Paste Filler Alloys and Consumables
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 423
from RS Components, Ltd.
ALLOY SN96.5 AG3 CU0.5 SIRIUS 1 LF-500G [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Paste
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
- Melting Range: 423
- Approvals / Conformance: RoHS Compliant
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 21.16 oz (600g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 21.16 oz (600g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 423
from RS Components, Ltd.
ALLOY SN62 PB AG2 SIRIUS 1 - 100G [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Paste
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
- Melting Range: 354
from DigiKey
CNP NP575-KAP 969 88.8-4-M17 INN [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Cartridge
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from DigiKey
CNP NP575-KAP 969 88.8-4-M17 INN [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar
from DigiKey
R276 SN96.5AG3.0CU0.5 T4 86% 100 [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 3.53 oz (100g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from DigiKey
R500 SN63PB37 T3 86% 100G SYR [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 3.53 oz (100g)
- Nominal Composition: Sn63Pb37 (63/37)
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from DigiKey
Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from DigiKey
WP616 SN96.5AG3.0CU0.5 T4 88.8% [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Cartridge, 21.16 oz (600g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from DigiKey
WP616 SN96.5AG3.0CU0.5 T5 88.3% [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from DigiKey
Lead Free No-Clean Solder Paste Jar, 17.64 oz (500g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
from DigiKey
Lead Free No-Clean Solder Paste Cartridge, 21.16 oz (600g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Cartridge, 21.16 oz (600g)
from DigiKey
Lead Free No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Tube, 0.35 oz (10g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Tube, 0.35 oz (10g)
- Nominal Composition: Bi57Sn42Ag1 (57/42/1)
- Melting Range: 284
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Range: 422 to 428
from DigiKey
Rosin Mildly Activated (RMA), Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from DigiKey
Rosin Mildly Activated (RMA), Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from DigiKey
No-Clean, Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from DigiKey
No-Clean, Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from DigiKey
No-Clean, Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc
- Nominal Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
from Princess Auto Limited
4 oz. Soldering Flux Paste [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from Nordson EFD
When joints are needed but printing is not possible, Nordson EFD ’s premium dispensing solder paste supports a wider array of applications with formulations created for specific uses. In addition to the standard pastes offered by other suppliers, EFD provides specialized formulations for... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: ISO9001
from R. S. Hughes Company, Inc.
The Kester 531 water soluble lead solder paste is another quality product from Kester. Total composition for this lead solder paste is sn62/pb36/ag02. Additional, and potentially important, information was collected about this product: Type 3 [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: ORM0 (IPC/J STD 004)
from Henkel Corporation - Industrial
LOCTITE MP 218, Solder paste, High activity, Soft residue, Colorless, Sn/Pb soldering. LOCTITE ® MP 218 is a high activity, soft residue, colorless solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Paste
from ESAB Welding and Cutting Products
Features. Cadmium free, low temperature, food grade solder in mesh form premixed with flux. For use on stainless and dissimilar metals. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Silver Alloy
from Henkel Corporation - Electronics
Halide-free, No-clean, SnPbSnPb solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in Pb-free formulation [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62, Sn63
from Galco Industrial Electronics
Solder Paste, No Clean Lead-free, [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Indium Corporation
The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from Lucas Milhaupt Global Brazing Solutions
Aluminum brazing and soldering filler metals are used to join materials within the aluminum family of alloys. These materials are available in wire, strip, powder, paste (both corrosive and non-corrosive formulations) and preformed rings and shapes. Lucas-Milhaupt also offers aluminum flux-cored... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Powder; Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.; Strip, sheet or foil; Solid wire or rod; Flux Cored Wire
- Melting Range: 1085
- Applications / Materials Joined: Aluminum Alloys
- Braze Alloy: Aluminum Alloy Braze
from Princess Auto Limited
Aluminum Solder Paste [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from Nordson EFD
Formulated to work with any alloy and heating process, Nordson EFD ’s FluxPlus ™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD provides a... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from R. S. Hughes Company, Inc.
The Kester Easy Profile 256 no clean lead solder paste is another quality product from Kester. Total composition for this lead solder paste is sn62/pb36/ag02. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: Bellcore GR 78; ROL0 (IPC/J STD 004)
from Henkel Corporation - Industrial
Modest residue level, halide-free solder paste recommended for Pb-free soldering and Sn/Pb soldering for printing and reflow in air. LOCTITE ® CR 32 is formulated as a modest residue level, halide-free solder paste recommended for Pb-free soldering and Sn/Pb soldering for printing and reflow in... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb formulation [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb) (optional feature); Lead Free; 92A
from Indium Corporation
Indium Corporation is the leading global supplier of commercial indium, high purity indium, indium fabrications, alloys, and chemicals. Indium metal is extracted from indium-bearing ore and is refined to various grades in high volume utilizing state of the art SPC controlled refining technologies. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.; Strip, sheet or foil; Solid wire or rod; Hollow wire or metal cored filler
- Solder Alloy: Indium Alloy Solders
from Princess Auto Limited
Silver Bearing Solder Paste [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from Nordson EFD
Nordson EFD ’s print paste is the industry leader in Surface Mount Technology (SMT) applications. Our batch-to-batch consistency helps reduce defects and eliminate the need for rework. PrintPlus ® glides smoothly over stencils, filling the apertures without voids and leaving virtually no... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from R. S. Hughes Company, Inc.
The Kester Enviromark 808 water soluble lead-free solder paste is another quality product from Kester. Total composition for this lead-free solder paste is sn96.5/ag03/cu0.5. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: ORM0 (IPC/J STD 004)
from Henkel Corporation - Industrial
LOCTITE ECCOBOND LUX OGR150THTG, Acrylate, Assembly, Photocurable Adhesive LOCTITE ® ECCOBOND LUX OGR150THTG photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeIndustry-leading solder paste in paste-transfer efficiency. Improved stability at different storage and operating temperatures, with extended stencil life up to 72 hours and extended abandon time up to 24 hours. Suitable for high-density, small to large boards. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC305
from Indium Corporation
Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: 61.0Ga/25.0In/13.0Sn/1.0Zn, 66.5Ga/20.5In/13.0Sn, 62.5Ga/21.5In/16.0Sn, 75.5Ga/24.5In, 95Ga/5In, 100Ga
- Solder Alloy: Indium Alloy Solders
from R. S. Hughes Company, Inc.
The Kester Enviromark 907 no clean lead-free solder paste is another quality product from Kester. Total composition for this lead-free solder paste is sn96.5/ag03/cu0.5. Additional, and potentially important, information was collected about this product: Powder Size: 3 [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: RoHS 2002/95/EC; ROL0 (IPC/J STD 004)
from Henkel Corporation - Industrial
LOCTITE GC 10, No-clean and Halogen-free Solder Paste, a RoHS-compliant, Excellent resistance in high humidity, Pb-free soldering. LOCTITE ® GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halogen-free, Pb-free, Water WashRoHS-compliant solder paste with excellent resistance in high humidity. Improved stability at different storage and operating temperatures, with extended stencil life over 24 hours. Suitable for high-density, small to large boards. Residues can be removed with... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC305
from Indium Corporation
Traditional solders have reflow temperatures in the range of 183 °C to 221 °C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in the 115 °C to 180 °C range. Some of these key drivers include: Temperature... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Indium Alloy Solders; Bismuth
from R. S. Hughes Company, Inc.
The Kester R276 no clean lead solder paste is another quality product from Kester. Total composition for this lead solder paste is sn63/pb37. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: Bellcore GR 78; ROL0 (IPC/J STD 004)
from Henkel Corporation - Industrial
LOCTITE GC 3W, Solder paste, Pb-free soldering, Halogen-free, Water Washable flux. LOCTITE ® GC 3W is a RoHS-compliant solder paste with excellent resistance in high humidity. Improved stability at different storage and operating temperatures, with extended stencil life over 24 hours. Suitable... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste designed for medium to large boards. Robust reflow process window with exceptional solderability across a wide range of challenging surfaces finishes including immersion Ag and OSP copper. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC305, SAC387
from Indium Corporation
Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both clean up... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from Henkel Corporation - Industrial
LOCTITE HF 108, Solder paste, Pb-free soldering LOCTITE ® HF 108 is a high tack, low voiding, RoHS-compliant solder paste designed for medium to large boards. Excellent fine pitch coalescence. Robust reflow process window with exceptional solderability across a wide range of challenging... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste suitable for high speed printing. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range of challenging surface finishes including OSP copper. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 90iSC, SAC305, SAC387
from Indium Corporation
The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from Henkel Corporation - Industrial
LOCTITE HF 212, No-clean and Halogen-free Solder Paste, High tack, Low voiding, RoHS-compliant Pb-free soldering. LOCTITE ® HF 212 is a high tack, low voiding, RoHS-compliant solder paste with excellent fine pitch coalescence and extended stencil life and abandon time. Designed for medium to... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeHalogen and Pb-free solder paste designed for medium to large boards. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP copper, ENIG and CuNiZn. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 90iSC, SAC0307, SAC305, SAC387
from Indium Corporation
#1210 Battery Flux was specially formulated for high volume cast-on-strap manufacturing where rapid evaporation of solvent is necessary. This fl ux contains no chlorides, heavy metals or organic acids, which could effect the long term life of the batteries. #1210 Battery Flux provides excellent... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from Henkel Corporation - Industrial
LOCTITE HF 250DP, Pb-free soldering, Solder paste LOCTITE ® HF 250DP solder paste is a halogen-free, no clean, low voiding Pb-free solder paste. It is a low metal content solder paste formulated for dispense applications. Optimized to achieve consistent 250 to 300 µm dot diameter using a... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeDispensing grade, halogen and Pb-free solder paste with exceptional dot-to-dot consistency, colorless residues and high-speed dispense capability with zero slump. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC387
from Indium Corporation
Indium Corporation's Flux #2 effectively reduces the oxides on the nickel and titanium of Nitinol. The recommended solder for use with this is Indalloy #121 (96.5Sn 3.5Ag) which is available through our e-commerce site. Indalloy #182 (80Au 20Sn) is also available by contacting one of our sales... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from Henkel Corporation - Industrial
LOCTITE HF 2W, Solder paste, Halogen-free, Water washable flux, Low voiding, REACH-compliant, Pb-based soldering. LOCTITE ® HF 2W is a low voiding, REACH-compliant solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Paste
from Henkel Corporation - Electronics
Halogen-free, SnPb, Water WashSnPb water washable, halogen-free solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed by deionized water for 5 to 15 minutes at 40°C to 60°C. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn63
from Indium Corporation
Indium Corporation's Flux #3 is a more viscous flux that works best with tin-containing alloys. It has a high boiling point and works well with higher temperature solders. The Flux #3 is available in 1-ounce containers [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
from Henkel Corporation - Industrial
LOCTITE LF 310, No-clean Solder paste, Excellent open time, Pb-free soldering. LOCTITE ® LF 310 medium is formulated for use with Pb-free alloys as a no-clean product for printing and reflow in air where process yield is critical. This material offers excellent open time, and good soldering... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
This halide-free, no-clean and Pb-free solder paste has an excellent humidity resistance and a broad process window for both reflow and printing. It offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide range of... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free
from Indium Corporation
NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In addition, NC-SMQ92J offers excellent wetting, unsurpassed stencil life, and consistent fine pitch deposition. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: 63Sn-37Pb
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from Henkel Corporation - Industrial
LOCTITE LF 318, Solder paste, Pb-free soldering LOCTITE ® LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
No-clean, Pb-freePb-free solder paste designed for low-temperature, Pb-free solder alloys. This material is formulated to provide excellent dispensability, printability and solderability through various reflow profiles. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; B158
from Indium Corporation
Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium 8.9E offers unprecedented... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Lead Free
from Henkel Corporation - Industrial
LOCTITE LF 318M, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE LF 318M is a halide-free, no clean, low voiding Pb-free solder paste which has excellent humidity resistance and a broad process window both for printing and reflow. This product has high tack... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halide-free, No-clean, SnPbSnPb, halide-free solder paste designed for high speed printing. Extended printed open time and tack life. Resistant to both hot and cold slump. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62, Sn63
from Indium Corporation
Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Applications / Materials Joined: Semiconductor Assembly, Die-Attach Paste
from Henkel Corporation - Industrial
LOCTITE LF 620, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE ® LF 620 is a halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow . It shows low hot slump to minimize... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halide-free, No-clean, SnPbSnPb, halide-free, high activity solder paste that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including rheo pump, proflow, large, high-density. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62, Sn63
from Indium Corporation
Indium Corporation ’s “Power-Safe ” NC-SMQ ®75 is the world ’s first and only solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach. The ultra-low flux residue, combined with a benign, low reactivity flux chemistry, enables... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004, J-STD-005
- Nominal Composition: Sn10/Pb88/Ag2, Sn5/Pb92.5/Ag2.5, Sn5/Pb95, Sn5/Pb85/Sb10
from Henkel Corporation - Industrial
LOCTITE LM 100, no clean flux, RoHS-compliant, Designed for use with low temperature Pb-free solder alloys LOCTITE ® LM 100 is a RoHS-compliant solder paste designed for use with low-temperature, Pb-free alloys. Formulated to provide excellent dispensability, printability and solderability in... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
No-clean, SnPbSnPb, halide-containing solder paste formulated for dispensing or printing and reflow in air, where process yield is critical. Offers excellent open time, good soldering activity, especially on OSP copper. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62
from Indium Corporation
BiAgX ® is a true solder paste technology. It reflows, solders, wets, and solidifies, just like any other solder paste. When converting from a standard high-Pb solder paste-based process, minimal process adjustments are required, eliminating the need for new capital expenditure. Solder joints... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Low Ag BiAgX® Indium7.xx, High Ag BiAgX® Indium7.xx
- Solder Alloy: Lead Free
- Approvals / Conformance: J-STD-004, J-STD-005
from Henkel Corporation - Industrial
LOCTITE 309, Rosin based Cored Solder Wire Flux. LOCTITE ® 309 solid flux is based on a blend of novel activators and resins. It has a mild characteristic odor and leaves a clear pale residue. The alloys used for LOCTITE flux cored solder wires conform to the purity requirements of the common... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Wire
from Henkel Corporation - Electronics
SnPb, Water WashSnPb water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time, greatly extended abandon times and good soldering activity over a wide range of reflow profile types and surface... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62, Sn63
from Indium Corporation
BiAgX ® is a true solder paste technology. It reflows, solders, wets, and solidifies, just like any other solder paste. When converting from a standard high-Pb solder paste-based process, minimal process adjustments are required, eliminating the need for new capital expenditure. Solder joints... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Low Ag BiAgX® Indium7.xx, High Ag BiAgX® Indium7.xx
- Solder Alloy: Lead Free
- Approvals / Conformance: J-STD-004, J-STD-005
from Henkel Corporation - Industrial
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill LOCTITE ® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Pb-free, Water WashPb-free water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time and good soldering activity over a wide range of reflow profiles and surface finishes. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC305, SAC387
from Indium Corporation
Indium8.9LDA is specially designed for IGBT manufacturing. The formulation has been optimized for vacuum reflow soldering of large area die. Ultra-low total voids are possible (typically <0.5%) using a variety of reflow profiles: two examples of suitable vacuum reflow profiles are shown on page... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: 96.5Sn/3.5Ag, 96.5Sn/3.0Ag/0.5Cu
- Solder Alloy: Tin-Gold
- Approvals / Conformance: J-STD-004, J-STD-005
from Indium Corporation
Indium9.52 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Indium9.52 is formulated for reflow in nitrogen... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: 63Sn/37Pb, 62Sn/36Pb/2Ag, 62.6Sn/37Pb/0.4Ag, 95.5 Sn/3.8Ag/0.7Cu, 96.5Sn/3.0Ag/0.5Cu,
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
- Approvals / Conformance: ANSI/JSTD-004/5
from Indium Corporation
Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Normally used with high temperature alloys,... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Sn10/Pb88/Ag2, Sn5/Pb92.5/Ag2.5, Sn5/Pb95, Sn5/Pb85/Sb10
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
- Approvals / Conformance: J-STD-004, J-STD-005
from Indium Corporation
Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of wirebond pads and for improved environmental compliance. Normally used with high temperature... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Lead-Gold
from Indium Corporation
NC-SMQ ®71 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. NC-SMQ ®71 is formulated for reflow in... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Sn10/Pb88/Ag2, Sn5/Pb92.5/Ag2.5, Sn5/Pb95
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Lead-Gold
- Approvals / Conformance: J-STD-004A, J-STD-005
from Indium Corporation
NC-SMQ ®75 is a halogen-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0.4% of paste or <5% of flux vehicle. It is designed for reflow in a nitrogen atmosphere of 100-ppm oxygen or less. This product has superior wetting capabilities compared to most... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Sn10/Pb88/Ag2, Sn5/Pb92.5/Ag2.5 ,Sn5/Pb95, Sn5/Pb85/Sb10
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
- Approvals / Conformance: J-STD-004, J-STD-005
from Indium Corporation
PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Sn63/Pb37
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
- Approvals / Conformance: J-STD-004
from Indium Corporation
PoP Paste Indium9.91 is a no-clean solder paste designed for use in package-on-package (0.3mm and larger) applications. PoP Paste Indium9.91 has a rheology designed to provide a long-lasting dipping process. Features: Eliminates defects due to package-warping. Air-reflow. Rheology optimized for both... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Sn63/Pb37
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); SAC305
- Approvals / Conformance: J-STD-004
from Indium Corporation
SMQ ®51-SC is a dispensing solder paste designed and formulated specifically for die-attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. When used with high temperature alloys, SMQ... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Sn10/Pb88/Ag2, Sn5/Pb92.5/Ag2.5, Sn5/Pb95, Sn5/Pb85/Sb10
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
- Approvals / Conformance: J-STD-004, J-STD-005
from Indium Corporation
Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications. Indium6.6HF exhibits... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-006
- Solder Alloy: Lead Free