TABLE OF CONTENTS Dr. Sundar M. Kamath
Sanmina Corporation
Prof. Rao R. Tummala
Georgia Institute of Technology
Understand the need for a single chip package
Understand the need for a single chip package
Categorize the types of single chip packages based on materials, processes and interconnections to IC and printed wiring board
Discuss materials and processes for single chip packages
Describe thermal, mechanical and electrical characteristics of single chip packages
Single chip packages are the IC carriers called components that go onto system-level boards in all electronic systems. They are made of plastics for low cost and ceramics for high thermal performance and reliability. The recent trend toward portable systems is driving the single chip packages into area array packages such as ball grid array (BGA) or chip scale package (CSP). This chapter is about all single chip packages.
A single chip package (SCP) is a package that supports a single microelectronic device so that its electrical, mechanical, thermal, and chemical performance needs are adequately served. The device so packaged as illustrated in Figure 7.1 originates from a wafer, gets singulated or diced, then packaged and burnt-in and tested. Such a packaged IC may contain millions of transistors or integrated circuits. An easily recognizable example of a SCP is Intel s ceramic pin grid array (CPGA) that has been used to package multiple generations of the X86 family of microprocessors (Figure 7.2) for personal computers.
