Fundamentals of Microsystems Packaging

Glossary

A-B

accelerated stress test
A test conducted at a stress, e.g., chemical of physical, higher than that encountered in normal operation, for the purpose of producing a measurable effect, such as a fatigue failure, in a shorter time than experienced at operating stresses.
accelerator
An organic compound which is added to an epoxy resin to shorten the cure time.
active components
Electronic components, such as transistors, diodes, electron tubes, thyristors, etc., which can operate on an applied electrical signal so as to change its basic characteristics, i.e., rectification, amplification, switching, etc.
active trimming
The process of trimming components such as resistors while the circuit is under power. Such components are fabricated directly onto the substrate of a hybrid or multichip module, and the trimming is usually performed using a laser beam.
additive plating
Processing a hybrid circuit substrate by sequentially plating conductive, resistive, and insulative materials, each through a mask, thus defining the areas of traces, pads, and elements.
additive process
A process in which conducting material is added to specific areas of a substrate. Groups of tracks, individual tracks, or portions of tracks can be built up to precise thicknesses by iterating the process multiple times with selective masking.
advanced statistical analysis program (ASTAP)
The Advanced Statistical Analysis Program is the IBM circuit analysis simulation program. It performs DC, time domain, and frequency domain simulations. Statistics can be applied to all simulations to predict operating tolerances. Among its many features is a...

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