Thin Film Measurement System

Description: software and development kit, and is available at an extremely low price! Couple this with StellarNet’s Thin Film Measurement System and have full functionality for measuring thickness and index of both single-layer and multilayer films!

Description: The Optical NanoGauge Thickness measurement system C15151-01 is a non-contact film thickness measurement system utilizing spectral interferometry. The high-power, highly stable white light source enables precise measurement of film thicknesses, even

• Range: 0.393701 inch
• Measurement Scale / Units: Metric
• Gaging Technology: Optical
• Attribute Measurement Capability: Thickness Gage

Description: TF Systems for Non-Contact Film Thickness Measurements We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet

• Applications: CVD / PVD Films, Data Storage / Memory, Flat Panel Displays, Optical Components, Polishing / CMP, Polymers / Photoresists, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument
• Features: Non-contact, Non-destructive, Other

Description: The TFG6220 measures the thickness of electrically conductive film, e.g. battery film, with maximum precision. The TFG6220 is used for qualification, offline testing of samples, and quality control. A vacuum device sucks in the object to be measured, smooths it and thus ensures

• Measurement Range: 0.0393701 inch
• Operating Temperature: 64.4 to 77 F
• Sensor Technology: Capacitive Linear Position Sensor
• Features: DC Powered

Description: The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation,

• Maximum Wafer / Part Size: 300.00000000000006 mm
• Measurements: Area Mapping, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Technology: Capacitance / EM Gage
• Mounting / Loading: Manual Loading

Description: different options for data acquisition electronics, standard and custom sensors, and software add-ons, which make the I-Scan system extremely versatile, creating endless possibilities for applications. Over 200 flexible, thin film sensors are available in different sizes,

• Pressure Range: 25,000 psi
• Width: 0.12 to 69 inch
• Length: 0.12 to 69 inch
• Thickness: 0.02 inch

Description: space on contact surface, and moreover there was no method to secure the sensor on contact surface at that time. A several-micrometer-thin-film sensor was installed on a sliding surface to attempt measurement, but since the sensor was attached on a contact surface, wear occurred

Description: Standard Test Method for Measurement of Dry Film Thickness of Thin Film Coil-Coated Systems by Destructive Means Using a Boring Device

Description: Standard Test Method for Measurement of Dry Film Thickness of Thin-Film Coil- Coated Systems by Destructive Means Using a Boring Device

Description: Automated Cassette-to-Cassette Thin-Film Thickness Mapping System for Production Environments The Filmetrics F60-c family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments.

• Measurements: Area Mapping
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: Standard Test Method for Measurement of Dry Film Thickness of Thin-Film Coil-Coated Systems by Destructive Means Using a Boring Device - INCLUDES STANDARD + REDLINE (PDF)

Description: 1.1 This standard consists of terms and definitions pertaining to measurements taken on thin, reflecting films, such as found in microelectromechanical systems (MEMS) materials. In particular, the terms are related to the standards in Section , which were generated by

Description: 1.1 This test method covers the measurement of dry film thickness (DFT) of coating films by microscopic observation of a precision-cut shallow-angle crater in the coating film. 1.2 The substrate may be any rigid, metallic material, for example, cold-rolled steel,

Description: 1.1 This test method covers the measurement of dry film thickness (DFT) of coating films by microscopic observation of a precision-cut, shallow-angle crater bored into the coating film. This crater reveals cross sectional layers appearing as rings, whose width is

Description: 1.1 This standard consists of terms and definitions pertaining to measurements taken on thin, reflecting films, such as found in microelectromechanical systems (MEMS) materials. In particular, the terms are related to the standards in Section 2, which were generated by

Description: Measure film thickness in-line and in real-time at up to seven locations with the F37. Example Layers Almost any smooth and at-least-partially transparent films may be measured. This includes virtually any semiconducting material, including those used in thin-film

• Features: Autoloading / In-line, Non-contact, Non-destructive
• Applications: CVD / PVD Films, Semiconductor Wafers
• Measurements: Deposition Rate, Thickness - Film / Layer
• Form Factor: Monitor / Instrument

Description: Methods of test for metallic and related coatings, Method 1.7: Local thickness tests - Measurement of dry film thickness of thin coating systems particularly by coil coated products by destructive means using a boring device

Description: the smallest features. High-Accuracy Surface Scanning Method Excellent resolution of 0.0004 Mil Quick and easy setup functions · Multiple measurement modes for a wide range of applications Common Applications: Angle Micron-level Defect Detection Surface Profiling Thin-film

• Features: Autoloading / In-line, Non-contact, Non-destructive, Other
• Form Factor: Controller, Monitor / Instrument, Sensor / Sensing Element
• Applications: Flat Panel Displays, Packaged ICs / Ceramic Substrates, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone, In-situ / System Mounted

Description: High-Resolution Film Thickness Maps The Filmetrics F42 can map the thickness of films, such as OSP, at over one-million points, each with a spot size as small as 3 microns. Using an integrated CCD camera, live video makes it easy to pinpoint exact measurement locations. Once the

• Measurements: Area Mapping, Optical Constants (n, k)
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: modules provide access to all of the analytical power of the Filmetrics F20. Data can be exported and printed easily. The F10-RTA models add 70° angled reflectance (450-800nm) to the F10-RT capabilities, which results in increased measurement capabilities for very or complex thin

• Range: 0.0000001181103 to 0.005905515 inch
• Mounting / Loading Options: Benchtop / Floor
• Measurement Scale / Units: Metric
• Gaging Technology: Non-contact, Optical

Description: stable, accurate measurements. An accuracy of ±0.02% and repeatability of 0.01µm makes this the most accurate sensor in its class. Improved Ernostar lensing and the second generation ABLE algorithm ensure stable measurement on anything from translucent plastics to uncured rubber to

• Features: Autoloading / In-line, Non-contact, Non-destructive, Other
• Form Factor: Controller, Monitor / Instrument, Sensor / Sensing Element
• Applications: Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone, In-situ / System Mounted

Description: SI-F Series Spectral Interference Displacement Meter The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see

• Features: Autoloading / In-line, Non-contact, Non-destructive
• Form Factor: Controller, Monitor / Instrument, Sensor / Sensing Element
• Applications: Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone, In-situ / System Mounted

Description: The modular measurement system FISCHERSCOPE MMS PC2 with the Windows™ CE operating system is the ideal solution for highly precise coating thickness measurement and material testing. Networking capability via LAN and USB connectivity enables rapid integration in quality

• Graduation / Resolution: 0 to 0.0787402 inch
• Resolution: 0 to 0.0787402 inch
• Mounting / Loading Options: Benchtop / Floor
• Features: Coating Thickness, Eddy Current / Electromagnetic, Wet Film Thickness

Description: referred to as an "Oscillator") and gives guidance for phase jitter that allows the accurate measurement of RMS jitter. In the measurement method, phase noise measurement equipment or a phase noise measurement system is used. NOTE Dielectric resonator oscillators

Description: referred to as an "Oscillator") and gives guidance for phase jitter that allows the accurate measurement of RMS jitter. In the measurement method, phase noise measurement equipment or a phase noise measurement system is used. NOTE Dielectric resonator oscillators

Description: The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mechanical Systems) devices. By fully integrating a microscope with Scanning

• Mounting / Loading: Manual Loading
• Features: Non-contact, Non-destructive, Other
• Technology: Optical / Imaging System
• Measurements: Roughness / Waviness, Shape / Flatness

Description: The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral

• Maximum Wafer / Part Size: 650.0000000000001 mm
• Measurements: Area Mapping, Critical Dimension / Trench Geometry, Depth Profiling, Roughness / Waviness, Shape / Flatness
• Technology: Interferometer
• Mounting / Loading: Manual Loading

Description: The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to

• Maximum Wafer / Part Size: 76 to 300.00000000000006 mm
• Measurements: Area Mapping, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Technology: Capacitance / EM Gage
• Mounting / Loading: Manual Loading

Description: Electro Mechanical Systems) type air-flow sensor chips. Until today, in MEMS-type airflow sensors, poly-crystalline silicon (poly-Si) and platinum were widely used as a resistor material of key functional elements on a membrane of air-flow-rate measurement portion. The functional

Description: The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the

• Maximum Wafer / Part Size: 300.00000000000006 mm
• Mounting / Loading: Floor Mounted / Stand-alone
• Measurements: Magnetic Properties (Coercivity / Shift)
• Technology: Magnetometer

Description: Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution Thickness range from 50um to 1mm Automated calibration Hiscan option

• Maximum Wafer / Part Size: 156 mm
• Mounting / Loading: Manual Loading
• Form Factor: Monitor / Instrument
• Technology: Optical / Imaging System

Description: utilizing a thin and flexible sensor. The system is comprised of data acquisition electronics, sensors, and software. Measuring both force and pressure, the exceptionally thin tactile sensor provides minimal interference between the objects being measured, allowing the true

• Working Pressure Range: 0 to 30,000 psi
• Operating Temperature: 15 to 140 F
• Pressure Measurement: Gauge
• Device Category: Instrument

Description: 3D HLP's ability to generate a detailed 3D representation of the surface, which can be used to accurately determine the topology of components, such as flatness, deflection and curvature. The RCS130-160 3D HLP is specially optimized for measurement and inspection tasks in production lines. It

• Vertical (Z) Range: 6.8897675 to 8.8582725 inch
• Lateral (X) Resolution: 0.00393701 inch
• Traverse Length: 6.299216 inch
• Operating Temperature: 32 to 104 F

Description: precision height gage. The Labmaster Standard is also the instrument of choice for thickness measurement of thin, soft materials such as poly films, meshes, magnetic tape or disk substrates, and metal foils. Also, the ball manufacturing industry heavily relies on the Labmaster

• Range: 0 to 8 inch
• Resolution: 0.0000001 inch
• Graduation / Resolution: 0.0000001 inch
• Range / Travel: 0 to 8 inch

Description: your side. The system incorporates a high resolution θ/θ closed loop goniometer drive system, cross beam optics (CBO), an in-plane scattering arm, and an optional 9.0 kW rotating anode generator. Coupling a computer controlled alignment system with a fully automated optical

• Maximum Specimen Diameter: 200 mm
• Features: Benchtop
• Positioning System: Eulerian Cradle, Goniometer
• Diffraction Method: Powder