Fundamentals of Microsystems Packaging

Chapter 3: The Role of Packaging in Microsystems

Overview

Prof. Rao Tummala
Georgia Institute of Technology

Evan Davidson
IBM

Dr. D. H. R. Sarma
Delphi Automotive

Dr. Bob Hubbard
Medtronic

Prof. N. J. Rao
Indian Institute of Science, India

CHAPTER OBJECTIVES

  • Describe the anatomy of an electronic product to consist of microelectronics, photonics, RF and MEMS devices and systems packaging

  • Describe the unique role played by systems packaging such as for performance in computers, harsh environments in automotives, high bandwidth in telecommunications, and ultraportability in consumer and medical applications

CHAPTER INTRODUCTION

Every system consists of devices. These devices need to be packaged to form systems that meet a variety of functions. This chapter describes systems computer, telecommunication, automotive, consumer and MEMS each having a very unique need that systems packaging is expected to meet. The role played by systems packaging in each of these five systems is presented.

3.1 WHAT IS AN ELECTRONIC PRODUCT?

Electronic products are now integral parts of our personal and professional lives. We cannot do anything without them anymore, just like we cannot do much without electricity. We use them to perform any number of functions for us. They enable us to communicate with others at a distance, access information, manage our homes and offices, have better and safer transportation for people and goods, manufacture goods of all varieties faster and better, explore and understand the world around us, and to entertain ourselves in any number of ways. These products come to us with different features, performances, price tags and sizes. Many of them,...

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