Fundamentals of Microsystems Packaging

Chapter 1: Introduction to Microsystems Packaging

Prof. Rao R. Tummala
Georgia Institute of Technology

CHAPTER OBJECTIVES

  • Introduce the concept of Microsystems

  • Present Microsystems building block technologies to contain Microelectronics, Photonics, MEMS, and RF/Wireless

  • Describe the role of Packaging as IC and Device Packaging, and Microsystems Packaging

  • Describe Systems Packaging to go from wafer to complete system

  • Describe the role of electrical, mechanical and materials in Systems Packaging

CHAPTER INTRODUCTION

Microsystems and the technologies they constitute are the building blocks of information technology. These systems require a set of fundamental technologies that include not only microelectronics but also photonics, MEMS, RF and wireless. For these functions to be integrated into systems, they have to be designed, fabricated, tested, cooled and reliability assured. In other words, they have to be system-packaged. This book is about Systems Packaging.

1.1 WHAT ARE MICROSYSTEMS?

Imagine a world without personal computers, cell phones, fax machines, camcorders, stereos, microwave ovens, calculators and all the other electronic products. Now imagine what is coming. Microsystems will impact many areas of life. These systems include voice controlled computers, electronic notepads and work surfaces, electronic newspapers on flat panel displays which can be rolled or folded, small mobile x-ray and diagnostic tools, micromedical implants, videophones in watches and wireless Internet access anytime anywhere. The technologies behind all these and millions of other electronic products in automotive, consumer, telecommunication, computer, aerospace, and medical industries are all based on microdevices and packaging technologies. They touch every aspect of human life with the potential to...

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