TABLE OF CONTENTS Prof. Harry K. Charles Jr.
Johns Hopkins University
Prof. Rao R. Tummala
Georgia Institute of Technology
Define multichip modules and basic application areas
Describe multichip module types and construction
Present elements of multichip module design
Develop tradeoffs between multichip module types and alternative packaging methods
Multichip modules (MCMs) have become a major thrust in electronic packaging technology. Because of the high performance and density of the integrated circuits packaged in multichip modules, stringent new demands are being placed on package structures, electrical interconnects, and sealing (encapsulation) materials. This chapter presents details of MCM technology, including different types, basic design rules, fundamental applications, and packaging alternatives to the MCM. Thin-film MCMs offer great promise for extremely high-performance (density) packaging at very low cost.
A multichip module (MCM) or package is defined as a single unit ( package ) containing two or more chips and an interconnection substrate which function together as a system building block. The MCM, or multichip package (MCP), provides signal interconnect and input/output (I/O) management for the chips contained within the module, thermal management (typically cooling), mechanical support, and environmental protection. MCMs or MCPs are an important technique for the packaging of integrated circuits (ICs) and associated subsystem and system elements. The MCM was developed in the early 1980s and is an evolution of the traditional hybrid package that appeared soon after the birth of the IC. Today s high-performance supercomputers and mainframes require many,...
