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Supplier: Accuris
Description: Semiconductor devices - Micro-electromechanical devices Part 9: Wafer to wafer bonding strength measurement for MEMS
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Supplier: Accuris
Description: Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
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Description: IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS
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Supplier: CSA Group
Description: IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS
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Supplier: Accuris
Description: Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 9: Wafer to wafer bonding strength measurement for MEMS
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Supplier: Kayaku Advanced Materials, Inc.
Description: Designed for cavity definition and capping in applications such as BAW, SAW, and microfluidic devices, these resists provide excellent alignment accuracy, low‑temperature processing, and high‑quality bond formation. Perminex adhesives enable patterning and bonding of wafers with high
- Applications: Electronics / Microelectronics
- Thick Film Type: Resistor
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Supplier: Palomar Technologies, Inc
Description: placement accuracy, making component assembly practical and cost-effective. A specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available. Wafer Scale Packaging (WSP) Wafer Scale Packaging (WSP) eutectic die attach on
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Supplier: Palomar Technologies, Inc
Description: include flip chip solder reflow, solder lid sealing, wafer to wafer bonding using solder, glass, adhesives and direct fusion. Wafer Aligner Capabilities Alignment of wafers of to 8 inch (200mm diameter) Fully adjustable stages for positions over wafer
- Maximum Wafer / Part Size: 100 to 200 mm
- Technology: Optical / Imaging System
- Features: Other
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Supplier: SCHOTT AG
Description: Glass wafers made of BOROFLOAT® glass offer outstanding thermal resistace. The glass composition of BOROFLOAT® is tailored to perfectly match the thermal expansion coefficient of silicon which is essential for good bonding behavior. BOROFLOAT® - The sum of its properties is what makes
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Description: A ceramic wafer chuck is a specialized tool employed in the semiconductor industry to hold wafers in a secure position. It functions as a stable platform that guarantees consistent contact and precise positioning of the wafer during many procedures, including lithography,
- Features: Alumina / Aluminum Oxide, Specialty Ceramic
- Applications: Chemical / Materials Processing, Electrical / HV Parts
- Specialty Ceramic Type: Silicon Carbide, Silicon Nitride, Tungsten Carbide (WC)
- Shape / Form: Wafer Carrier / Holder
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Description: reliability of Si chip and thermal heat cycling. According to direct wafer bonding technology, polished semiconductor wafers can be bonded together without adhesives. Direct wafer bonding requires very flat and high smooth surface (Ra≤0.05um), Innovacera AlN
- Specialty Ceramic Type: Aluminum Nitride
- Features: Other, Specialty / Other, Specialty Ceramic
- Shape / Form: Wafer / Substrate
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Supplier: Palomar Technologies, Inc
Description: Overview The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its patented Dual Z-Axis bond head enables very reliable Deep Access wire bond
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Supplier: Palomar Technologies, Inc
Description: packages requires specialized thermal processing in high vacuum system. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Wafer Level Packaging and Wafer Bonding.
- Temperature Range: 662 F
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Supplier: Hyperion Materials & Technologies
Description: Standard grade micron synthetic diamond powder designed for resin bond systems. Designed for reliable and secure performance in polishing applications and lapping of glass, wafers, and polycrystalline diamond.
- Applications: Abrasive / Erosive Wear Protection
- Material Type: Diamond / Diamond-Like
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Supplier: Plansee SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire
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Supplier: ETEL S.A.
Description: state). Up to 10 kUPH throughput for a typical flip chip die bonding application. Up to 2 kUPH throughput for a hybrid bonding application. Up to 180 kUPH throughput for µ-LED bonding. Up to 4 g acceleration in X, 6 g in Y and 7.5 g in Z. Up to 2 m/s speed in X and Y and 1 m/s
- Stroke or X-Axis Travel: 0 to 16.141741 inch
- Y-Axis Travel: 0 to 17.5196945 inch
- Z-Axis Travel: 1.181103 inch
- Rated Speed: 78.74015748031496 in/sec
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Supplier: Shenzhen Jewellok Technology Co., Ltd.
Description: Chemical Delivery Modules for Automated Blending and Precise Dilution in Modern Wafer Cleaning Applications Shenzhen Jewellok Technology specializes in Ultra-High Purity (UHP) liquid chemical delivery systems tailored for the semiconductor and photovoltaic industries. These systems are
- Body Material: Stainless Steel
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Supplier: AENOR
Description: Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
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Supplier: AENOR
Description: Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
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Supplier: Zygo Corporation
Description: Wafer production technology requires extreme precision components, whether for reticle stages, wafer stages or imaging technologies. ZYGO is a leading supplier of stage positioning components, serving the semiconductor industry and emerging EUV technologies through multiple custom
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Viscosity: 20,000 to 30,000 cP
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
- Substrate Compatibility: Ceramic / Glass
- Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric, Gel, Other, Thermal / Heat Conductive, Unfilled
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Supplier: Kunshan Xinlun Superabrasives Co., Ltd.
Description: Bond: vitrified or ceramic bond; Abrasive: Diamond; Dimension: As per your requirement. Applications: For centerless grinding; Material of workpiece: wafer, carbide, cermet, CBN, PCD,PCBN, crystal, rare-earth material, etc.
- Mounting: Bore / Center Mount
- Features: Closed Structure / High Concentration, Specialty / Other
- Applications & Materials Abraded: Cylindrical / Centerless
- Type: Superabrasive - Diamond, Superabrasive Wheel
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Supplier: MacDermid Alpha Electronics Solutions
Description: formulated for the fabrication of pillars or pads for wafer level packaging applications that require hybrid bonding. It enables low temperature, high reliability copper to copper interconnects for die-to-die (D2D), die-to-wafer (D2W), and wafer-to-wafer (W2W)
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Supplier: Kunshan Xinlun Superabrasives Co., Ltd.
Description: Bond: vitrified or ceramic bond; Abrasive: CBN or Diamond; Dimension: As per your requirement; Application: For surface grinding; Material of workpiece: wafer, carbide, cermets, CBN, PCD, PCBN, crystal, rare-earth material, ceramics, magnetic material. Semiconductor material, and automobile
- Mounting: Bore / Center Mount
- Type: Ceramic (e.g., Norton SG®, Norton Quantum®), Superabrasive - CBN, Superabrasive - Diamond, Superabrasive Wheel
- Features: Closed Structure / High Concentration, Other, Specialty / Other
- Bond Type: Vitrified
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Supplier: MacDermid Alpha Electronics Solutions
Description: Solvent-based adhesive for temporary bonding, ideal for GaAs/silicon wafer thinning. Debonds with IPA, no residue. Product Overview A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive paste is a low-modulus polymer
- Industry: Aerospace, Electronics, Medical / Food (Sanitary / FDA), Semiconductors / IC Packaging
- Cure / Technology: Thermoplastic / Hot Melt
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Supplier: Tronics Microsystems
Description: customers will have access to advanced DRIE process up to 1:30 aspect ratio. As well as reliable and qualified deep vacuum wafer level package process below 10mTorr. Tronics offer is not limited to wafer processing. We also perform wafer level test and dicing. This ensures
- Services: Design / Engineering, Production, Prototyping, R & D / Development
- Capabilities: Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing, Wafer Bonding, Wet / Chemical Etching
- Features: Europe Only, Specialty / Other
- Materials: Quartz, SOI, Silicon
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Description: AlN substrate possesses a wide range of superior physical properties, including high breakdown electric field strength, thermal conductivity, resistivity, and so forth. In fields like LED packaging, power modules, wafer bonding, power resistors, and metalized substrates (such as thin
- Density: 3.2499979488370605 to 3.349997885724355 g/cc
- Max Use / Curie Temperature: 1,200 C
- Dielectric Strength: 17,000,000 V/m
- Specialty Ceramic Type: Aluminum Nitride
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Supplier: MacDermid Alpha Electronics Solutions
Description: ideal for semiconductor wafer applications requiring gold bump plating or minimal grain growth during heat treatment.
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Supplier: MacDermid Alpha Electronics Solutions
Description: Tin-silver bump metallization bath allows high-speed electro-deposition of smooth, fine-grained, uniform tin silver alloy bumps. Product Overview MICROFAB TS-650 NXG is the tin-silver bump, pillar, and capping metallization process for wafer level packaging designs where coplanarity, bond
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Description: Semiconductor manufacturing: Rapid annealing of wafers, wafer bonding, eutectic bonding, thermocompression bonding. Electronic packaging: Welding of LED chips and power devices. Materials research: High temperature sintering, thermal cycle experiments. Aerospace:
- Features: Other
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Supplier: Locon Sensor Systems, Inc.
Description: is adjustable from 0 to 8mm, depending on the sensor model. Because of their extremely precise sensing capabilities, Locon Sensors capacitive bonding sensors can detect even the smallest gold wires in any bonding machine to attach bare wafer chips to a base plate. Locon Sensors
- Operating Distance: 0 to 0.3149608 inch
- Operating Temperature: -22 to 176 F
- Sensor Technology: Capacitive Proximity Sensor
- Body Shape: Cylindrical, Threaded Barrel
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Supplier: Accuratus Corporation
Description: Accuratus maintains an inventory of standard aluminum nitride substrates for fast delivery requirements. They are stocked in industry standard thicknesses of .025 inches and .040 inches. We will be happy to provide a quotation. Call us at 908-213-7070 or fax your requirement to 908-213-7069. If you
- Thickness / Wall Thickness: 0.04 inch
- Length: 2 inch
- Diameter: 2 inch
- Density: 3.26 g/cc
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Supplier: Henkel Corporation - Industrial
Description: to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness
- Viscosity: 55,000 cP
- Thermal Conductivity: 0.44 W/m-K
- Features: Electrically Insulating / Dielectric
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Supplier: ROHM Semiconductor USA, LLC
Description: hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is
- Operating Temperature: -40 to 185 F
- Measurement Axes: Triaxial
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enhancing the longevity and performance of the LEDs. Wafer Bonding Technology: Innovacera’s AIN wafers, with their polished surfaces (Ra ≤ 0.05 µm), meet the stringent requirements of direct wafer bonding technology. This process, which bonds semiconductor wafers without (read more)
Browse Specialty Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
In advanced semiconductor production, unstable wafer positioning, thermal distortion, and contamination risks can directly impact yield, process repeatability, and device reliability—especially during lithography, plasma processing, and bonding (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
supply-chain issue. Swissbit is responding with fully integrated e.MMC manufacturing in Berlin. Production begins at wafer level and includes substrate design, bonding, molding, balling, burn-in, inspection, and electrical testing across industrial (read more)
Browse Memory Modules Datasheets for Swissbit AG -
for die-to-die (D2D), die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding. Learn more about product features and applications. (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions -
steps transform delicate wafers into robust and functional electronic components that meet the demands of modern technology. Packaging Packaging provides physical protection for semiconductor devices, shields them from environmental hazards, and manages heat dissipation during (read more)
Browse CNC Machining Services Datasheets for Top Seiko Co., Ltd. -
– Sometimes semiconductor processes require a trace moisture environment to maintain material properties essential in precision bonding, such as in multi-wafer stacking in a non-vacuum environment. Air Innovations can help you sustain the low (read more)
Browse Environmental Control Systems Datasheets for Air Innovations LLC -
chip die bonding application and up to 180 kUPH for µ-LED bonding. TELICA is available in two standard variants: variant 1 for Wafer Level Packages (WLP) with X410 x Y445 x Z30 mm travels and (read more)
Browse Multi-axis Positioning Systems Datasheets for ETEL S.A. -
modules Integrated circuit package Semiconductor manufacturing devices High-frequency circuits LED package Wafer bonding Optical module submount Ferrite microstrip circuit (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
hybrid bonding are two standout technologies in mid-end semiconductor manufacturing. At Top Seiko, we specialize in delivering premium vacuum chucks crafted from a variety of materials (read more)
Browse Production Machining Datasheets for Top Seiko Co., Ltd. -
Product Overview Used as structural support members in precision metrology equipment, wafer inspection stages, coordinate measuring machines, and optical platforms where frame rigidity and dimensional stability directly determine measurement accuracy. Fountyl silicon (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for Fountyl Technologies Pte. Ltd.
Conduct Research Top
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Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
used to mount the wafer during the die sawing operation. The analytical equipment and methodology used to determine the failure mechanism are described. Auger Electron Spectroscopy and X-ray Photoelectron spectroscopy are used to identify the elements and their chemical states on the die bonding
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
ST opens automated assembly line in Malaysia, pushes ahead in Singapore As planned, Don Brooks leaves UMC post TI closes $1.2 billion stock acquisition of Unitrode QuickLogic's IPO includes 3.3 million shares offered by Cypress SiGen teams with Electronic Visions on SOI wafer bonding system DSP
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
ASE to surpass Amkor in IC-packaging market, says report Merger rumors in foundry biz SiGen, EV Group forge wafer bonding alliance Apple cites Oxford Semi's ARM chip in Firewire drive failures Suppliers get hopeful for 2004 Tronics Microsystems opens Grenoble MEMS wafer fab Struggling Trikon raises
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Semiconductor Manufacturing Processes and Laser Displacement Sensors (.pdf)
more accurate (0.02 µm repeatability), faster (392 kHz sampling rate) and more flexible. Because of their greater speed, accuracy and flexibility, these sensors can be used in a wider variety of applications ranging from wafer production and handling all the way to wire bonding and final packaging
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Hernon Supertacker Used in UConn Application
Supertacker (R) involves bonding mounting wires to diamond wafers. Project lead Igor Senderovich is a Graduate Student at UConn. The diamond radiators are part of a larger project of building a Tagger Microscope, which is a movable, high-resolution hodoscope that counts post- bremsstrahlung
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Three Common Types of Pressure-Sensor Packages
At the heart of every MEMS pressure sensor is a MEMS silicon die. Merit Sensor owns and operates a wafer fab, where it produces all of its own MEMS die. Packaging a MEMS die requires specialized equipment and skills to handle the small and sensitive die and to perform delicate wire bonding
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. barrier Cypress, Mosel Vitelic to develop 0.13-micron process technology ESEC develops flexible die bonder for wider range of IC packages Taiwan's government delays S3-Via venture in graphics chips Silicon Genesis expands SOI wafer manufacturing capacity, ships samples 'E-diagnostics' heats up
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DeepMaterial Adhesive Solutions for Industrial
for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment
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Indicates content that may require registration and/or purchase.
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Wafer Level 3-D ICs Process Technology
Geometric scaling has a fundamental 2x cost reduction per technology node while 3D from a simple wafer perspective has an additional cost of vertical wafer bonding and interconnection.
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MEMS Materials and Processes Handbook
Wafer bond- ing , a crucial fabrication technique for silicon MEMS encapsulation and structure fabrication, is covered in detail in Chapter 11 with emphasis placed on direct and intermediate layer bonding methods.
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http://dspace.mit.edu/bitstream/handle/1721.1/16675/56835839-MIT.pdf?sequence=2
Wafer Bonding : Mechanics-Based Models and Experiments .
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Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics
BIn memory of Qin-Yi Tong who significantly advanced the field of wafer bonding .
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Bonding in Microsystem Technology
The mechanism of high-temperature brand silicon wafer bonding has been described by many authors [1–3, 5, 6, 22, 35, 37–39]*.
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http://dspace.mit.edu/bitstream/handle/1721.1/30156/60654503-MIT.pdf?sequence=2
Copper Wafer Bonding in Three-Dimensional Integration .
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http://dspace.mit.edu/bitstream/handle/1721.1/37879/124509864-MIT.pdf?sequence=2
Multi-Layer Three-Dimensional Silicon Electronics Enabled by Wafer Bonding .
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http://dspace.mit.edu/bitstream/handle/1721.1/38515/156572821-MIT.pdf?sequence=2
19 1.2.1 Wafer Bonding Characterization………………………………...