TABLE OF CONTENTS Prof. Avram Bar-Cohen
University of Minnesota
Dr. Abhay Watwe
Intel Corporation
Prof. Kankanhally N. Seetharamu
University of Science, Malaysia
Describe the need for thermal management of electronic components
Introduce the fundamental heat transfer mechanisms of conduction, convection and radiation which play a major role in the cooling of electronic components
Introduce the concept of thermal resistance and illustrate its usefulness in detecting the most critical thermal transfer path
Provide simple equations and tabulate commonly used thermal properties to enable the reader to perform a first order analysis of heat transfer from an electronic package
Describe various cooling methods typically used or considered
All microelectronic devices require power for their use. A typical microprocessor of today uses about 35 watts, and in 2005 it is expected to use about 100 watts. This is an enormous power density that, if not properly managed, can result in microprocessor failure. This chapter addresses all thermal technologies required to understand and deal with the consequences of heat generation in electronic components.
The resistance to the flow of electrical current through the leads, poly-silicon layers, and transistors comprising a semiconductor device, results in significant internal heat generation within an operating microelectronic component. In the absence of cooling that is, heat removal mechanisms the temperature of such an operating component would rise at a constant rate until it reaches a value at which the electronic operation of the device ceases or the component loses its...
