Halogen / Halide Free Filler Alloys and Consumables
from Indium Corporation
With the increased demand for flux coatings that have lower voiding, Indium Corporation has developed the next generation of flux coatings. The LV-Series of flux coatings offers low voiding, especially in situations where the component footprint will not allow for proper outgassing of volatized... [See More]
- Fluxes & Cleaners: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: IPC-TM-650 2.6.3.3,
from Indium Corporation
TACFlux 026 is no-clean and halide-free fl ux designed especially for fl ip-chip and CSP (chip scale package) attachment. It can be also used for 3D packages (POP). TACFlux 026 is designed to accommodate a wide range of refl ow temperatures, and is suitable for all Sn/Pb, Pb-Free and high-Pb... [See More]
- Fluxes & Cleaners: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004
from Indium Corporation
TACFlux ®057 is an air reflow, halogen-free, no-clean flux used with SnBi and SnBiAg alloys. TACFlux ®057 provides excellent wetting in air and nitrogen and provides the low activation temperature necessar y for the low melting SnBi and SnBiAg alloys. [See More]
- Fluxes & Cleaners: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004
from Indium Corporation
Features: Halogen-free – no intentionally added (NIA) halogens. Flux rheology applicable for all sphere sizes. Suitable for Pb-free or SnPb applications. Uniform pin transfer over extended periods. Proven high yields in ball-attach process. Excellent solderability on a wide range of surfaces. [See More]
- Fluxes & Cleaners: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004, J-STD-005
from Indium Corporation
Features. Designed for flip-chip dipping applications. Tackiness suitable for holding die during assembly. Bubble-free airless packaging. Ultra-low residue. Halogen-free. No-clean. Introduction. Flip-Chip Flux NC-26-A is a halogen-free, no-clean flipchip dipping flux which is designed to leave a... [See More]
- Fluxes & Cleaners: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004/B
from Indium Corporation
Features. Halogen-free (no intentionally-added halogens). Viscosity suitable for 150-300mm wafers. Solvent clean. Nitrogen reflow atmosphere. Suitable for high-Pb, SnPb, and Pb-free solder applications. Introduction. Wafer Flux SC 5R is a low viscosity semiconductor-grade wafer bumping (bump fusion)... [See More]
- Fluxes & Cleaners: Soldering Flux / Rosin; Halide Free
- Approvals / Conformance: J-STD-004
from Indium Corporation
Features. Excellent cleanability, residue can be removed with room temperature DI water. Stencil-printable, high tack. Offers high yields in BGA bumping process. Halide-free with excellent solderability. Wide process window. Introduction. WS-363 Interconnect Flux is a high viscosity paste-type fl ux... [See More]
- Fluxes & Cleaners: Soldering Flux / Rosin; Halide Free
from Indium Corporation
Features. Excellent cleanability; residue can be removed with room temperature water. Pin-transfer and stencil printable. Offers high yields in BGA bumping process. Halide-free with excellent solderability. Wide process window. Suitable for SnPb and Pb-free applications. Introduction. WS-364... [See More]
- Fluxes & Cleaners: Soldering Flux / Rosin; Halide Free