BGA Memory Chips

Manufacturer: Cypress Semiconductor Corp. Storage Condition: Dry storage cabinet & Humidity protection package. Win Source Part Number: 1154832-AM29SL800DB90WAD. Number of Pins: 48. Categories: Custom Parts. Case / Package: FBGA. Popularity: Medium. Fake Threat In the Open Market: 53 pct. Supply... [See More]

• Package Type: BGA; FBGA
• Pins: 48

• Memory Category: Flash

Cypress, S25FL128LAGBHV020 [See More]

• Package Type: BGA
• Density: 128000

• Memory Category: Flash
• Pins: 24

Synchronous FIFO 36M (1M x 36) Uni-Directional 133MHz 10ns 209-FBGA (14x22) [See More]

• Package Type: BGA; 209-BGA
• Data Rate: 133

• Density: 36000
• Access Time: 10

IBM04188 - 8Mb (512K x 18) SRAM [See More]

• Package Type: BGA; BGA153

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 926931-MEC1428-SZ-C1. Operating Temperature Range: 0 °C ~ 70 °C. Core Processor: MIPS32 ® M14K ™. Package: Tray. Package: 144-WFBGA. Mounting: Surface Mount. Number of I/O: 108. Program Memory Type: External Program... [See More]

• Package Type: BGA; 144-WFBGA (9x9)

• Operating Temperature: 0 to 70

Cypress, S25FL128LAGBHV020 [See More]

• Package Type: BGA
• Density: 128000

• Memory Category: Flash
• Pins: 24

Asynchronous, Synchronous FIFO 36K (2K x 18)(4K x 9) Uni-Directional 83MHz, 200MHz 10ns, 3.6ns 144-PBGA (13x13) [See More]

• Package Type: BGA; 144-BGA
• Operating Current: 60

• Density: 36
• Data Rate: 83 to 200

Standard SRAM, 64KX16, 10ns, CMOS, PBGA48 [See More]

• Package Type: BGA; CABGA48
• Logic Family: CMOS

• Memory Category: SRAM Chip

Manufacturer: Cypress Semiconductor Corp. Win Source Part Number: 916604-CYF0018V33L-133BGXI. Operating Temperature Range: -40 °C ~ 85 °C. Features: Synchronous FIFO 18M (512K x 36) Uni-Directional 133MHz 10ns 209-FBGA (14x22). Package: Tray. Package: 209-BGA. Mounting: Surface Mount. Part... [See More]

• Package Type: BGA; 209-FBGA (14x22)
• Operating Temperature: -40 to 85

• Memory Category: FIFO

Cypress, S25FL256LAGBHV020 [See More]

• Package Type: BGA
• Density: 256000

• Memory Category: Flash
• Pins: 24

Asynchronous, Synchronous FIFO 36K (1K x 36) Uni-Directional 100MHz, 225MHz 8ns, 3.4ns 208-PBGA (17x17) [See More]

• Package Type: BGA; 208-BGA
• Operating Current: 70

• Density: 36
• Data Rate: 100 to 225

128K X 36, 256K X 18, 3.3V Synchronous ZBT SRAM [See More]

• Package Type: BGA; CABGA165

• Memory Category: SRAM Chip

Manufacturer: Cypress Semiconductor Corp. Win Source Part Number: 916605-CYF0036V33L-133BGXI. Operating Temperature Range: -40 °C ~ 85 °C. Features: Synchronous FIFO 36M (1M x 36) Uni-Directional 133MHz 10ns 209-FBGA (14x22). Package: Tray. Package: 209-BGA. Mounting: Surface Mount. Part... [See More]

• Package Type: BGA; 209-FBGA (14x22)
• Operating Temperature: -40 to 85

• Memory Category: FIFO

Cypress, S25FL256SAGBHBA00 [See More]

• Package Type: BGA
• Density: 256000

• Memory Category: Flash
• Pins: 24

Asynchronous, Synchronous FIFO 36K (1K x 36) Uni-Directional 100MHz, 225MHz 8ns, 3.4ns 208-PBGA (17x17) [See More]

• Package Type: BGA; 208-BGA
• Operating Current: 70

• Density: 36
• Data Rate: 100 to 225

4 Meg (256K X 16-Bit) 3.3V Static RAM [See More]

• Package Type: BGA; BGA48
• Density: 0

• Memory Category: SRAM Chip

Manufacturer: Cypress Semiconductor Corp. Win Source Part Number: 867916-CYF0072V18L-133BGXI. Operating Temperature Range: -40 °C ~ 85 °C. Features: Synchronous FIFO 72M (2M x 36) Uni-Directional 133MHz 10ns 209-FBGA (14x22). Package: Tray. Package: 209-BGA. Mounting: Surface Mount. Part... [See More]

• Package Type: BGA; 209-FBGA (14x22)
• Operating Temperature: -40 to 85

• Memory Category: FIFO

Cypress, S25FL256LAGBHV020 [See More]

• Package Type: BGA
• Density: 256000

• Memory Category: Flash
• Pins: 24

Asynchronous, Synchronous FIFO 1.125M (16K x 72) Uni-Directional 100MHz, 225MHz 8ns, 3.4ns 324-PBGA (19x19) [See More]

• Package Type: BGA; 324-BGA
• Operating Current: 130

• Density: 1125
• Data Rate: 100 to 225

BQ2028 4Kb EEPROM with single-wire HDQ interface and temperature sensor [See More]

• Package Type: BGA; DSBGA12

• Memory Category: EEPROM

Manufacturer: Micron Technology Inc. Win Source Part Number: 886169-MT29PZZZ4D4BKEPK-18 W.94H. Features: Memory IC 168-VFBGA (12x12). Package: Tray. Package: 168-VFBGA. Mounting: Surface Mount. Part Status: Obsolete. Categories: Integrated Circuits (ICs). Case / Package: 168-VFBGA (12x12). ECCN:... [See More]

• Package Type: BGA; 168-VFBGA (12x12)

Cypress Semiconductor, S25FL256SAGBHV200 [See More]

• Package Type: BGA
• Density: 256000

• Memory Category: Flash
• Pins: 24

Synchronous FIFO 4.7M (131K x 36) Uni-Directional 166MHz 4ns 144-PBGA (13x13) [See More]

• Package Type: BGA; 144-BGA
• Operating Current: 40

• Density: 4700
• Data Rate: 166

EEPROM, 64KX8, Serial, CMOS, PBGA8 [See More]

• Package Type: BGA; BGA8
• Logic Family: CMOS

• Memory Category: EEPROM

Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100. Operating Temperature Range: -40 °C ~ 105 °C (TC). Features: SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) - 200-WFBGA (10x14.5). Package: Tray. Package: 200-WFBGA. Mounting: Surface Mount. Family Name: MT53E128. [See More]

• Package Type: BGA; 200-WFBGA (10x14.5)

• Operating Temperature: -40 to 105

Cypress Semiconductor, S25FL256SAGBHV200 [See More]

• Package Type: BGA
• Density: 256000

• Memory Category: Flash
• Pins: 24

Synchronous FIFO 4.7M (131K x 36) Uni-Directional 133.3MHz 5ns 144-PBGA (13x13) [See More]

• Package Type: BGA; 144-BGA
• Operating Current: 40

• Density: 4700
• Data Rate: 133

SRAM 44-BGA [See More]

• Package Type: BGA; BGA44

• Memory Category: SRAM Chip

Manufacturer: Micron Technology Inc. Win Source Part Number: 1080940-MT66R7072A10AB5ZZW.ZCA TR. Packaging: Reel - TR. Mounting: SMD (SMT). Technology: PCM - LPDDR2, MCP - LPDDR2. Memory Size: 1Gb (128M x 8)(PCM), 512Mb (64M x 8)(MCP). Categories: Integrated Circuits. Status: Obsolete(EOL). [See More]

• Package Type: BGA; 121-VFBGA (11x10)
• Supply Voltage: 1.14 V ~ 1.95 V

• Memory Category: RAM
• Operating Temperature: -25 to 85

Cypress Semiconductor, S25FL512SAGBHI310 [See More]

• Package Type: BGA
• Density: 512000

• Memory Category: Flash
• Pins: 24

Asynchronous, Synchronous FIFO 9M (512K x 18)(1M x 9) Uni-Directional 50MHz, 100MHz 14ns, 4.5ns 240-PBGA (19x19) [See More]

• Package Type: BGA; 240-BGA
• Operating Current: 70

• Density: 9000
• Data Rate: 50 to 100

CY14B064I - Non-Volatile SRAM, 8KX8 PDSO16 [See More]

• Package Type: BGA; BGA165

• Memory Category: SRAM Chip

Manufacturer: Micron Technology Inc. Win Source Part Number: 1080941-MT66R7072A10ACUXZW.ZCA TR. Packaging: Reel - TR. Mounting: SMD (SMT). Technology: PCM - LPDDR2, MCP - LPDDR2. Memory Size: 1Gb (128M x 8)(PCM), 512Mb (64M x 8)(MCP). Categories: Integrated Circuits. Status: Obsolete(EOL). [See More]

• Package Type: BGA; 121-VFBGA (8x8)
• Supply Voltage: 1.14 V ~ 1.95 V

• Memory Category: RAM
• Operating Temperature: -25 to 85

Cypress Semiconductor, S25FL512SAGBHI310 [See More]

• Package Type: BGA
• Density: 512000

• Memory Category: Flash
• Pins: 24

Asynchronous, Synchronous FIFO 9M (512K x 18)(1M x 9) Uni-Directional 100MHz, 225MHz 8ns, 3.4ns 240-PBGA (19x19) [See More]

• Package Type: BGA; 240-BGA
• Operating Current: 70

• Density: 9000
• Data Rate: 100 to 225

Non-Volatile SRAM, 128KX8, 25ns, CMOS, PBGA48 [See More]

• Package Type: BGA; PG-TFBGA-48
• Logic Family: CMOS

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 862002-AT24C01D-CUM-T. Operating Temperature Range: -40 °C ~ 85 °C (TC). Features: EEPROM Memory IC 1Kb (128 x 8) I ²C 1 MHz 4.5 µs 8-VFBGA (1.5x2). Package: Reel - TR. Package: 8-VFBGA. Mounting: Surface Mount. Family... [See More]

• Package Type: BGA; 8-VFBGA (1.5x2)
• Operating Temperature: -40 to 85

• Memory Category: EEPROM

Cypress Semiconductor, S29GL064S70BHI030 [See More]

• Package Type: BGA
• Density: 64000

• Memory Category: Flash
• Pins: 48

Asynchronous, Synchronous FIFO 9M (512K x 18)(1M x 9) Uni-Directional 83MHz, 200MHz 10ns, 3.6ns 240-PBGA (19x19) [See More]

• Package Type: BGA; 240-BGA
• Operating Current: 70

• Density: 9000
• Data Rate: 83 to 200

Non-Volatile SRAM, 128KX8, CMOS, PBGA24 [See More]

• Package Type: BGA; PG-BGA-24
• Logic Family: CMOS

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 862013-AT24C08D-CUM-T. Operating Temperature Range: -40 °C ~ 85 °C (TC). Features: EEPROM Memory IC 8Kb (1K x 8) I ²C 1 MHz 4.5 µs 8-VFBGA (1.5x2). Package: Reel - TR. Package: 8-VFBGA. Mounting: Surface Mount. Family... [See More]

• Package Type: BGA; 8-VFBGA (1.5x2)
• Operating Temperature: -40 to 85

• Memory Category: EEPROM

Cypress Semiconductor, S29GL064S70BHI030 [See More]

• Package Type: BGA
• Density: 64000

• Memory Category: Flash
• Pins: 48

Synchronous FIFO 2.25M (32K x 72) Uni-Directional 100MHz 6.5ns 256-PBGA (17x17) [See More]

• Package Type: BGA; 256-BGA
• Operating Current: 75

• Density: 2250
• Data Rate: 100

SRAM Chip Async Single 3.3V 1M-bit 64K x 16 70ns 48-Pin FBGA [See More]

• Package Type: BGA; PBGA48

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 078636-AT24C256-10UI-2.7. Packaging: Tray. Mounting: SMD (SMT). Technology: EEPROM. Memory Size: 256Kb (32K x 8). Access Time: 550ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 8-dBGA (3.73x2.35)
• Supply Voltage: 2.7 V ~ 5.5 V

• Memory Category: EEPROM; EEPROM
• Access Time: 550

Cypress Semiconductor, S29GL512T11FHIV20 [See More]

• Package Type: BGA
• Density: 512000

• Memory Category: Flash
• Pins: 64

IC FLASH 1GBIT SPI/QUAD 24TFBGA [See More]

• Package Type: BGA; 24-BGA
• Supply Voltage: 1.65V ~ 2V

• Memory Category: Flash
• Operating Temperature: -40 to 85

SLOW 3.3V SUPER LOW POWER 256K X 8 SRAM [See More]

• Package Type: BGA; BGA36

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 078648-AT24C512-10UI-2.7. Packaging: Tray. Mounting: SMD (SMT). Technology: EEPROM. Memory Size: 512Kb (64K x 8). Access Time: 550ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 8-dBGA (4.07x2.47)
• Supply Voltage: 2.7 V ~ 5.5 V

• Memory Category: EEPROM; EEPROM
• Access Time: 550

Cypress Semiconductor, S29GL512T11FHIV20 [See More]

• Package Type: BGA
• Density: 512000

• Memory Category: Flash
• Pins: 64

IC FLASH 2GBIT SPI/QUAD 24CSPBGA [See More]

• Package Type: BGA; 24-BGA
• Supply Voltage: 1.65V ~ 2V

• Memory Category: Flash
• Operating Temperature: -40 to 105

Standard SRAM, 256KX8, 70ns, CMOS, PBGA36 [See More]

• Package Type: BGA; PBGA36
• Logic Family: CMOS

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 862029-AT24C512C-CUM-T. Operating Temperature Range: -40 °C ~ 85 °C (TA). Features: EEPROM Memory IC 512Kb (64K x 8) I ²C 400 kHz 900 ns 8-dBGA (2.35x3.73). Package: Reel - TR. Package: 8-VFBGA, DSBGA. Mounting: Surface... [See More]

• Package Type: BGA; 8-dBGA (2.35x3.73)
• Operating Temperature: -40 to 85

• Memory Category: EEPROM

Infineon STD SPI S25FL128SAGBHI200 [See More]

• Package Type: BGA
• Density: 1024000

• Memory Category: Flash
• Pins: 24

SRAM, RLDRAM Memory IC 512Mb (128M x 4) Parallel 3.2ns 288-FCBGA (19x19) [See More]

• Package Type: BGA; 288-BGA, FCBGA

• Density: 512000

SLOW 3.0V SUPER LOW POWER 512K X 8 SRAM [See More]

• Package Type: BGA; VFBGA36

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 1018932-AT25128-10UI-2.7. Packaging: Tray. Mounting: SMD (SMT). Technology: EEPROM. Memory Size: 128Kb (16K x 8). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C (TA). Case /... [See More]

• Package Type: BGA; 8-dBGA (4.07x2.47)
• Supply Voltage: 2.7 V ~ 5.5 V

• Memory Category: EEPROM; EEPROM
• Operating Temperature: -40 to 85

Infineon STD SPI S25FL128SAGBHI200 [See More]

• Package Type: BGA
• Density: 1024000

• Memory Category: Flash
• Pins: 24

Memory IC [See More]

• Package Type: BGA; 1512-BGA, FCBGA

• Memory Category: SRAM Chip

CY7C057 - 3.3 V 32K X 36 Flex36 Asynchronous Dual-Port Static RAM, Commercial Temp [See More]

• Package Type: BGA; FBGA

• Memory Category: SRAM Chip

Manufacturer: Toshiba Semiconductor and Storage. Win Source Part Number: 1106019-TC58BVG0S3HBAI4. Packaging: Tray. Mounting: SMD (SMT). Technology: EEPROM - NAND. Memory Size: 1Gb (128M x 8). Access Time: 25ns. Categories: Integrated Circuits. Status: Active. Temperature Range - Operating: -40... [See More]

• Package Type: BGA; 63-TFBGA (9x11)
• Supply Voltage: 2.7 V ~ 3.6 V

• Memory Category: EEPROM; EEPROM
• Access Time: 25

Infineon STD SPI S25FL256SAGBHI200 [See More]

• Package Type: BGA
• Density: 2048000

• Memory Category: Flash
• Pins: 24

1T-SRAM Memory IC 576Mb (8M x 72) Parallel 1.25GHz 2.6ns 324-PBGA (19x19) [See More]

• Package Type: BGA; 324-BGA
• Density: 576000

• Memory Category: SRAM Chip
• Operating Temperature: 0 to 85

SRAM 1MBIT 10NS 48TFBGA [See More]

• Package Type: BGA; TFBGA48

• Memory Category: SRAM Chip

Manufacturer: Toshiba Semiconductor and Storage. Win Source Part Number: 212624-TC58BVG0S3HBAI4JDH. Packaging: Tray. Mounting: SMD (SMT). Technology: EEPROM - NAND. Memory Size: 1Gb (128M x 8). Access Time: 25ns. Categories: Integrated Circuits. Status: Active. Temperature Range - Operating: -40... [See More]

• Package Type: BGA; 63-TFBGA (9x11)
• Supply Voltage: 2.7 V ~ 3.6 V

• Memory Category: EEPROM; EEPROM
• Access Time: 25

Infineon STD SPI S25FL256SAGBHI200 [See More]

• Package Type: BGA
• Density: 2048000

• Memory Category: Flash
• Pins: 24

1T-SRAM Memory IC 1.152Gb (16M x 72) Parallel 1.25GHz 2.7ns 676-BGA (27x27) [See More]

• Package Type: BGA; 676-BGA
• Operating Temperature: 0 to 85

• Memory Category: SRAM Chip

ZBT SRAM, 1MX72, 3.4ns, CMOS, PBGA209 [See More]

• Package Type: BGA; BGA209
• Logic Family: CMOS

• Memory Category: SRAM Chip

Manufacturer: Kingston. Win Source Part Number: 870445-EMMC16G-TB29-90F01. Series: e •MMC ™. Features: FLASH - NAND (TLC) Memory IC 128Gb (16G x 8) eMMC 153-FBGA (11.5x13). Package: 153-BGA. Package: Tray. Mounting: Surface Mount. Categories: Integrated Circuits (ICs). Case / Package:... [See More]

• Package Type: BGA; 153-FBGA (11.5x13)

Infineon STD SPI S25FL256SAGBHI300 [See More]

• Package Type: BGA
• Density: 2048000

• Memory Category: Flash
• Pins: 24

SRAM - Synchronous, Standard Memory IC 144Mb (8M x 18) Parallel 250MHz 119-FPBGA (22x14) [See More]

• Package Type: BGA; 119-BGA
• Density: 144000

• Memory Category: SRAM Chip
• Supply Voltage: 2.3V ~ 2.7V, 3V ~ 3.6V

QDR SRAM, 8MX18, CMOS, PBGA361 [See More]

• Package Type: BGA; PG-FCBGA-361
• Logic Family: CMOS

• Memory Category: SRAM Chip

Manufacturer: Micron Technology Inc. Win Source Part Number: 886457-MTFC8GACAENS-AIT TR. Features: Memory IC 153-TFBGA (11.5x13). Package: Reel - TR. Package: 153-TFBGA. Mounting: Surface Mount. Family Name: MTFC8. Categories: Integrated Circuits (ICs). Case / Package: 153-TFBGA (11.5x13). [See More]

• Package Type: BGA; 153-TFBGA (11.5x13)

Infineon STD SPI S25FL256SAGBHI300 [See More]

• Package Type: BGA
• Density: 2048000

• Memory Category: Flash
• Pins: 24

SRAM - Quad Port, Synchronous Memory IC 144Mb (4M x 36) Parallel 625MHz 260-BGA (22x14) [See More]

• Package Type: BGA; 260-BGA
• Density: 144000

• Memory Category: SRAM Chip
• Supply Voltage: 1.2V ~ 1.35V

Standard SRAM, 256KX16, 10ns, CMOS, PBGA48 [See More]

• Package Type: BGA; BGA
• Logic Family: CMOS

• Memory Category: SRAM Chip

Manufacturer: Micron Technology Inc. Win Source Part Number: 197454-28F256K3C. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH - NOR. Memory Size: 256Mb (16M x 16). Access Time: 120ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 64-EasyBGA (10x13)
• Supply Voltage: 2.7 V ~ 3.6 V

• Memory Category: Flash; FLASH
• Access Time: 120

SRAM - Asynchronous Memory IC 16Mb (512K x 32) Parallel 55ns 119-PBGA (14x22) [See More]

• Package Type: BGA; 119-BGA
• Density: 16000

• Memory Category: SRAM Chip
• Supply Voltage: 1.65V ~ 2.2V

Dual-Port SRAM, 64KX18, 4ns PBGA256 [See More]

• Package Type: BGA; BGA256

• Memory Category: SRAM Chip

Manufacturer: Micron Technology Inc. Win Source Part Number: 075697-320W18BE. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH - NOR. Memory Size: 32Mb (2M x 16). Access Time: 60ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 56-VFBGA
• Supply Voltage: 1.7 V ~ 1.95 V

• Memory Category: Flash; FLASH
• Access Time: 60

SRAM - Quad Port, Synchronous Memory IC 1.152Mb (64K x 18) Parallel 100MHz 272-PBGA (27x27) [See More]

• Package Type: BGA; 272-BGA
• Density: 1152

• Memory Category: SRAM Chip
• Supply Voltage: 3V ~ 3.6V

Dual-Port SRAM, 64KX36, 4.4ns PBGA256 [See More]

• Package Type: BGA; FBGA256

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 162214-45DB041B. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). Case /... [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Memory Category: Flash; FLASH
• Operating Temperature: 0 to 70

IC FLSH RAM 512MBIT HYPRBS 24BGA [See More]

• Package Type: BGA; 24-BGA
• Density: 512000

• Memory Category: Flash
• Supply Voltage: 2.7V ~ 3.6V

Dual-Port SRAM, 64KX72, 4.4ns PBGA484 [See More]

• Package Type: BGA; BGA484

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 1019454-AT45DB011B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 1Mb (264 Bytes x 512 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C (TC). [See More]

• Package Type: BGA; 9-CBGA (5x5)
• Supply Voltage: 2.7 V ~ 3.6 V

• Memory Category: Flash; FLASH
• Operating Temperature: -40 to 85

32GB EMMC TLC 5.1 -25C+85C IND [See More]

• Package Type: BGA; 153-BGA
• Supply Voltage: 1.8V ~ 3.3V

• Memory Category: Flash
• Operating Temperature: -25 to 85

CYD18S18 - Fullflex Synchronous Sdr Dual Port SRAM, Commercial Temp [See More]

• Package Type: BGA; PBGA256

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 221124-AT45DB021B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 2Mb (264 Bytes x 1024 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 9-CBGA (5x5)
• Supply Voltage: 2.7 V ~ 3.6 V

• Memory Category: Flash; FLASH
• Operating Temperature: 0 to 70

SDRAM - DDR4 Memory IC 4Gb (256M x 16) Parallel 1.2GHz 96-BGA [See More]

• Package Type: BGA; 96-BGA
• Supply Voltage: 1.14V ~ 1.26V

• Memory Category: DRAM Chip
• Operating Temperature: 0 to 95

SRAM 64KBIT 55NS 100VFBGA [See More]

• Package Type: BGA; BGA100

• Memory Category: SRAM Chip

Manufacturer: Microchip Technology. Win Source Part Number: 221132-AT45DB041B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Memory Category: Flash; FLASH
• Operating Temperature: 0 to 70

SRAM - Dual Port, Synchronous Memory IC 36Mb (1M x 36) Parallel 133MHz 4.2ns 256-CABGA (17x17) [See More]

• Package Type: BGA; 256-BGA
• Density: 36000

• Memory Category: SRAM Chip
• Supply Voltage: 2.4V ~ 2.6V

FBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

MEMORY CONTROLLER AND PCI BRIDGE [See More]

• Package Type: BGA; 474-BCBGA Exposed Pad
• Operating Temperature: -40 to 105

• Supply Voltage: 3.135V ~ 3.465V

Ultra-Reliable Asynchronous SRAMs. Click to Enlarge. With the performance to serve a wide variety of high reliability industrial, communication, data processing, medical, consumer and military applications, Fast and Micropower (MoBL ®) SRAM devices are available with on-chip ECC. These devices... [See More]

• Package Type: BGA; SOIC; TSOP; SOJ; STSOP, VFBGA, FBGA
• Density: 256 to 64000

• Memory Category: SRAM Chip
• Pins: 32 to 119

GSI Technology ™s Asynchronous  SRAM portfolio can handle all of your design needs. Our asynchronous  SRAMs are easy to use, have fast access times, and are available in a variety of packages. Asynchronous  SRAMs are appropriate as main memory for small cache-less embedded... [See More]

• Package Type: BGA; TSOP; FPBGA
• Density: 1000 to 8000

• Memory Category: SRAM Chip
• Supply Voltage: 3.3V

IC FIFO 1024X36 5NS 208-BGA [See More]

• Package Type: BGA; 208-BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 36
• Operating Current: 70

IC FIFO ASYNC/SYNC 1MX9 240BGA [See More]

• Package Type: BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 9000
• Operating Current: 70

The MR4A08B is a 16,777,216-bit magnetoresistive random access memory (MRAM) device organized as 2,097,152 words of 8 bits. The MR4A08B offers SRAM compatible 35ns read/write timing with unlimited endurance. Data is always non-volatile for greater than 20-years. Data is automatically protected on... [See More]

• Package Type: BGA
• Density: 16000

• Memory Category: MRAM
• Number of Words: 2000

The 70T3509M is a high-speed 1024K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1 , permits the on-chip circuitry of each port to enter a very low... [See More]

• Package Type: BGA
• Density: 36864

• Memory Category: DPRAM
• Number of Words: 1024

FBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

IC USB NX2LP NAND CNTRLR 56VFBGA [See More]

• Package Type: BGA; 56-VFBGA
• Operating Temperature: 0 to 70

• Supply Voltage: 3.6V; 3V ~ 3.6V

GSI's SigmaDDR „ ¢  SRAMs are the acknowledged leader in the industry with their combination of capacity and performance. SigmaDDR transaction rates are unequaled by any competitors. SigmaDDR SRAMs are synchronous memories with a common read and write data bus. œDDR ... [See More]

• Package Type: BGA
• Density: 18000 to 288000

• Memory Category: SRAM Chip
• Data Rate: 400 to 633

PBGA 13.00X13.00X1.76 MM, 1.00MM [See More]

• Package Type: BGA; 144-BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 36
• Operating Current: 40

IC FIFO ASYNC/SYNC 1MX9 240BGA [See More]

• Package Type: BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 9000
• Operating Current: 70

The 72V2103 256K x 9/128K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network,... [See More]

• Package Type: BGA
• Density: 2048

• Memory Category: FIFO
• Number of Words: 128

4Gbit SDRAM DDR4 1.2GHz FBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA
• Density: 4000000

• Memory Category: DRAM Chip
• Supply Voltage: 1.14V~1.26V

Synchronous FIFO 36K (1K x 18 x 2) Bi-Directional 100MHz 6.5ns 121-PBGA (15x15) [See More]

• Package Type: BGA; 121-BBGA
• Supply Voltage: 4.5 V ~ 5.5 V

• Density: 36
• Operating Current: 100

GSI Technology ™s No Bus Turnaround (NBT „ ¢) product portfolio is the largest in the industry with six different densities in x18, 32, 36 and 72 bit widths. Our NBT SRAMs provide the fastest clock rates and lowest power of any in the world. NBT SRAMs are synchronous, burst-capable... [See More]

• Package Type: BGA; QFP; TQFP
• Density: 4000 to 288000

• Memory Category: SRAM Chip
• Supply Voltage: 1.8V; 2.5V; 3.3V

IC SRAM 8MBIT HSTL 153PBGA [See More]

• Package Type: BGA; 153-PBGA (14x22)
• Density: 8000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 85degC (TA)

IC FIFO ASYNC/SYNC 1MX9 240BGA [See More]

• Package Type: BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 9000
• Operating Current: 70

The 72T18105 is a 128K x 18 / 256K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to... [See More]

• Package Type: BGA
• Density: 2048

• Memory Category: FIFO
• Number of Words: 128

FBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Asynchronous, Synchronous FIFO 9M (512K x 18)(1M x 9) Uni-Directional 50MHz, 100MHz 14ns, 4.5ns 240-PBGA (19x19) [See More]

• Package Type: BGA; 240-BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 9000
• Operating Current: 70

GSI's SigmaQuad „ ¢  SRAMs are the acknowledged leader in the industry with their combination of capacity and performance. SigmaQuad transaction rates are unequaled by any competitors. SigmaQuad SRAMs are synchronous memories with separate read and write data buses. œQuad ... [See More]

• Package Type: BGA; CCGA, CLGA
• Density: 18000 to 288000

• Memory Category: SRAM Chip
• Data Rate: 200 to 1333

IC SRAM 8MBIT HSTL 119BGA [See More]

• Package Type: BGA; 119-BGA (17x7)
• Density: 8000

• Memory Category: SRAM; SRAM Chip

IC FIFO 1024X36 4-4NS 208-BGA [See More]

• Package Type: BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 36
• Operating Current: 70

The 70V639 is a high-speed 128K x 18 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER / SLAVE Dual-Port RAM for 36-bit-or-more word system. Using the IDT MASTER / SLAVE Dual-Port RAM approach in 36-bit or wider memory system applications... [See More]

• Package Type: BGA
• Density: 2304

• Memory Category: DPRAM
• Number of Words: 128

FBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Asynchronous, Synchronous FIFO 9M (512K x 18)(1M x 9) Uni-Directional 100MHz, 225MHz 8ns, 3.4ns 240-PBGA (19x19) [See More]

• Package Type: BGA; 240-BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 9000
• Operating Current: 70

GSI Technology ™s Specialty SRAMs fill the gap left when other SRAM companies left the industry. Our Register-to-Register, Late Write, and Double Late Write SRAMs have enabled critical designs to continue long after all other options were made obsolete. [See More]

• Package Type: BGA
• Density: 18000

• Memory Category: SRAM Chip
• Supply Voltage: 1.8V; 2.5V

IC FLSH RAM 32GBYTE EMMC 144FBGA [See More]

• Package Type: BGA; 144-FBGA (8x9.5)
• Density: 256000000

• Memory Category: Flash; Non-Volatile, Volatile
• Supply Voltage: -25degC ~ 85degC

IC FIFO ASYNC/SYN 128KX72 324BGA [See More]

• Package Type: BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 9000
• Operating Current: 130

The 70V3399 is a high-speed 128K x 18 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1 , permits the on-chip circuitry of each port to enter a very low standby... [See More]

• Package Type: BGA
• Density: 2304

• Memory Category: DPRAM
• Number of Words: 128

FBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Asynchronous, Synchronous FIFO 9M (512K x 18)(1M x 9) Uni-Directional 83MHz, 200MHz 10ns, 3.6ns 240-PBGA (19x19) [See More]

• Package Type: BGA; 240-BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 9000
• Operating Current: 70

GSI offers the broadest portfolio of Synchronous Burst (SyncBurst „ ¢) SRAMs in the industry. Our SyncBurst SRAMs provide the fastest clock rates and lowest power of any in the world. SyncBurst SRAMs provide a œburst  of (typically) 2 to 4 words in response to a single clock... [See More]

• Package Type: BGA; QFP; TQFP
• Density: 4000 to 288000

• Memory Category: SRAM Chip
• Supply Voltage: 1.8V; 2.5V; 3.3V

IC FLASH 128GBIT EMMC 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Density: 128000000

• Memory Category: Flash; Non-Volatile
• Supply Voltage: -40degC ~ 105degC

CABGA 11.00X11.00X1.40 MM, 1.00M [See More]

• Package Type: BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 2250
• Operating Current: 35

The 70T3399 is a high-speed 128K x 18 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1 , permits the on-chip circuitry of each port to enter a very low standby... [See More]

• Package Type: BGA
• Density: 2304

• Memory Category: DPRAM
• Number of Words: 128

FBGA-200 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Asynchronous, Synchronous FIFO 36K (1K x 36) Uni-Directional 100MHz, 225MHz 8ns, 3.4ns 208-PBGA (17x17) [See More]

• Package Type: BGA; 208-BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 36
• Operating Current: 70

IC FLASH 8MBIT PARALLEL 48FBGA [See More]

• Package Type: BGA; 48-FBGA (6x9)
• Density: 8000

• Memory Category: Flash; Non-Volatile
• Supply Voltage: 0degC ~ 70degC (TA)

IC FIFO SYNC 512KX9 100CABGA [See More]

• Package Type: BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 4500
• Operating Current: 35

The 70V659 is a high-speed 128K x 36 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER / SLAVE Dual-Port RAM for 72-bit-or-more word system. Using the IDT MASTER / SLAVE Dual-Port RAM approach in 72-bit or wider memory system applications... [See More]

• Package Type: BGA
• Density: 4608

• Memory Category: DPRAM
• Number of Words: 128

FBGA-180 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Asynchronous, Synchronous FIFO 9M (128K x 72) Uni-Directional 83MHz, 200MHz 10ns, 3.6ns 324-PBGA (19x19) [See More]

• Package Type: BGA; 324-BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 9000
• Operating Current: 130

IC DRAM 8GBIT PAR 78FBGA [See More]

• Package Type: BGA; 78-FBGA (9x10.5)
• Density: 8000000

• Memory Category: Volatile; DRAM Chip
• Supply Voltage: 0degC ~ 95degC (TC)

IC FIFO SYNC 512KX9 100CABGA [See More]

• Package Type: BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 4500
• Operating Current: 35

The 70T659 is a high-speed 128K x 36 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER / SLAVE Dual-Port RAM for 72-bit-or-more word system which would result in full-speed, error-free operation without the need for additional discrete... [See More]

• Package Type: BGA
• Density: 4608

• Memory Category: DPRAM
• Number of Words: 128

TFBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Synchronous FIFO 4.5M (256K x 18)(512K x 9) Uni-Directional 133.3MHz 5ns 100-CABGA (11x11) [See More]

• Package Type: BGA; 100-LBGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 4500
• Operating Current: 35

IC DRAM 4GBIT PARALLEL 96FBGA [See More]

• Package Type: BGA; 96-FBGA (7.5x13.5)
• Density: 4000000

• Memory Category: Volatile; DRAM Chip
• Supply Voltage: -40degC ~ 105degC (TC)

IC FIFO SYNC 8KX9 5NS 100CABGA [See More]

• Package Type: BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 72
• Operating Current: 35

The 72V36110 128K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible Bus-Matching x36/x18/x9 data flow and Asynchronous/Synchronous translation on the read or write ports ; SuperSync II FIFO ’s are appropriate for network, video, telecommunications, data... [See More]

• Package Type: BGA
• Density: 4096

• Memory Category: FIFO
• Number of Words: 128

FBGA-96(8x14) DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Synchronous FIFO 4.5M (256K x 18)(512K x 9) Uni-Directional 133.3MHz 5ns 100-CABGA (11x11) [See More]

• Package Type: BGA; 100-LBGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 4500
• Operating Current: 35

IC DRAM 2GBIT PARALLEL 78FBGA [See More]

• Package Type: BGA; 78-FBGA (7.5x10.5)
• Density: 2000000

• Memory Category: Volatile; DRAM Chip
• Supply Voltage: 0degC ~ 95degC (TC)

IC FIFO SYNC 131KX36 4NS 144BGA [See More]

• Package Type: BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 4700
• Operating Current: 40

The 70V3599 is a high-speed 128K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1 , permits the on-chip circuitry of each port to enter a very low standby... [See More]

• Package Type: BGA
• Density: 4608

• Memory Category: DPRAM
• Number of Words: 128

FBGA-96(8x14) DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Synchronous FIFO 72K (4K x 18)(8K x 9) Uni-Directional 133.3MHz 5ns 100-CABGA (11x11) [See More]

• Package Type: BGA; 100-LBGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 72
• Operating Current: 35

IC DRAM 8GBIT PAR 96FBGA [See More]

• Package Type: BGA; 96-FBGA (13.5x9)
• Density: 8000000

• Memory Category: Volatile; DRAM Chip
• Supply Voltage: 0degC ~ 95degC (TC)

IC FIFO SYNC 131KX36 5NS 144BGA [See More]

• Package Type: BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 4700
• Operating Current: 40

The 70T3599 is a high-speed 128K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1 , permits the on-chip circuitry of each port to enter a very low standby... [See More]

• Package Type: BGA
• Density: 4608

• Memory Category: DPRAM
• Number of Words: 128

FBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Synchronous FIFO 4.7M (131K x 36) Uni-Directional 166MHz 4ns 144-PBGA (13x13) [See More]

• Package Type: BGA; 144-BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 4700
• Operating Current: 40

IC DRAM 4GBIT PARALLEL 78FBGA [See More]

• Package Type: BGA; 78-FBGA (7.5x10.6)
• Density: 4000000

• Memory Category: Volatile; DRAM Chip
• Supply Voltage: -40degC ~ 105degC (TC)

36M PROGRAMMABLE FIFO 209FBGA [See More]

• Package Type: BGA
• Supply Voltage: 3 V ~ 3.6 V

• Density: 36000
• Access Time: 10

The 70V7599 is a high-speed 128K x 36 (4Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 2Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 2Kx36 memory block not already accessed... [See More]

• Package Type: BGA
• Density: 4608

• Memory Category: DPRAM; SRAM Chip
• Number of Words: 128

TFBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Synchronous FIFO 4.7M (131K x 36) Uni-Directional 133.3MHz 5ns 144-PBGA (13x13) [See More]

• Package Type: BGA; 144-BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 4700
• Operating Current: 40

IC DRAM 1GBIT PARALLEL 134FBGA [See More]

• Package Type: BGA; 134-FBGA (10x11.5)
• Density: 1000000

• Memory Category: Volatile; DRAM Chip
• Supply Voltage: -30degC ~ 85degC (TC)

IC FIFO SYNC 2MX36 10NS 209FBGA [See More]

• Package Type: BGA
• Access Time: 10

• Density: 72000

The 72T36115 is a 128K x 36 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x36/x18/x9 data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large... [See More]

• Package Type: BGA
• Density: 4096

• Memory Category: FIFO
• Number of Words: 128

FBGA-78 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Asynchronous, Synchronous FIFO 1.125M (32K x 36) Uni-Directional 133.3MHz 5ns 144-PBGA (13x13) [See More]

• Package Type: BGA; 144-BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 1125
• Operating Current: 40

IC SRAM 16MBIT PARALLEL 48TFBGA [See More]

• Package Type: BGA; 48-TFBGA (6x8)
• Density: 16000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: -40degC ~ 85degC (TA)

IC FIFO SYNC 256KX10 208PBGA [See More]

• Package Type: BGA
• Supply Voltage: 2.375 V ~ 2.625 V

• Density: 2500
• Operating Current: 60

The 70T3799M is a high-speed 128K x 72 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1 , permits the on-chip circuitry of each port to enter a very low... [See More]

• Package Type: BGA
• Density: 9216

• Memory Category: DPRAM
• Number of Words: 128

VFBGA-60(8x9) DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Synchronous FIFO 18M (512K x 36) Uni-Directional 133MHz 10ns 209-FBGA (14x22) [See More]

• Package Type: BGA; 209-BGA
• Supply Voltage: 1.7 V ~ 1.9 V

• Density: 18000
• Data Rate: 133

MEMORY [See More]

• Package Type: BGA; 153-FBGA (11.5x13)
• Density: 64000000

• Memory Category: Flash; Non-Volatile
• Supply Voltage: -40degC ~ 85degC (TA)

IC FIFO SYNC 16KX9 6.5NS 100BGA [See More]

• Package Type: BGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 144
• Operating Current: 35

The 72T72115 is a 128K x 72 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x72/x36/x18 data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large... [See More]

• Package Type: BGA
• Density: 9216

• Memory Category: FIFO
• Number of Words: 128

FBGA-84(9x12.5) DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Synchronous FIFO 144K (8K x 18)(16K x 9) Uni-Directional 100MHz 6.5ns 100-BGA MICROSTAR (10x10) [See More]

• Package Type: BGA; 100-LFBGA
• Supply Voltage: 3.15 V ~ 3.45 V

• Density: 144
• Operating Current: 35

IC SRAM 2MBIT PARALLEL 48FBGA [See More]

• Package Type: BGA; 48-FBGA (7x7)
• Density: 2000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: -40degC ~ 85degC (TA)

IC SRAM 4MBIT HSTL 119BGA [See More]

• Package Type: BGA
• Density: 4000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 85degC (TA)

The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network,... [See More]

• Package Type: BGA
• Density: 288

• Memory Category: FIFO
• Number of Words: 16

FBGA-60 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

SRAM - Synchronous Memory IC 1Mbit 119-BGA (17x7) [See More]

• Package Type: BGA; 119-BGA
• Density: 1000

• Memory Category: SRAM; SRAM Chip
• Supply Voltage: 3.3V

IC SRAM 2MBIT PARALLEL 36FBGA [See More]

• Package Type: BGA; 36-FBGA (7x7)
• Density: 2000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: -40degC ~ 85degC (TA)

IC FLSH RAM 4GBYTE EMMC 221VFBGA [See More]

• Package Type: BGA
• Density: 32000000

• Memory Category: Flash; Non-Volatile, Volatile
• Supply Voltage: -25degC ~ 85degC

The 72T1875 is a 16K x 18 / 32K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to... [See More]

• Package Type: BGA
• Density: 288

• Memory Category: FIFO
• Number of Words: 16

FBGA-84 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

SRAM - Synchronous Memory IC 8Mbit HSTL 1.8 ns 153-PBGA (14x22) [See More]

• Package Type: BGA; 153-BBGA
• Density: 8000

• Memory Category: SRAM; SRAM Chip
• Supply Voltage: 2.375V ~ 2.625V

IC SRAM 2MBIT PARALLEL 172FBGA [See More]

• Package Type: BGA; 172-FBGA (15x15)
• Density: 2000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

IC FLSH RAM 8GBYTE EMMC 221VFBGA [See More]

• Package Type: BGA
• Density: 64000000

• Memory Category: Flash; Non-Volatile, Volatile
• Supply Voltage: -25degC ~ 85degC

The 72V3680 16K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible Bus-Matching x36/x18/x9 data flow and Asynchronous/Synchronous translation on the read or write ports ; SuperSync II FIFO ’s are appropriate for network, video, telecommunications, data... [See More]

• Package Type: BGA
• Density: 512

• Memory Category: FIFO
• Number of Words: 16

FBGA-84(8x12.5) DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

Memory IC 8Mbit HSTL 119-BGA (17x7) [See More]

• Package Type: BGA; 119-BBGA
• Density: 8000

• Memory Category: SRAM; SRAM Chip
• Supply Voltage: 3.3V

IC SRAM 2MBIT PARALLEL 48VFBGA [See More]

• Package Type: BGA; 48-VFBGA (6x8)
• Density: 2000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

IC SRAM 4.5MBIT PAR 256CABGA [See More]

• Package Type: BGA
• Density: 4500

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

The 70V3569 is a high-speed 16K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1 , permits the on-chip circuitry of each port to enter a very low standby... [See More]

• Package Type: BGA
• Density: 576

• Memory Category: DPRAM
• Number of Words: 16

FBGA-178 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

FLASH - NAND, DRAM - LPDDR Memory IC 4GByte (NAND), 4Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 221-VFBGA (13x11.5) [See More]

• Package Type: BGA; 221-VFBGA
• Density: 32000000

• Memory Category: Flash; FLASH, RAM
• Supply Voltage: 3.3V; 1.8V, 3.3V

IC SRAM 18MBIT PAR 165FBGA [See More]

• Package Type: BGA; 165-FBGA (13x15)
• Density: 18000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

IC SRAM 4.5MBIT PAR 208CABGA [See More]

• Package Type: BGA
• Density: 4500

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

The 72T7285 is a 16K x 72 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x72/x36/x18 data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts... [See More]

• Package Type: BGA
• Density: 1024

• Memory Category: FIFO
• Number of Words: 16

TFBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

FLASH - NAND, DRAM - LPDDR Memory IC 8GByte (NAND), 8Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 221-VFBGA (13x11.5) [See More]

• Package Type: BGA; 221-VFBGA
• Density: 64000000

• Memory Category: Flash; FLASH, RAM
• Supply Voltage: 3.3V; 1.8V, 3.3V

IC SRAM 9MBIT PARALLEL 165FBGA [See More]

• Package Type: BGA; 165-FBGA (13x15)
• Density: 9000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

IC SRAM 18MBIT PAR 119PBGA [See More]

• Package Type: BGA
• Density: 18000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

The 72V51443 multi-queue flow-control device is a single chip within which between 1 and 16 discrete FIFO queues can be setup. All queues within the device have common data input bus, (write port) and a common data output bus, (read port). Data written into the write port is directed to a respective... [See More]

• Package Type: BGA
• Density: 1024

• Memory Category: FIFO
• Number of Words: 4

TFBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

FLASH - NAND, DRAM - LPDDR Memory IC 8GByte (NAND), 8Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 136-FBGA (10x10) [See More]

• Package Type: BGA; 136-FBGA
• Density: 64000000

• Memory Category: Flash; FLASH, RAM
• Supply Voltage: 3.3V; 1.8V, 3.3V

IC SRAM 16MBIT PAR 165FBGA [See More]

• Package Type: BGA; 165-FBGA (13x15)
• Density: 16000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

IC SRAM 1MBIT PARALLEL 48CABGA [See More]

• Package Type: BGA
• Density: 1000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: -40degC ~ 85degC (TA)

The 72V51446 multi-queue flow-control device is a single chip within which between 1 and 16 discrete FIFO queues can be setup. All queues within the device have common data input bus, (write port) and a common data output bus, (read port). Data written into the write port is directed to a respective... [See More]

• Package Type: BGA
• Density: 1024

• Memory Category: FIFO
• Number of Words: 2

VFBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

EEPROM Memory IC 2Kbit Single Wire 100 kHz 4-CSP [See More]

• Package Type: BGA; 4-UFBGA, CSPBGA
• Density: 2

• Memory Category: EEPROM; EEPROM
• Supply Voltage: 1.8V ~ 5.5V

IC SRAM 2MBIT PARALLEL 256FBGA [See More]

• Package Type: BGA; 256-FBGA (17x17)
• Density: 2000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: -40degC ~ 85degC (TA)

IC SRAM 4.5MBIT PAR 165CABGA [See More]

• Package Type: BGA
• Density: 4500

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

The 72V51456 multi-queue flow-control device is a single chip within which between 1 and 16 discrete FIFO queues can be setup. All queues within the device have common data input bus, (write port) and a common data output bus, (read port). Data written into the write port is directed to a respective... [See More]

• Package Type: BGA
• Density: 2048

• Memory Category: FIFO
• Number of Words: 4

TFBGA-96 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

FLASH - NAND, DRAM - LPDDR Memory IC 16GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 254-FBGA (11.5x13x1.0) [See More]

• Package Type: BGA; 254-FBGA
• Density: 128000000

• Memory Category: Flash; FLASH, RAM
• Supply Voltage: 3.3V; 1.8V, 3.3V

78 ball FBGA DDR3L 1866 [See More]

• Package Type: BGA; 78-FBGA (7.5x10.6)
• Density: 4000000

• Memory Category: Volatile; DRAM Chip
• Supply Voltage: 0degC ~ 95degC (TC)

IC SRAM 4MBIT PARALLEL 48CABGA [See More]

• Package Type: BGA
• Density: 4000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

The 72V233 2K x 9/1K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video,... [See More]

• Package Type: BGA
• Density: 18

• Memory Category: FIFO
• Number of Words: 1

FBGA-200 DDR SDRAM ROHS [See More]

• Package Type: BGA

• Memory Category: DRAM Chip

EEPROM Memory IC 256Kbit I ²C 400 kHz 900 ns 8-CSP [See More]

• Package Type: BGA; 8-UFBGA, CSPBGA
• Density: 256

• Memory Category: EEPROM; EEPROM
• Supply Voltage: 1.7V ~ 5.5V

IC RAM 4MB XSPI/OCTAL 24BGA [See More]

• Package Type: BGA; 24-TBGA (6x8)
• Density: 4000

• Memory Category: Non-Volatile
• Supply Voltage: 0degC ~ 70degC (TA)

IC SRAM 9MBIT PARALLEL 165CABGA [See More]

• Package Type: BGA
• Density: 9000

• Memory Category: Volatile; SRAM Chip
• Supply Voltage: 0degC ~ 70degC (TA)

The 72825 is a 1K x 18 First-In, First-Out memory with clocked read and write controls. It is functionally equivalent to two 72225 FIFOs in a single package with all associated control, data, and flag lines assigned to independent pins and would be applicable for a wide variety of data buffering... [See More]

• Package Type: BGA
• Density: 18

• Memory Category: FIFO
• Number of Words: 1