112 F
• Watt Density: 1.9 W/in²

Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 32.78 to 120 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Dielectric Constant (Relative Permittivity): 3.42

Description: capability allows higher wattage levels Optional custom profiled heat density creates a uniform heat sink temperature which can improve processing yields High temperature capability to 235°C (455°F) Custom shapes and sizes to 22" x 90" (560 x 2285 mm) Custom

• AC Voltage Required: 115 volts
• Length: 5 inch
• Maximum Operating (Sheath) Temperature: -26 to 212 F
• Watt Density: 10 W/in²

Description: adhesives that are matched to the dielectric’s physical and chemical properties; and element alloys that have been developed to increase capabilities at lower costs. Frequently, Thermal Circuits develops its heater components into turn-key assemblies with added value extensions including heat

• Industry Served: Aerospace, Automotive, Electronics, Food and Beverage, General Industrial, Medical, Military, Other
• Location: North America, United States Only, Northeast US Only
• Services: Design Assistance

Description: Birk's silicone rubber heaters are rugged, flexible and chemical-resistant. Our rugged flexible heaters can be combined with many components. Thermostats, fuses, thermocouples, RTDs, thermistors, connectors, heat sinks, wiring harnesses, motors and any other desired

Description: bare 3-wire leads as a standard configuration (connector optional), it can be customized for use in a wide variety of applications. The sensor can be easily applied with its selfadhesive backing, or positioned permanently with OMEGABOND cements. Use the SA1-RTD to monitor chip, heat

• Bare or Insulated Lead Wires: Yes
• Basic Element Used: RTD
• Element Configuration: Single Element
• Probe Configuration: Flexible Probe, Flat/Ribbon

Description: for a wide variety of uses, particularly in automotive applications. Combining the properties of silicone rubber pads with those of a conventional heat transfer paste, TCOR has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance.

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Reactive / Moisture Cured, Single Component System
• Features: Flexible / Dampening, Thermal / Heat Conductive
• Industry: Automotive, Electronics

Description: LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength

• Features: Thermal / Heat Conductive
• Thermal Conductivity: 1.1 W/m-K

Description: temperatures – maintains adhesion strength up to temperatures as high as 175°C; extreme environment capable High electrical and thermal conductivity – superior grounding and minimum thermal resistance to heat sink Compatible with temperature

• Features: Thermal / Heat Conductive

Description: LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: OEM / Industrial
• Thermal Conductivity: 1.1 W/m-K

Description: resulting RF reflections created by the heat sink’s surface can cause performance robbing resonances. Suppress-n-Sink is a low-cost, flexible solution to both of these problems. Produced in sheets, Suppress-n-Sink material can be die cut to any shape. The materials

Description: substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion. Low temperature cure Flexible Good adhesion

• Adhesive: Epoxy
• Backing: Specialty / Other
• Thickness: 0.0020 inches

Description: • Resistive touchscreen display (HMI) • NEMA 4x sealed enclosure, water proof and dust proof • Stainless steel construction • LCD screen shielded by a Tempered Glass Protective Overlay • Easy latch access • Hard-anodized aluminum heat sink

• CPU Speed: 1730 MHz
• Configuration or Mounting Style: Other Mounting Style
• Display Type: Flat Panel Display (FPD)
• Features: Keyboard Support, Networkable System, Meets NEMA Enclosure Standards, Mouse Support

Description: unobtrusively measure pressure distribution in a variety of applications. Molds Gaskets Heat Sinks Sealing Bars Pinch Rollers & Nips

• Category of Device: Sensor / Transducer
• Force Measured: Compression
• Operating Temperature: 400 F
• Sensor Output: Digital

Description: 600W/ch stereo or 1200W of 70V mono power. Reliability - Massive power toroid and heat sinks; heavy 14-gauge chassis; patented Back-Slope? AC voltage stabilization; Clip limiters, DC voltage, over-current, and thermal protection circuits. *3 modes of operation: Stereo (4-ohm), Dual

Description: 600W/ch stereo or 1200W of 70V mono power. Reliability - Massive power toroid and heat sinks; heavy 14-gauge chassis; patented Back-Slope? AC voltage stabilization; Clip limiters, DC voltage, over-current, and thermal protection circuits. *3 modes of operation: Stereo (4-ohm), Dual

Description: 600W/ch stereo or 1200W of 70V mono power. Reliability - Massive power toroid and heat sinks; heavy 14-gauge chassis; patented Back-Slope? AC voltage stabilization; Clip limiters, DC voltage, over-current, and thermal protection circuits. *3 modes of operation: Stereo (4-ohm), Dual

Description: effect that can reduce the external thermal resistance by up to 20 %, thus making it possible to increase the current by up to 15 % or reduce the chip temperature by 15...20 K. If these advantages are not made use of, less complex heat sink designs than those in sixpacks are possible.

Description: steel construction • LCD screen shielded by a Tempered Glass Protective Overlay • Easy latch access • Hard-anodized aluminum heat sink • Closed loop thermal cooling for high heat environments • Flexible mounting options • Keyboard/mouse optional • 0° to 50°C Operation /

• Display Size: 19 inch
• Features: Touch Screen
• IDE Disks Capacity: 120 GB
• Operating System: Microsoft®

Description: construction • LCD screen shielded by a Tempered Glass Protective Overlay • Easy latch access • Hard-anodized aluminum heat sink • Closed loop thermal cooling for high heat environments • Flexible mounting options • Keyboard/mouse optional • 0° to 50°C Operation /

• Display Size: 17 inch
• Features: Touch Screen
• IDE Disks Capacity: 120 GB
• Operating System: Microsoft®

Description: heat sinks to provide superior heat transfer. In many cases, Birk's Kapton® film heaters are designed to provide immediate integration into assemblies, which include sensors, heat sinks, fuses, probes and electronics. Many of these products are completely assembled

• Fuel / Energy Source: Electric
• Heater Type: Other

Description: Sinter Silver Paste for Package Sinter Attachment Product Overview ALPHA Argomax 2047 is a nano-Silver sintering paste developed to meet the increasing demand of large area attach applications (module to baseplate and heat-sink attach) by providing a thick bond line

Description: Nutfield Technology’s QS-7 Open Frame 2-Axis Scan Heads are compact and provide flexibility for mounting in OEM applications or pro ducts. The scan head includes two galvanometers with mirrors mounted in optimized XY configuration, two servo amplifiers (require mounting to heat

• Automation / Control: Windows / PC Control
• Beam Delivery Component: Galvanometer Scanner, Laser Head / Focusing Unit
• Clear Aperture / Beam Diameter: 7 to 10 mm
• Process / Operation: Laser Marking, Other

Description: and flexibility make it ideal for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80 to 100 ºC for simple rework. Once cured the adhesive is flexible with 80 A hardness and tensile

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Dielectric Strength: 750 kV/in
• Thermal Conductivity: 1.7 W/m-K

Description: We know that our customers need options when designing hermetic packages to protect sensitive electronics. Our thermal titanium composite packaging technology with Cu/Mo heat sinks was developed to address the evolving needs of our customers. These housings use titanium as the primary

• Materials: Other

Description: High electrical and thermal conductivity – superior grounding and minimum thermal resistance to heat sink Compatible with temperature-sensitiv e substrates and components – cures at a low temperature of 125°C Flexible – allows use of material combinations with CTE mismatches

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 11.39 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: OEM / Industrial

Description: of end connectors and data rate Multiple heat sink options Patent pending FireFly™ evaluation kit available. Active optical cable assembly sold separately For more information, contact

• Bending Radius: 7.5 mm
• Cable Type: Simplex, Duplex, Multifiber Cable
• Connector Type: None, MTP, Other
• Fiber Mode: Multimode

Description: metallic case which serves as a heat sink for the electronics. Outdoor mounting in NEMA 4 class boxes and pedestals gives the HS8000 the flexibility needed for a wide range of deployments in power, wireless, military, utility, pipeline, security/ surveillance, highway management

• Area Network Type: Local Area Network (LAN)
• Features: Ruggedized
• Form Factor: Rack Mount
• Number of Ports: 10 #

Description: need it. Innovative, finned aluminum heat sink keeps toggle switch cool for a long switch life. Versatile mounting systems features 4 standard mounts to choose from. Heavy duty vinyl covered flexible arm keeps grease and oil contaminants out for long lasting performance. Heavy

• Application: Other
• Lamp Type: Fluorescent, Other
• Light Fixture Type: Other
• Light Fixture Wattage: 23 watts

Description: need it. Innovative, finned aluminum heat sink keeps toggle switch cool for a long switch life. Versatile mounting systems features 4 standard mounts to choose from. Heavy duty vinyl covered flexible arm keeps grease and oil contaminants out for long lasting performance. Heavy

• Application: Other
• Lamp Type: Fluorescent, Other
• Light Fixture Type: Other
• Light Fixture Wattage: 23 watts

Description: need it. Innovative, finned aluminum heat sink keeps toggle switch cool for a long switch life. Versatile mounting systems features 4 standard mounts to choose from. Heavy duty vinyl covered flexible arm keeps grease and oil contaminants out for long lasting performance. Heavy

• Application: Other
• Lamp Type: Fluorescent, Other
• Light Fixture Type: Other
• Light Fixture Wattage: 23 watts

Description: need it. Innovative, finned aluminum heat sink keeps toggle switch cool for a long switch life. Versatile mounting systems features 4 standard mounts to choose from. Heavy duty vinyl covered flexible arm keeps grease and oil contaminants out for long lasting performance. Heavy

• Application: Other
• Lamp Type: Fluorescent, Other
• Light Fixture Type: Other
• Light Fixture Wattage: 23 watts

Description: /mK Low minimum bond line thickness (90-100 µm) Emphasized thermal stability in cured state Primerless adhesion to metal, Al, based heat sinks, to ceramics, FR4. Flexibility in application method superior dispensing performance, screen printability suitable for automated bonding

• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 8.33 µin/in-F
• Cure Type / Technology: Single Component System
• Dielectric Strength: 279 kV/in

Description: to bond flexible circuits to rigid boards during the fabrication of rigid-flex circuits, as well as to bond stiffeners and heat sinks. Construction and Certification for Sheet Adhesive: Adhesive thickness: 12, 25, 50, 75 and 100um Certified to IPC 4203A/18

• Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
• Features: Encapsulating / Potting
• Industry: Electronics, OEM / Industrial

Description: -flex circuits, as well as to bond stiffeners and heat sinks. Construction and Certification for Sheet Adhesive: Adhesive thickness: 12, 25, 50, 75 and 100um Certified to IPC 4203A/18

• Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
• Features: Encapsulating / Potting, UL Approved
• Industry: Electronics, OEM / Industrial