TABLE OF CONTENTS Prof. Jianmin Qu
Georgia Institute of Technology
Dr. Yifan Guo
Motorola
Present the general philosophy and principles of thermomechanical reliability analysis.
Summarize the current methodologies, approaches and tools for thermomechanical reliability analysis.
Outline the next generation reliability analysis tools for the development of next generation packages.
This chapter will start by trying to answer questions like what is thermomechanical reliability in electronic packaging and why is it important to study package reliability? Then, the method of using metrology to analyze reliability will be discussed. Different failure modes and mechanisms will then be investigated, including chemical, physical and thermomechanical failures. The concept of accelerated reliability tests will be introduced and several reliability qualification standards will be described. The chapter will also provide some basic concepts of numerical, analytical and experimental methodologies for failure and reliability analyses. Finally, a summary and trend in reliability technology will be given.
The reliability of a packaged microelectronic system is defined as the probability that this system will be operational within acceptable limits for a given period of time. The mean time to failure for modern devices may range from several hours to several decades at room temperature. Product reliability tests cannot be performed for such long durations. Reliability technologies based on well-designed, well-understood and thoroughly implemented accelerated tests, therefore, are very critical technologies.
Reliability technologies are generally concerned with the following four questions:
When does the...
