TABLE OF CONTENTS Prof. Daniel F. Baldwin
Georgia Institute of Technology
Define and describe the purpose of IC assembly
Introduce and described each of the three primary IC assembly technologies: wirebond, TAB, and flip chip
Project future trends
IC assembly is the most important first step in the use of an IC which will go through a number of process steps before it can be used in an electronic system. This chapter introduces and describes the three most important IC assembly technologies.
IC assembly is the first processing step after wafer fabrication and singulation that enables ICs to be packaged for systems use. IC assembly is defined as the process of electrically connecting I/O bond pads on the IC to the corresponding bond pads on the package. The package in this case can be a single chip package, a multichip package, or a system level board. Such an assembly process involves three interfaces: (1) metallurgical bond pad interface on the IC; (2) metallurgical bond pad interface on the package; and (3) electrical interconnection between these two interfaces. Figure 9.1 illustrates the three primary interfaces.
While the metallurgical bond pad interface on the package side varies with the package type, the primary metallurgy of the IC bond pad is aluminum. Copper metallization is being introduced because of its higher electrical conductivity that translates into higher clock speeds in...
