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Supplier: StellarNet, Inc.
Description: spectrometer software and development kit, and is available at an extremely low price! Couple this with StellarNet’s Thin Film Measurement System and have full functionality for measuring thickness and index of both single-layer and multilayer films!
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Supplier: StellarNet, Inc.
Description: TF Systems for Non-Contact Film Thickness Measurements We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet
- Applications: CVD / PVD Films, Data Storage / Memory, Flat Panel Displays, Optical Components , Polishing / CMP, Polymers / Photoresists, Semiconductor Wafers, Other
- Measurement Capability: Thickness - Film / Layer, Thickness - Wafer / Disc (TTV)
- Mounting / Loading: In-situ / System Mounted
- Non-contact: Yes
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Supplier: MTI Instruments Inc.
Description: The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation,
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Wafer Probing System, Sensor / Sensing Element
- Maximum Wafer / Part Size: 300 mm
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Supplier: Filmetrics, Inc.
Description: Boost the Capabilities and Extend the Life of Your NanoSpec™ 180/210 System Your NanoSpec™ has been a workhorse for your fab, but many years of use may have caused maintenance costs to balloon. The F40-NSR converts your NanoSpec™ 180/210 into a modern-day measurement
- Applications: CVD / PVD Films, Semiconductor Wafers
- Measurement Capability: Optical Constants (n, k)
- Mounting / Loading: In-situ / System Mounted
- Non-contact: Yes
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Supplier: Filmetrics, Inc.
Description: High-Resolution Film Thickness Maps The Filmetrics F42 can map the thickness of films, such as OSP, at over one-million points, each with a spot size as small as 3 microns. Using an integrated CCD camera, live video makes it easy to pinpoint exact measurement locations. Once the
- Applications: CVD / PVD Films, Semiconductor Wafers
- Area Mapping: Yes
- Measurement Capability: Optical Constants (n, k)
- Mounting / Loading: In-situ / System Mounted
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Supplier: Filmetrics, Inc.
Description: Automated Cassette-to-Cassette Thin-Film Thickness Mapping System for Production Environments The Filmetrics F60-c family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These
- Applications: CVD / PVD Films, Semiconductor Wafers
- Area Mapping: Yes
- Mounting / Loading: In-situ / System Mounted
- Non-contact: Yes
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Supplier: Filmetrics, Inc.
Description: Turn Your Microscope into a Film Thickness Measurement Tool The F40 product family is for applications that require a spot size as small as 1 micron. For most microscopes the F40 simply attaches to the c-mount adapter, which is the industry standard for video camera mounting. The
- Applications: CVD / PVD Films, Semiconductor Wafers
- Measurement Capability: Optical Constants (n, k)
- Mounting / Loading: In-situ / System Mounted
- Non-contact: Yes
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Supplier: Hamamatsu Photonics
Description: The Optical NanoGauge Thickness measurement system C15151-01 is a non-contact film thickness measurement system utilizing spectral interferometry. The high-power, highly stable white light source enables precise measurement of film thicknesses, even
- Gaging Technology: Optical
- Range: 0.3937 inch
- Units: Metric
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Supplier: Hamamatsu Photonics
Description: The Optical NanoGauge Thickness measurement system C13027 is a non-contact film thickness measurement system utilizing spectral interferometry. The C13027 not only supports PLC connections but is also designed more compact than our other models for easy
- Gaging Technology: Optical
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Supplier: Hamamatsu Photonics
Description: The Optical NanoGauge Thickness measurement system C12562 is a compact, space-saving, non-contact film thickness measurement system designed to easily install in equipment where needed. In the semiconductor industry, measuring silicon thickness is essential due to
- Gaging Technology: Optical
- Range: 1.97E-5 to 0.0118 inch
- Units: Metric
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Supplier: KEYENCE
Description: Angle Micron-level Defect Detection Surface Profiling Thin-film Thickness Coating Thickness BGA Profile Laser-Marking Depth
- Applications: Semiconductor Wafers, Flat Panel Displays, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone
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Supplier: KEYENCE
Description: LK-G5000 High-Speed / High-Accuracy Laser Displacement Sensor The LK-G5000 is a High-Speed 1D Laser Displacement Sensor for precision displacement measurement. With a sampling speed of 392 kHz, this sensor is able keep up with just about any inline process as well as account
- Applications: Semiconductor Wafers, Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone
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Supplier: SAE International
Description: immediately and data was unable to be obtained. To accomplish above issue, we developed a protective layer with excellent wear-resistance that successfully extended the measurement time by protecting the thin-film sensor. In order to measure pressure during driving, we provided a PVD
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Supplier: KEYENCE
Description: SI-F Series Spectral Interference Displacement Meter The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able
- Applications: Semiconductor Wafers, Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone
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Supplier: MTI Instruments Inc.
Description: The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Wafer Probing System, Sensor / Sensing Element
- Maximum Wafer / Part Size: 76 to 300 mm
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Supplier: MicroSense, LLC
Description: The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: Up to 300 mm
- Measurement Capability: Magnetic Properties (Coercivity / Shift)
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Supplier: Polytec, Inc.
Description: The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mecha nical Systems) devices. By fully integrating a microscope with
- Applications: Other
- Form Factor: Sensor / Sensing Element
- Measurement Capability: Roughness / Waviness, Shape / Flatness, Other
- Mounting / Loading: Manual Loading
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Supplier: Accuris
Description: Standard Test Method for Measurement of Dry Film Thickness of Thin Film Coil-Coated Systems by Destructive Means Using a Boring Device
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Supplier: MicroSense, LLC
Description: Benchtop, automated Thickness measurement systems Cassette to cassette or manual loading Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 2” to 4” (50 to 100mm). Thickness range: 50um to 3mm
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 50 to 100 mm
- Measurement Capability: Thickness - Wafer / Disc (TTV)
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Supplier: MicroSense, LLC
Description: Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution Thickness range from 50um to 1mm Automated
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 156 mm
- Measurement Capability: Thickness - Wafer / Disc (TTV)
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Supplier: Zygo Corporation
Description: virtually all types of surfaces, from rough to super smooth, including thin films, steep slopes, and large steps. Sub-nanometer measurement precision is independent of field magnification Gage capable performance - exceptional precision and repeatability for the most demanding
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Depth Profiling: Yes
- Form Factor: Monitor / Instrument
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Supplier: Technic, Inc.
Description: Technic's EBA, unlike other control methods, it utilizes both DC & AC voltammetry for precise analysis of plating additives. Technic EBA provides precise measurements with real time data with SPC controllability. It is a fully automated system with a self-contained probe that
- Applications & Materials Processed: Other
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Supplier: MicroSense, LLC
Description: Automated Wafer Thickness Measurement System Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 4” to 12” (100 to 300mm) Thickness range: 50um to 3mm
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 100 to 300 mm
- Measurement Capability: Roughness / Waviness, Thickness - Wafer / Disc (TTV)
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Supplier: ASTM International
Description: 1.1 This test method covers the measurement of dry film thickness (DFT) of coating films by microscopic observation of a precision-cut, shallow-angle crater bored into the coating film. This crater reveals cross sectional layers appearing as rings, whose width is
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Supplier: ASTM International
Description: 1.1 This test method covers the measurement of dry film thickness (DFT) of coating films by microscopic observation of a precision-cut, shallow-angle crater bored into the coating film. This crater reveals cross sectional layers appearing as rings, whose width is
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Supplier: ASTM International
Description: 1.1 This test method covers the measurement of dry film thickness (DFT) of coating films by microscopic observation of a precision-cut, shallow-angle crater bored into the coating film. This crater reveals cross sectional layers appearing as rings, whose width is
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Supplier: Fischer Technology, Inc.
Description: The modular measurement system FISCHERSCOPE MMS PC2 with the Windows™ CE operating system is the ideal solution for highly precise coating thickness measurement and material testing. Networking capability via LAN and USB connectivity enables rapid integration in quality
- Coating Thickness: Yes
- Gaging Technology: Eddy Current / Electromagnetic, Electronic
- Graduation / Resolution: 0.0 to 0.0787 inch
- Mounting / Loading: Benchtop / Floor
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Supplier: ASTM International
Description: 1.1 This test method covers the measurement of dry film thickness (DFT) of coating films by microscopic observation of a precision-cut shallow-angle crater in the coating film. 1.2 The substrate may be any rigid, metallic material, for example, cold-rolled steel,
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Supplier: Accuris
Description: Standard Test Method for Measurement of Dry Film Thickness of Thin-Film Coil-Coated Systems by Destructive Means Using a Boring Device - INCLUDES STANDARD + REDLINE (PDF)
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Supplier: Tekscan, Inc.
Description: , and software. There are many different options for data acquisition electronics, standard and custom sensors, and software add-ons, which make the I-Scan system extremely versatile, creating endless possibilities for applications. Over 200 flexible, thin film sensors are
- Electrical Output: Other
- Electronic/Digital Image: Yes
- Flexible: Yes
- Imager/Sensor Type: Active Pressure Sensor Arrays
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Supplier: Accuris
Description: Methods of test for metallic and related coatings, Method 1.7: Local thickness tests - Measurement of dry film thickness of thin coating systems particularly by coil coated products by destructive means using a boring device
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Description: IEC 62884-2:2017 specifies the methods for the measurement and evaluation of the phase jitter measurement of piezoelectric, dielectric and electrostatic oscillators, including dielectric resonator oscillators (DROs) and oscillators using a thin-film bulk acoustic resonator
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Supplier: Cascade Microtech, Inc.
Description: Designed specifically for DC/CV parametric measurement applications
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 150 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: Rigaku Corporation
Description: , film composition, and element concentration with new functions and a low-COO design. A versatile and reliable tool for 200 mm and smaller wafers, the WDA-3650 incorporates our trademark X-Y-? sample stage system for superior results on difficult measurements, such as
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
- Measurement Capability: Composition, Thickness - Film / Layer
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Supplier: KEYENCE
Description: SI-F Series Spectral Interference Displacement Meter The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able
- Applications: Semiconductor Wafers, Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone
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Supplier: Polytec, Inc.
Description: Roughness (Ra) overthe full surface with results comparable to an AFM, but in a fraction of the time. You can achieve repeatablenano and micro waviness measurements when measuring the same target on different machines and the capability to not only find defects, but to classify nano-pits and
- Applications: Data Storage / Memory
- Form Factor: Monitor / Instrument
- Measurement Capability: Defects / ADC, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-310 includes Rigaku's
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-V310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-V310 includes Rigaku's
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF 3760 includes Rigaku's
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: Tekscan, Inc.
Description: pressure between two surfaces, utilizing a thin and flexible sensor. The system is comprised of data acquisition electronics, sensors, and software. Measuring both force and pressure, the exceptionally thin tactile sensor provides minimal interference between the objects being
- Device Category: Instrument
- Display: Video
- Operating Temperature: 15 to 140 F
- Pressure Reading: Gauge
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Supplier: Park Systems, Inc.
Description: Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Park Systems, Inc.
Description: The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology over any other
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
- Mounting / Loading: Floor Mounted / Stand-alone
Find Suppliers by Category Top
Featured Products Top
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which are enabled by multiple thin film measurement and analysis technologies available on ZYGO's 3D optical profilers. Advanced Model Based (read more)
Browse Thin Film Coating Services Datasheets for Zygo Corporation -
flow rate and moisture content in various gases and liquids. This webinar will present the anemometric and calorimetric thermal mass flow measurement principles employed by IST AG's thin-film flow sensors. Viewers will also learn about the importance of selecting the right materials for (read more)
Browse Flow Meters Datasheets for Innovative Sensor Technology IST USA Division -
System accurately measures the highest-performance optical filters. The HELIX Spectral Analysis System has redefined measurement capabilities of high performance thin-film optical filters. HELIX is an instrument designed and developed by Alluxa Engineering staff to address the limitations (read more)
Browse Optical Filters Datasheets for Alluxa, Inc. -
's cell constant and the benefits of 2-electrode and 4-electrode measurement for different applications. We'll then take a trip to the cleanroom and see how they are made, step-by-step, using thin- and thick-film processes. Lastly, we'll discuss sensor customization for unique applications Register for OnDemand Webinar (read more)
Browse Biosensors and Microarrays Datasheets for Innovative Sensor Technology IST USA Division -
five types of thin film measurement technology: RTD temperature sensors, capacitive relative humidity sensors, mass flow sensors and conductivity. Manufactured at the component level, these elements are available with a diverse range of standard and custom features (read more)
Browse Flow Meters Datasheets for Innovative Sensor Technology IST USA Division -
-independent measurement, where a nanometer-accurate thickness value is achieved even with moving objects. The large thickness measuring range allows the measurement of thin layers, flat glass and films. Since the white light interferometer works with an SLED in the near infrared range, thickness measurement of anti (read more)
Browse Interferometers Datasheets for Micro-Epsilon Group -
The combiSENSOR KSB6430 combines two different measuring principles and converts their advantages into precise thickness measurements. The measuring range of the sensor extends from 5 µm to 3 mm and is therefore designed for both very thin and thicker coatings (read more)
Browse Capacitive Linear Position Sensors Datasheets for Micro-Epsilon Group -
regular business hours for design, application, and after sales support. Products: IST produces five types of thin film measurement technology: RTD temperature (read more)
Browse Resistive Temperature Devices (RTD) Elements Datasheets for Innovative Sensor Technology IST USA Division -
regular business hours for design, application, and after sales support. Products: IST produces five types of thin film measurement technology: RTD (read more)
Browse Moisture Meters Datasheets for Innovative Sensor Technology IST USA Division -
gage block comparator with many more uses besides gage blocks and can be used as a high precision height gage. The Labmaster Standard is also the instrument of choice for thickness measurement of thin, soft materials such as poly films, meshes, magnetic tape or disk substrates, and metal foils (read more)
Browse Calibration Instruments Datasheets for Pratt & Whitney Measurement Systems, Inc.
Conduct Research Top
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First-Ever Precision Measurement/Loading System for GRIN Optical Thin Film Measurement
ABTech Manufacturing creates the first measurement and automatic loading system for ultra-precise, ultra-thin optical films in just 3 months.
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New Metrology Techniques for Advanced Thin Film Optical Filters
Improvements in optical filter performance require improvements in optical filter measurement techniques.
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Ammonia Pressure Measurement using Thermal Flash Protection (.pdf)
O-ring will fail. Fluid filled sensors suffer from freezing effects. This causes a rupture of the thin diaphragm membrane, which is welded in place to hold in the silicone oil-fill. Thin film sensors [based on 15-5 and 17-4PH stainless steels] that have their diaphragm welded to a pressure port
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Temperature Compensation of a DC Radiometer
The thin film thermopile detector like its forefather, the wire thermocouple, requires either a reference junction temperature measurement or a constant temperature sink for its reference junction. The later is usually difficult to implement in an instrument because of size and weight requirements
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Flowmeters Benefit From Silicon Advances
Controller Responds Rapidly Developed with the aid of micro-machining and thin-film technologies, "ultra-miniature " thermal flow sensor is capable of 2 millisecond response time at the chip level. Symmetrical design affords measurement of reverse flows. Digital MFC Preprogrammed for Common Gases
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A Microfluidic System for Biological Particle Enrichment Using Contactless Dielectrophoresis
reservoirs filled with a highly. conductive solution, rather than a separate thin-film array,. the electrode structures used by cDEP can be fabricated in. the same step as that of the rest of the device; hence, the. process is conducive to mass production.18. A cDEP device is presented