Help with Logic Decoders and Demultiplexers specifications:
General Specifications
Back to Top
![]() |
![]() | ||
Function | |||
Your choices are... | |||
Decoders | Decoders are digital circuits that convert coded information into a familiar or uncoded form. | ||
Demultiplexers | Demultiplexers are circuits that switch digital data from one input line to several output lines in a specific time sequence. | ||
Decoders / Demultiplexers | Decoders / demultiplexers can be used as decoders or demultiplexers. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
![]() | |||
Input Lines: | |||
Your choices are... | |||
1 | The device has only one input line. | ||
2 | The device has 2 input lines. | ||
3 | The device has 3 input lines. | ||
4 | The device has 4 input lines. | ||
BCD | The input lines represent binary coded decimal (BCD) numbers (4 input lines) | ||
Other | Other unlisted input lines. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
![]() | |||
Output Lines: | |||
Your choices are... | |||
2 | The device has 2 output lines. | ||
4 | The device has 4 output lines. | ||
6 | The device has 6 output lines. | ||
8 | The device has 8 output lines. | ||
10 | The device has 10 output lines. | ||
14 | The device has 14 output lines. | ||
16 | The device has 16 output lines. | ||
7-Segment | The device has seven output lines, which are designed to connect to a 7-segment display. | ||
Other | Other unlisted output lines. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
![]() | |||
Supply Voltage: | |||
Your choices are... | |||
-5 V | The chip operates with -5 volts. | ||
-4.5 V | The chip operates with -4.5 volts. | ||
-3.3 V | The chip operates with -3.3 volts. | ||
-3 V | The chip operates with -3 volts. | ||
1.2 V | The chip operates with 1.2 volts. | ||
1.5 V | The chip operates with 1.5 volts. | ||
1.8 V | The chip operates with 1.8 volts. | ||
2.5 V | The chip operates with 2.5 volts. | ||
3 V | The chip operates with 3 volts. | ||
3.3 V | The chip operates with 3.3 volts. | ||
3.6 V | The chip operates with 3.6 volts. | ||
5 V | The chip operates with 5 volts. | ||
Other | Other unlisted supply voltages. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
![]() |
IC Chip Specifications
Back to Top
![]() |
![]() | ||
Package Type: | |||
Your choices are... | |||
BGA | Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. | ||
PBGA | Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm. | ||
TBGA | Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts. | ||
FLGA | Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. | ||
QFP | Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications. | ||
LQFP | Low quad flat package (LQFP). | ||
TQFP | Thin quad flat package (TQFP). | ||
SOP | Small outline package (SOP). | ||
SOIC | Small outline integrated circuit (SOIC). | ||
TSOP Type I, II | Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. | ||
SSOP | Shrink small outline package (SSOP). | ||
TVSOP | Thin very small outline package (TVSOP). | ||
TSSOP | Thin shrink small outline L-leaded package (TSSOP). | ||
SOJ | Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. | ||
HSOF | Small outline flat-leaded package with heat sink (HSOF). | ||
PLCC | Plastic leaded chip carrier (PLCC). | ||
LCCC | Leadless ceramic chip carrier (LCCC). | ||
DIP | Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. | ||
PDIP | Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. | ||
CDIP | Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. | ||
SIP | Single in-line package (SIP). | ||
SDIP | Shrink dual in-line package (SDIP). | ||
SZIP | Shrink zigzag in-line package (SZIP). | ||
Other | Other unlisted, specialized, or proprietary IC packages. | ||
Search Logic: | Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
![]() | |||
Logic Family | |||
Your choices are... | |||
Transistor-Transistor Logic (TTL) | Transistor-transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT), diodes and resistors. It is notable, as it was the base for the first widespread semiconductor integrated circuit (IC) technology. All TTL circuits operate with a 5 V power supply. TTL signals are defined as "low" or L when between 0 V and 0.8 V with respect to the ground terminal, and "high" or H when between 2 V and 5 V. The first logic devices designed from bipolar transistors were referred to as standard TTL. The addition of Schottky diodes to the base collector of bipolar transistor was called Schottky logic (S-TTL). Schottky diodes shorten propagation delays within TTL by preventing the collector from going into what is called “deep saturation.” Other TTL technologies include low-power Schottky (LS-TTL), advanced Schottky (AS-TTL), advanced low-power Schottky (ALS-TTL), and low-voltage TTL (LVTTL). | ||
FAST | Fairchild advanced Schottky TTL (FAST) technology was created in late 1970 when advances in IC technology allowed the speed and drive of S-TTL to be combined with the lower power of LS-TTL to form a new logic. An advanced related family is the FASTr, which is faster then FAST, has a higher driving capability (IOL, IOH), and produces much lower noise. The “r” in FASTr refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed. | ||
Standard CMOS / CMOS (4000) | Complementary metal-oxide semiconductor (CMOS) logic uses a combination of p-type and n-type metal-oxide-semiconductor field effect transistors (MOSFET) to implement logic gates and other digital circuits found in computers, telecommunications and signal processing equipment. It is the technology of choice for many present-day digital integrated circuits. CMOS 4000 refers to the series 4000 that is true CMOS with non-TTL levels. | ||
Fast CMOS | Fast CMOS technology (FCT) was introduced in 1986. With this technology the speed gap between CMOS and TTL was closed. Since FCT is the CMOS version of FAST, it has the low power consumption of CMOS but speed comparable with TTL. Advanced versions of the FCT standard are FCTx and FCTx-T. The x in FCTx and FCTx-T refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed. | ||
High-Speed CMOS | High-speed CMOS technology (HCMOS) is also known as HC / HCT. There are several basic flavors of HCMOS technology: high-speed CMOS (HC), high-speed CMOS with TTL input (HCT), advanced high-speed CMOS (AHC), and advanced high-speed CMOS with TTL inputs (AHCT). | ||
Advanced CMOS | Advanced CMOS is a much higher speed version of HCMOS. It is also known as AC / ACT. Advanced CMOS technology comes in different flavors: standard advanced CMOS (AC), advanced CMOS with TTL inputs (ACT), advanced CMOS with quiet outputs (ACQ), advanced CMOS with TTL inputs and quiet outputs (ACTQ), advanced ultra-Low voltage CMOS (AUC), advanced ultra-low power CMOS (AUP), advanced very-low voltage CMOS (AVC), advanced low voltage HCMOS (ALVC), and advanced low voltage CMOS with bus hold (ALVCH). ACQ / ACTQ are second generation Advanced CMOS with much lower noise. While ACQ has the CMOS input level, ACQT is equipped with TTL level input. | ||
Low Voltage CMOS | There are several low voltage CMOS technologies: standard low voltage (LV), low voltage high performance HCMOS (LVC), low voltage CMOS technology with TTL inputs (LVT), Low voltage with TTL inputs and high impedance (LVTC), advanced low voltage CMOS with bus hold (ALVCH), low voltage CMOS that operates with 3 V or 5 V (LCX), and low voltage CMOS that operates with 1.8 V or 3.6 V (VCX). | ||
BiCMOS | BiCMOS is a SiGe Bipolar technology that combines the high speed of bipolar TTL with the low power consumption of CMOS. There are a number of BiCMOS flavors including advanced BiCMOS technology (ABT), advanced BiCMOS technology with enhanced transceiver logic (ABTE), advanced low-voltage BiCMOS (ALB), advanced low-voltage BiCMOS technology (ALVT), BiCMOS with TTL inputs (BCT), BiCMOS with backplane and transceiver logic (BTL), and low-voltage BiCMOS technology (LVT). | ||
Emitter Coupled Logic (ECL) | Emitter coupled logic (ECL) uses transistors to steer current through gates that compute logical functions. By comparison, TTL and related families use transistors as digital switches, where the transistors are either cut off or saturated, depending on the state of the circuit. This distinction explains ECL's chief advantage: that because the transistors are always in the active region, they can change state very rapidly, so ECL circuits can operate at very high speed; and also its major disadvantage: the transistors are continually drawing current, which means the circuits require high power, and thus generate large amounts of waste heat. ECL gates use differential amplifier configurations at the input stage. A bias configuration supplies a constant voltage at the midrange of the low and high logic levels to the differential amplifier, so that the appropriate logical function of the input voltages will control the amplifier and the base of the output transistor. The propagation time for this arrangement can be less than a nanosecond. Other noteworthy characteristics of the ECL family include the fact that the large current requirement is approximately constant, and does not depend significantly on the state of the circuit. This means that ECL circuits generate relatively little power noise, unlike many other logic types that typically draw far more current when switching than quiescent, for which power noise can become problematic. ECL circuits operate with negative power supplies, and logic levels incompatible with other families, which means that interoperation between ECL and other designs are difficult. The fact that the high and low logic levels are relatively close mean that ECL suffers from small noise margins, which can be troublesome in some circumstances. | ||
Integrated Injection Logic (I2L) | Integrated injection logic (I2L) is based on bipolar transistor logic. It is commonly referred to as "I-square-L." | ||
Silicon on Sapphire (SOS) | Silicon on sapphire (SOS) is a hetero-epitaxial process wherein a thin layer of silicon is “grown” on a sapphire (Al2O3) wafer. SOS is part of the silicon on insulator (SOI) family of CMOS technologies. SOS is primarily used in military and space applications because of its inherent resistance to radiation. It has seen little commercial use to date because of difficulties in fabricating the very small transistors used in modern high-density applications. Problematically, the SOS process often results in the formation of dislocations from crystal lattice disparities between the sapphire and silicon. This leads to unusable wafers and drives up the production cost. | ||
Gallium Arsenide (GaAs) | Gallium arsenide (GaAs) is a compound semiconductor mixing the strength of two elements, gallium (Ga) and arsenic (As). Gallium is a byproduct of the smelting of other metals, notably aluminum and zinc, and is rarer than gold. Arsenic is not rare, but it is poisonous. Gallium arsenide has many uses including being used in some diodes, field-effect transistors (FETs), and integrated circuits (ICs). GaAs components are useful at ultra-high radio frequencies and in fast electronic switching applications. GaAs devices generate less noise than most other types of semiconductor components and, as a result, are useful in weak-signal amplification applications. Gallium arsenide is used in the manufacture of light-emitting diodes (LEDs), which are found in optical communications and control systems. Gallium arsenide can replace silicon in the manufacture of linear and digital ICs. Digital devices are used for electronic switching, and also in computer systems. | ||
Crossbar Technology (CBT) | Crossbar technology (CBT) enables a bus interface to function as a very fast bus switch, isolating the bus when the switch is open and offering very little delay when the switch is closed. Opening the switch provides circuit isolation (high impedance). Closing the switch provides a near-zero propagation delay through a 5-Ohm resistance. Bus switch technology is used in programmable logic devices (PLDs) for improved performance. Typically, CBT devices operate from 4.5 V to 5.0 V. CBT is also known as quick switch (QS), fast switch technology (FST), or Pericom Interface (PI5C). | ||
Gunning Transceiver Logic (GTL) | Gunning transceiver logic (GTL) is a standard for electrical signals in CMOS circuits that is used to provide high data transfer speeds with small voltage swings. | ||
Other | Other unlisted logic families. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
![]() | |||
Pin Count | The number of pins in the package. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
![]() | |||
Number of Units in the Chip: | Total number of devices in the package. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
![]() |
Performance
Back to Top
![]() |
![]() | ||
Propagation Delay | The time interval between the application of an input signal and the occurrence of the corresponding output in a logic circuit. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
![]() | |||
Operating Current | The minimum current needed for active chip operation. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
![]() | |||
Power Dissipation | Power dissipation is the total power consumption of the device. It is generally expressed in watts or milliwatts. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
![]() | |||
Operating Ambient Temperature: | This is the full-required range of ambient operating temperature. | ||
Search Logic: | User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria. | ||
![]() | |||
Complementary Output? | The device has a pin (or pins in case of parallel output) for the complementary output. Therefore it has two outputs: true and complementary. | ||
Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
![]() | |||
Radiation Tolerant? | The device is radiation hardened or tolerant. | ||
Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
![]() | |||
ESD Protection? | The device has internal circuitry for ESD protection. | ||
Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
![]() |